CN119732185A - 印刷布线板以及其制造方法 - Google Patents

印刷布线板以及其制造方法 Download PDF

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Publication number
CN119732185A
CN119732185A CN202380062778.2A CN202380062778A CN119732185A CN 119732185 A CN119732185 A CN 119732185A CN 202380062778 A CN202380062778 A CN 202380062778A CN 119732185 A CN119732185 A CN 119732185A
Authority
CN
China
Prior art keywords
layer
hole
conductor
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202380062778.2A
Other languages
English (en)
Chinese (zh)
Inventor
佐伯真理
石冈卓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN119732185A publication Critical patent/CN119732185A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202380062778.2A 2022-08-31 2023-08-31 印刷布线板以及其制造方法 Withdrawn CN119732185A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-137463 2022-08-31
JP2022137463 2022-08-31
PCT/JP2023/031794 WO2024048713A1 (ja) 2022-08-31 2023-08-31 印刷配線板及びその製造方法

Publications (1)

Publication Number Publication Date
CN119732185A true CN119732185A (zh) 2025-03-28

Family

ID=90099810

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380062778.2A Withdrawn CN119732185A (zh) 2022-08-31 2023-08-31 印刷布线板以及其制造方法

Country Status (4)

Country Link
EP (1) EP4583645A1 (https=)
JP (2) JP7583228B2 (https=)
CN (1) CN119732185A (https=)
WO (1) WO2024048713A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978152B2 (ja) * 2003-05-19 2007-09-19 住友重機械工業株式会社 レーザ加工方法
JP4457843B2 (ja) * 2004-10-15 2010-04-28 住友ベークライト株式会社 回路基板の製造方法
KR20090110596A (ko) * 2008-04-18 2009-10-22 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2010024233A1 (ja) * 2008-08-27 2010-03-04 日本電気株式会社 機能素子を内蔵可能な配線基板及びその製造方法
US8933556B2 (en) * 2010-01-22 2015-01-13 Ibiden Co., Ltd. Wiring board
JP2014075523A (ja) * 2012-10-05 2014-04-24 Sumitomo Electric Printed Circuit Inc プリント配線板及びその製造方法
JP6846862B2 (ja) 2015-10-26 2021-03-24 京セラ株式会社 印刷配線板およびその製造方法
JP2021111711A (ja) * 2020-01-10 2021-08-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法

Also Published As

Publication number Publication date
JPWO2024048713A1 (https=) 2024-03-07
JP7583228B2 (ja) 2024-11-13
EP4583645A1 (en) 2025-07-09
JP2025017372A (ja) 2025-02-05
WO2024048713A1 (ja) 2024-03-07

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SE01 Entry into force of request for substantive examination
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Application publication date: 20250328