CN118756273A - 预湿方法 - Google Patents

预湿方法 Download PDF

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Publication number
CN118756273A
CN118756273A CN202410826087.1A CN202410826087A CN118756273A CN 118756273 A CN118756273 A CN 118756273A CN 202410826087 A CN202410826087 A CN 202410826087A CN 118756273 A CN118756273 A CN 118756273A
Authority
CN
China
Prior art keywords
substrate
degassing
liquid
prewetting
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410826087.1A
Other languages
English (en)
Chinese (zh)
Inventor
关正也
矢作光敏
山田展也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021154525A external-priority patent/JP7008863B1/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN118756273A publication Critical patent/CN118756273A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN202410826087.1A 2021-05-31 2022-04-28 预湿方法 Pending CN118756273A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
PCT/JP2021/020612 WO2022254485A1 (ja) 2021-05-31 2021-05-31 プリウェットモジュール、およびプリウェット方法
JPPCT/JP2021/020612 2021-05-31
JP2021154525A JP7008863B1 (ja) 2021-05-31 2021-09-22 プリウェットモジュール、脱気液循環システム、およびプリウェット方法
JP2021-154525 2021-09-22
CN202210460141.6A CN114752976B (zh) 2021-05-31 2022-04-28 预湿模块、脱气液循环系统和预湿方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202210460141.6A Division CN114752976B (zh) 2021-05-31 2022-04-28 预湿模块、脱气液循环系统和预湿方法

Publications (1)

Publication Number Publication Date
CN118756273A true CN118756273A (zh) 2024-10-11

Family

ID=82332925

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202410826087.1A Pending CN118756273A (zh) 2021-05-31 2022-04-28 预湿方法
CN202210460141.6A Active CN114752976B (zh) 2021-05-31 2022-04-28 预湿模块、脱气液循环系统和预湿方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202210460141.6A Active CN114752976B (zh) 2021-05-31 2022-04-28 预湿模块、脱气液循环系统和预湿方法

Country Status (6)

Country Link
US (2) US11833551B2 (https=)
JP (1) JPWO2022254485A1 (https=)
KR (1) KR102467232B1 (https=)
CN (2) CN118756273A (https=)
TW (1) TWI789309B (https=)
WO (1) WO2022254485A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020196506A1 (ja) * 2019-03-28 2020-10-01 東京エレクトロン株式会社 基板処理装置および基板処理方法
US20250038014A1 (en) * 2022-08-08 2025-01-30 Ebara Corporation Pre-wet module

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS387417Y1 (https=) * 1961-06-03 1963-04-24
JPS4531726B1 (https=) * 1967-02-18 1970-10-14
JPS473521B1 (https=) * 1967-12-28 1972-01-31
JPS518898Y1 (https=) * 1969-10-11 1976-03-09
JPS5879404A (ja) * 1981-11-05 1983-05-13 Japanese National Railways<Jnr> 車両の減速照査器
JP3886328B2 (ja) * 2000-09-19 2007-02-28 大日本スクリーン製造株式会社 基板メッキ装置
JP4323930B2 (ja) * 2003-11-18 2009-09-02 キヤノン株式会社 薬液処理方法
JP2009221521A (ja) * 2008-03-14 2009-10-01 Ebara Corp めっき方法及びめっき装置
US8501025B2 (en) * 2010-03-31 2013-08-06 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus and substrate treatment method
JP5920867B2 (ja) * 2011-09-29 2016-05-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6191497B2 (ja) * 2014-02-19 2017-09-06 信越化学工業株式会社 電着装置及び希土類永久磁石の製造方法
US9714462B2 (en) * 2014-10-08 2017-07-25 Applied Materials, Inc. Vacuum pre-wetting apparatus and methods
US10262876B2 (en) * 2015-02-16 2019-04-16 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP6543543B2 (ja) * 2015-09-18 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP7067863B2 (ja) 2016-12-28 2022-05-16 株式会社荏原製作所 基板を処理するための方法および装置
KR20170027746A (ko) * 2017-01-20 2017-03-10 유진인스텍 주식회사 소재의 표면처리정도 측정방법 및 시스템
JP6857531B2 (ja) * 2017-03-31 2021-04-14 株式会社荏原製作所 めっき方法及びめっき装置
JP7083695B2 (ja) * 2018-05-11 2022-06-13 株式会社荏原製作所 バンプ高さ検査装置、基板処理装置、バンプ高さ検査方法、記憶媒体
JP7291030B2 (ja) * 2018-09-06 2023-06-14 株式会社荏原製作所 基板処理装置

Also Published As

Publication number Publication date
JPWO2022254485A1 (https=) 2022-12-08
WO2022254485A1 (ja) 2022-12-08
CN114752976A (zh) 2022-07-15
TWI789309B (zh) 2023-01-01
US20240050992A1 (en) 2024-02-15
US11833551B2 (en) 2023-12-05
US20220379352A1 (en) 2022-12-01
CN114752976B (zh) 2024-08-13
KR102467232B1 (ko) 2022-11-16
TW202302923A (zh) 2023-01-16
US12076760B2 (en) 2024-09-03

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