JPWO2022254485A1 - - Google Patents
Info
- Publication number
- JPWO2022254485A1 JPWO2022254485A1 JP2021549262A JP2021549262A JPWO2022254485A1 JP WO2022254485 A1 JPWO2022254485 A1 JP WO2022254485A1 JP 2021549262 A JP2021549262 A JP 2021549262A JP 2021549262 A JP2021549262 A JP 2021549262A JP WO2022254485 A1 JPWO2022254485 A1 JP WO2022254485A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3308—Vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021154525A JP7008863B1 (ja) | 2021-05-31 | 2021-09-22 | プリウェットモジュール、脱気液循環システム、およびプリウェット方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/020612 WO2022254485A1 (ja) | 2021-05-31 | 2021-05-31 | プリウェットモジュール、およびプリウェット方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022254485A1 true JPWO2022254485A1 (https=) | 2022-12-08 |
Family
ID=82332925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021549262A Pending JPWO2022254485A1 (https=) | 2021-05-31 | 2021-05-31 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11833551B2 (https=) |
| JP (1) | JPWO2022254485A1 (https=) |
| KR (1) | KR102467232B1 (https=) |
| CN (2) | CN118756273A (https=) |
| TW (1) | TWI789309B (https=) |
| WO (1) | WO2022254485A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020196506A1 (ja) * | 2019-03-28 | 2020-10-01 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US20250038014A1 (en) * | 2022-08-08 | 2025-01-30 | Ebara Corporation | Pre-wet module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS387417Y1 (https=) * | 1961-06-03 | 1963-04-24 | ||
| JPS4531726B1 (https=) * | 1967-02-18 | 1970-10-14 | ||
| JPS473521B1 (https=) * | 1967-12-28 | 1972-01-31 | ||
| JPS518898Y1 (https=) * | 1969-10-11 | 1976-03-09 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879404A (ja) * | 1981-11-05 | 1983-05-13 | Japanese National Railways<Jnr> | 車両の減速照査器 |
| JP3886328B2 (ja) * | 2000-09-19 | 2007-02-28 | 大日本スクリーン製造株式会社 | 基板メッキ装置 |
| JP4323930B2 (ja) * | 2003-11-18 | 2009-09-02 | キヤノン株式会社 | 薬液処理方法 |
| JP2009221521A (ja) * | 2008-03-14 | 2009-10-01 | Ebara Corp | めっき方法及びめっき装置 |
| US8501025B2 (en) * | 2010-03-31 | 2013-08-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment apparatus and substrate treatment method |
| JP5920867B2 (ja) * | 2011-09-29 | 2016-05-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6191497B2 (ja) * | 2014-02-19 | 2017-09-06 | 信越化学工業株式会社 | 電着装置及び希土類永久磁石の製造方法 |
| US9714462B2 (en) * | 2014-10-08 | 2017-07-25 | Applied Materials, Inc. | Vacuum pre-wetting apparatus and methods |
| US10262876B2 (en) * | 2015-02-16 | 2019-04-16 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
| JP6543543B2 (ja) * | 2015-09-18 | 2019-07-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板洗浄装置および基板洗浄方法 |
| JP7067863B2 (ja) | 2016-12-28 | 2022-05-16 | 株式会社荏原製作所 | 基板を処理するための方法および装置 |
| KR20170027746A (ko) * | 2017-01-20 | 2017-03-10 | 유진인스텍 주식회사 | 소재의 표면처리정도 측정방법 및 시스템 |
| JP6857531B2 (ja) * | 2017-03-31 | 2021-04-14 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| JP7083695B2 (ja) * | 2018-05-11 | 2022-06-13 | 株式会社荏原製作所 | バンプ高さ検査装置、基板処理装置、バンプ高さ検査方法、記憶媒体 |
| JP7291030B2 (ja) * | 2018-09-06 | 2023-06-14 | 株式会社荏原製作所 | 基板処理装置 |
-
2021
- 2021-05-31 JP JP2021549262A patent/JPWO2022254485A1/ja active Pending
- 2021-05-31 WO PCT/JP2021/020612 patent/WO2022254485A1/ja not_active Ceased
-
2022
- 2022-04-28 CN CN202410826087.1A patent/CN118756273A/zh active Pending
- 2022-04-28 CN CN202210460141.6A patent/CN114752976B/zh active Active
- 2022-05-04 KR KR1020220055302A patent/KR102467232B1/ko active Active
- 2022-05-27 TW TW111119850A patent/TWI789309B/zh active
- 2022-06-13 US US17/839,070 patent/US11833551B2/en active Active
-
2023
- 2023-10-25 US US18/494,501 patent/US12076760B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS387417Y1 (https=) * | 1961-06-03 | 1963-04-24 | ||
| JPS4531726B1 (https=) * | 1967-02-18 | 1970-10-14 | ||
| JPS473521B1 (https=) * | 1967-12-28 | 1972-01-31 | ||
| JPS518898Y1 (https=) * | 1969-10-11 | 1976-03-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022254485A1 (ja) | 2022-12-08 |
| CN114752976A (zh) | 2022-07-15 |
| TWI789309B (zh) | 2023-01-01 |
| US20240050992A1 (en) | 2024-02-15 |
| US11833551B2 (en) | 2023-12-05 |
| CN118756273A (zh) | 2024-10-11 |
| US20220379352A1 (en) | 2022-12-01 |
| CN114752976B (zh) | 2024-08-13 |
| KR102467232B1 (ko) | 2022-11-16 |
| TW202302923A (zh) | 2023-01-16 |
| US12076760B2 (en) | 2024-09-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210820 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210820 |
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| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20210820 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210922 |