CN1201651C - 零件安装设备的头部组件 - Google Patents
零件安装设备的头部组件 Download PDFInfo
- Publication number
- CN1201651C CN1201651C CNB001040286A CN00104028A CN1201651C CN 1201651 C CN1201651 C CN 1201651C CN B001040286 A CNB001040286 A CN B001040286A CN 00104028 A CN00104028 A CN 00104028A CN 1201651 C CN1201651 C CN 1201651C
- Authority
- CN
- China
- Prior art keywords
- main shaft
- voice coil
- bar
- housing
- head assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009434 installation Methods 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 11
- 239000011796 hollow space material Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims 1
- 230000003028 elevating effect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/044—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR8479/1999 | 1999-03-13 | ||
KR1019990008479A KR100585588B1 (ko) | 1999-03-13 | 1999-03-13 | 부품 실장기용 헤드 조립체 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1267186A CN1267186A (zh) | 2000-09-20 |
CN1201651C true CN1201651C (zh) | 2005-05-11 |
Family
ID=19576497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001040286A Expired - Fee Related CN1201651C (zh) | 1999-03-13 | 2000-03-13 | 零件安装设备的头部组件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6308403B1 (zh) |
JP (1) | JP4219527B2 (zh) |
KR (1) | KR100585588B1 (zh) |
CN (1) | CN1201651C (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000288969A (ja) * | 1999-04-01 | 2000-10-17 | Mirae Corp | 表面実装機のマウンタヘッド |
KR100348400B1 (ko) * | 2000-05-20 | 2002-08-10 | 미래산업 주식회사 | 표면실장장치의 모듈헤드의 노즐회전장치 |
KR20010114161A (ko) * | 2000-06-21 | 2001-12-29 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품의 장착 장치 및 장착 방법 |
JP2002243402A (ja) * | 2001-02-22 | 2002-08-28 | Juki Corp | 直動軸の位置検出構造及び電子部品搭載用ヘッド |
KR100394224B1 (ko) * | 2001-06-12 | 2003-08-09 | 미래산업 주식회사 | 비접촉 실링구조를 갖는 부품흡착헤드 |
JP2004094188A (ja) * | 2002-07-12 | 2004-03-25 | Omron Corp | 光スイッチ |
DE10316293B4 (de) * | 2003-04-09 | 2005-03-10 | Siemens Ag | Bestückkopf zum Aufnehmen, Transportieren und Aufsetzen von Bauelementen |
WO2005020657A1 (ja) * | 2003-08-20 | 2005-03-03 | Murata Manufacturing Co., Ltd. | 部品装着装置及び部品装着方法 |
KR101141706B1 (ko) * | 2005-09-28 | 2012-05-04 | 삼성테크윈 주식회사 | 부품실장기용 헤드 어셈블리 |
KR101228315B1 (ko) * | 2005-11-10 | 2013-01-31 | 삼성테크윈 주식회사 | 부품 실장기용 헤드 어셈블리 |
KR20080060415A (ko) * | 2006-12-27 | 2008-07-02 | 미래산업 주식회사 | 핸들러의 전자부품 픽커 |
JP4997124B2 (ja) * | 2008-01-21 | 2012-08-08 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着ヘッド及び電子部品装着装置 |
KR101352571B1 (ko) | 2008-07-02 | 2014-01-17 | 삼성테크윈 주식회사 | 부품실장기의 헤드 어셈블리 및 이를 사용한 헤드어셈블리의 부품 흡착, 장착 방법 |
CN102506713A (zh) * | 2011-11-22 | 2012-06-20 | 吴江市博众精工科技有限公司 | 一种转动模组 |
KR101493746B1 (ko) * | 2013-08-26 | 2015-02-16 | 조항일 | 픽 앤 플레이스 장치의 피커 회전장치 |
US11382248B2 (en) | 2018-02-26 | 2022-07-05 | Universal Instruments Corporation | Dispensing head |
SE544249C2 (en) | 2018-02-26 | 2022-03-15 | Universal Instruments Corp | Pick-and-place spindle module, bank, and method |
CN112135509A (zh) * | 2019-10-30 | 2020-12-25 | 孙传保 | 一种便于调节速度的自动贴片机 |
CN114055157B (zh) * | 2021-12-02 | 2022-08-30 | 安徽省佳艺休闲用品有限公司 | 一种家具部件管塞安装用加工机台 |
CN117506874B (zh) * | 2023-12-25 | 2024-04-16 | 济南奥普瑞思智能装备有限公司 | 一种传动机器人桁架 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57102094A (en) * | 1980-12-17 | 1982-06-24 | Matsushita Electric Ind Co Ltd | Device for mounting leadless electric part |
US4498023A (en) * | 1983-10-31 | 1985-02-05 | Motorola, Inc. | Voice coil linear motor with integral capacitor |
JPH02303200A (ja) * | 1989-05-18 | 1990-12-17 | Hitachi Ltd | 電子部品装着装置 |
US5397423A (en) * | 1993-05-28 | 1995-03-14 | Kulicke & Soffa Industries | Multi-head die bonding system |
JP3469652B2 (ja) * | 1994-09-26 | 2003-11-25 | 富士機械製造株式会社 | 電子部品装着装置 |
JP3677108B2 (ja) * | 1996-01-29 | 2005-07-27 | 三星テクウィン株式会社 | 部品搭載装置 |
JP3755181B2 (ja) * | 1996-04-05 | 2006-03-15 | 松下電器産業株式会社 | 電子部品装着装置 |
JP3477321B2 (ja) * | 1996-07-25 | 2003-12-10 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP3942217B2 (ja) * | 1996-12-03 | 2007-07-11 | 松下電器産業株式会社 | 電子部品装着装置および電子部品装着方法 |
JPH1168389A (ja) * | 1997-08-13 | 1999-03-09 | Matsushita Electric Ind Co Ltd | 電子部品実装方法と電子部品実装装置 |
JP3957895B2 (ja) * | 1997-11-10 | 2007-08-15 | 松下電器産業株式会社 | 部品装着装置 |
KR200262970Y1 (ko) * | 1999-02-27 | 2002-01-31 | 정문술 | 표면실장기의 마운팅 헤드 |
-
1999
- 1999-03-13 KR KR1019990008479A patent/KR100585588B1/ko not_active IP Right Cessation
-
2000
- 2000-03-13 JP JP2000068118A patent/JP4219527B2/ja not_active Expired - Fee Related
- 2000-03-13 CN CNB001040286A patent/CN1201651C/zh not_active Expired - Fee Related
- 2000-03-13 US US09/524,789 patent/US6308403B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20000060295A (ko) | 2000-10-16 |
US6308403B1 (en) | 2001-10-30 |
CN1267186A (zh) | 2000-09-20 |
KR100585588B1 (ko) | 2006-06-07 |
JP4219527B2 (ja) | 2009-02-04 |
JP2000280194A (ja) | 2000-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Gyeongnam, South Korea Patentee after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam, South Korea Patentee before: Samsung Techwin Co.,Ltd. Address after: Gyeongnam, South Korea Patentee after: Samsung Techwin Co.,Ltd. Address before: Gyeongnam, South Korea Patentee before: Samsung Aerospace Industries, Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050511 Termination date: 20180313 |
|
CF01 | Termination of patent right due to non-payment of annual fee |