JPWO2024185127A1 - - Google Patents
Info
- Publication number
- JPWO2024185127A1 JPWO2024185127A1 JP2025505031A JP2025505031A JPWO2024185127A1 JP WO2024185127 A1 JPWO2024185127 A1 JP WO2024185127A1 JP 2025505031 A JP2025505031 A JP 2025505031A JP 2025505031 A JP2025505031 A JP 2025505031A JP WO2024185127 A1 JPWO2024185127 A1 JP WO2024185127A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/009053 WO2024185127A1 (ja) | 2023-03-09 | 2023-03-09 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024185127A1 true JPWO2024185127A1 (https=) | 2024-09-12 |
| JPWO2024185127A5 JPWO2024185127A5 (https=) | 2025-05-09 |
| JP7778271B2 JP7778271B2 (ja) | 2025-12-01 |
Family
ID=92674541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025505031A Active JP7778271B2 (ja) | 2023-03-09 | 2023-03-09 | 半導体装置及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7778271B2 (https=) |
| CN (1) | CN120814047A (https=) |
| DE (1) | DE112023005941T5 (https=) |
| WO (1) | WO2024185127A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024127170A (ja) * | 2023-03-09 | 2024-09-20 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102495A (ja) * | 1999-09-28 | 2001-04-13 | Toshiba Corp | 半導体装置 |
| JP2002151633A (ja) * | 2000-11-08 | 2002-05-24 | Citizen Watch Co Ltd | 樹脂封止型半導体装置 |
| JP2004327555A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Works Ltd | 半導体装置 |
| JP2012146711A (ja) * | 2011-01-07 | 2012-08-02 | Panasonic Corp | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243582A (ja) * | 2002-02-21 | 2003-08-29 | Hitachi Unisia Automotive Ltd | 半導体装置 |
| JP5023604B2 (ja) * | 2006-08-09 | 2012-09-12 | 富士電機株式会社 | 半導体装置 |
| JP5633210B2 (ja) * | 2010-06-28 | 2014-12-03 | 富士通セミコンダクター株式会社 | 半導体装置 |
| US10410945B2 (en) * | 2015-03-23 | 2019-09-10 | Hitachi, Ltd. | Semiconductor device |
-
2023
- 2023-03-09 WO PCT/JP2023/009053 patent/WO2024185127A1/ja not_active Ceased
- 2023-03-09 DE DE112023005941.1T patent/DE112023005941T5/de active Pending
- 2023-03-09 JP JP2025505031A patent/JP7778271B2/ja active Active
- 2023-03-09 CN CN202380095365.4A patent/CN120814047A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102495A (ja) * | 1999-09-28 | 2001-04-13 | Toshiba Corp | 半導体装置 |
| JP2002151633A (ja) * | 2000-11-08 | 2002-05-24 | Citizen Watch Co Ltd | 樹脂封止型半導体装置 |
| JP2004327555A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Works Ltd | 半導体装置 |
| JP2012146711A (ja) * | 2011-01-07 | 2012-08-02 | Panasonic Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024185127A1 (ja) | 2024-09-12 |
| CN120814047A (zh) | 2025-10-17 |
| DE112023005941T5 (de) | 2026-01-15 |
| JP7778271B2 (ja) | 2025-12-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250226 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250226 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20251021 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20251118 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7778271 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |