JP7583228B2 - 印刷配線板及びその製造方法 - Google Patents

印刷配線板及びその製造方法 Download PDF

Info

Publication number
JP7583228B2
JP7583228B2 JP2024540014A JP2024540014A JP7583228B2 JP 7583228 B2 JP7583228 B2 JP 7583228B2 JP 2024540014 A JP2024540014 A JP 2024540014A JP 2024540014 A JP2024540014 A JP 2024540014A JP 7583228 B2 JP7583228 B2 JP 7583228B2
Authority
JP
Japan
Prior art keywords
layer
hole
opening
conductor
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024540014A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024048713A1 (https=
JPWO2024048713A5 (https=
Inventor
真理 佐伯
卓 石岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2024048713A1 publication Critical patent/JPWO2024048713A1/ja
Publication of JPWO2024048713A5 publication Critical patent/JPWO2024048713A5/ja
Priority to JP2024191441A priority Critical patent/JP2025017372A/ja
Application granted granted Critical
Publication of JP7583228B2 publication Critical patent/JP7583228B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2024540014A 2022-08-31 2023-08-31 印刷配線板及びその製造方法 Active JP7583228B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024191441A JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022137463 2022-08-31
JP2022137463 2022-08-31
PCT/JP2023/031794 WO2024048713A1 (ja) 2022-08-31 2023-08-31 印刷配線板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024191441A Division JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2024048713A1 JPWO2024048713A1 (https=) 2024-03-07
JPWO2024048713A5 JPWO2024048713A5 (https=) 2024-09-05
JP7583228B2 true JP7583228B2 (ja) 2024-11-13

Family

ID=90099810

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024540014A Active JP7583228B2 (ja) 2022-08-31 2023-08-31 印刷配線板及びその製造方法
JP2024191441A Pending JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024191441A Pending JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Country Status (4)

Country Link
EP (1) EP4583645A1 (https=)
JP (2) JP7583228B2 (https=)
CN (1) CN119732185A (https=)
WO (1) WO2024048713A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004337948A (ja) 2003-05-19 2004-12-02 Sumitomo Heavy Ind Ltd レーザ加工方法
JP2006114787A (ja) 2004-10-15 2006-04-27 Sumitomo Bakelite Co Ltd 回路基板の製造方法
JP2009260204A (ja) 2008-04-18 2009-11-05 Samsung Electro Mech Co Ltd プリント基板およびその製造方法
WO2010024233A1 (ja) 2008-08-27 2010-03-04 日本電気株式会社 機能素子を内蔵可能な配線基板及びその製造方法
WO2011089795A1 (ja) 2010-01-22 2011-07-28 イビデン株式会社 配線板及びその製造方法
JP2021111711A (ja) 2020-01-10 2021-08-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014075523A (ja) * 2012-10-05 2014-04-24 Sumitomo Electric Printed Circuit Inc プリント配線板及びその製造方法
JP6846862B2 (ja) 2015-10-26 2021-03-24 京セラ株式会社 印刷配線板およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004337948A (ja) 2003-05-19 2004-12-02 Sumitomo Heavy Ind Ltd レーザ加工方法
JP2006114787A (ja) 2004-10-15 2006-04-27 Sumitomo Bakelite Co Ltd 回路基板の製造方法
JP2009260204A (ja) 2008-04-18 2009-11-05 Samsung Electro Mech Co Ltd プリント基板およびその製造方法
WO2010024233A1 (ja) 2008-08-27 2010-03-04 日本電気株式会社 機能素子を内蔵可能な配線基板及びその製造方法
WO2011089795A1 (ja) 2010-01-22 2011-07-28 イビデン株式会社 配線板及びその製造方法
JP2021111711A (ja) 2020-01-10 2021-08-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法

Also Published As

Publication number Publication date
JPWO2024048713A1 (https=) 2024-03-07
CN119732185A (zh) 2025-03-28
EP4583645A1 (en) 2025-07-09
JP2025017372A (ja) 2025-02-05
WO2024048713A1 (ja) 2024-03-07

Similar Documents

Publication Publication Date Title
KR100905566B1 (ko) 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법
US8680404B2 (en) Printed circuit board including via pad with concavo-convex patterns and method of manufacturing the same
KR101167466B1 (ko) 다층 인쇄회로기판 그 제조방법
US8541693B2 (en) Wiring board and method for manufacturing the same
US20070074902A1 (en) Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor
JP2011171397A (ja) 多層配線基板及びその製造方法
KR102561794B1 (ko) 인쇄회로기판 및 이의 제조 방법
JP2011155251A (ja) 多層配線基板
JP2013211431A (ja) 印刷配線板内蔵用電子部品および部品内蔵印刷配線板の製造方法
TWI481329B (zh) 貫通孔形成方法及配線電路基板的製造方法
WO2013161181A1 (ja) 多層配線基板
JP7583228B2 (ja) 印刷配線板及びその製造方法
JP2017084914A (ja) 印刷配線板およびその製造方法
US8578601B2 (en) Method of manufacturing printed circuit board
KR20110098677A (ko) 다층 배선 기판 및 그 제조방법
TWI471073B (zh) 線路基板及其製作方法
JP2017135357A (ja) 印刷配線板およびその製造方法
JP2008016482A (ja) 多層プリント配線板の製造方法
KR100704920B1 (ko) 범프기판을 이용한 인쇄회로기판 및 제조방법
US20230397335A1 (en) Wiring substrate
CN121420628A (zh) 印刷布线板及印刷布线板的制造方法
JP3296273B2 (ja) 多層プリント配線板及びその製造方法
WO2025023018A1 (ja) プリント配線板およびプリント配線板の製造方法
JP2024147936A (ja) 配線基板及び配線基板の製造方法
KR20100037391A (ko) 인쇄회로기판의 제조 방법 및 그 방법으로 제조된 인쇄회로기판

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240702

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240702

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240702

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240806

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240920

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241001

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241031

R150 Certificate of patent or registration of utility model

Ref document number: 7583228

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150