JPWO2024048713A1 - - Google Patents

Info

Publication number
JPWO2024048713A1
JPWO2024048713A1 JP2024540014A JP2024540014A JPWO2024048713A1 JP WO2024048713 A1 JPWO2024048713 A1 JP WO2024048713A1 JP 2024540014 A JP2024540014 A JP 2024540014A JP 2024540014 A JP2024540014 A JP 2024540014A JP WO2024048713 A1 JPWO2024048713 A1 JP WO2024048713A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024540014A
Other languages
Japanese (ja)
Other versions
JP7583228B2 (ja
JPWO2024048713A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024048713A1 publication Critical patent/JPWO2024048713A1/ja
Publication of JPWO2024048713A5 publication Critical patent/JPWO2024048713A5/ja
Priority to JP2024191441A priority Critical patent/JP2025017372A/ja
Application granted granted Critical
Publication of JP7583228B2 publication Critical patent/JP7583228B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2024540014A 2022-08-31 2023-08-31 印刷配線板及びその製造方法 Active JP7583228B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024191441A JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022137463 2022-08-31
JP2022137463 2022-08-31
PCT/JP2023/031794 WO2024048713A1 (ja) 2022-08-31 2023-08-31 印刷配線板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024191441A Division JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2024048713A1 true JPWO2024048713A1 (https=) 2024-03-07
JPWO2024048713A5 JPWO2024048713A5 (https=) 2024-09-05
JP7583228B2 JP7583228B2 (ja) 2024-11-13

Family

ID=90099810

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024540014A Active JP7583228B2 (ja) 2022-08-31 2023-08-31 印刷配線板及びその製造方法
JP2024191441A Pending JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024191441A Pending JP2025017372A (ja) 2022-08-31 2024-10-31 印刷配線板及びその製造方法

Country Status (4)

Country Link
EP (1) EP4583645A1 (https=)
JP (2) JP7583228B2 (https=)
CN (1) CN119732185A (https=)
WO (1) WO2024048713A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004337948A (ja) * 2003-05-19 2004-12-02 Sumitomo Heavy Ind Ltd レーザ加工方法
JP2006114787A (ja) * 2004-10-15 2006-04-27 Sumitomo Bakelite Co Ltd 回路基板の製造方法
JP2009260204A (ja) * 2008-04-18 2009-11-05 Samsung Electro Mech Co Ltd プリント基板およびその製造方法
WO2010024233A1 (ja) * 2008-08-27 2010-03-04 日本電気株式会社 機能素子を内蔵可能な配線基板及びその製造方法
WO2011089795A1 (ja) * 2010-01-22 2011-07-28 イビデン株式会社 配線板及びその製造方法
JP2014075523A (ja) * 2012-10-05 2014-04-24 Sumitomo Electric Printed Circuit Inc プリント配線板及びその製造方法
JP2021111711A (ja) * 2020-01-10 2021-08-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6846862B2 (ja) 2015-10-26 2021-03-24 京セラ株式会社 印刷配線板およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004337948A (ja) * 2003-05-19 2004-12-02 Sumitomo Heavy Ind Ltd レーザ加工方法
JP2006114787A (ja) * 2004-10-15 2006-04-27 Sumitomo Bakelite Co Ltd 回路基板の製造方法
JP2009260204A (ja) * 2008-04-18 2009-11-05 Samsung Electro Mech Co Ltd プリント基板およびその製造方法
WO2010024233A1 (ja) * 2008-08-27 2010-03-04 日本電気株式会社 機能素子を内蔵可能な配線基板及びその製造方法
WO2011089795A1 (ja) * 2010-01-22 2011-07-28 イビデン株式会社 配線板及びその製造方法
JP2014075523A (ja) * 2012-10-05 2014-04-24 Sumitomo Electric Printed Circuit Inc プリント配線板及びその製造方法
JP2021111711A (ja) * 2020-01-10 2021-08-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びその製造方法

Also Published As

Publication number Publication date
CN119732185A (zh) 2025-03-28
JP7583228B2 (ja) 2024-11-13
EP4583645A1 (en) 2025-07-09
JP2025017372A (ja) 2025-02-05
WO2024048713A1 (ja) 2024-03-07

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