WO2022254485A1 - プリウェットモジュール、およびプリウェット方法 - Google Patents
プリウェットモジュール、およびプリウェット方法 Download PDFInfo
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- WO2022254485A1 WO2022254485A1 PCT/JP2021/020612 JP2021020612W WO2022254485A1 WO 2022254485 A1 WO2022254485 A1 WO 2022254485A1 JP 2021020612 W JP2021020612 W JP 2021020612W WO 2022254485 A1 WO2022254485 A1 WO 2022254485A1
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- Prior art keywords
- substrate
- processed
- holding member
- degassing
- liquid
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 45
- 239000000758 substrate Substances 0.000 claims abstract description 353
- 239000007788 liquid Substances 0.000 claims abstract description 73
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000007872 degassing Methods 0.000 claims description 75
- 238000004140 cleaning Methods 0.000 claims description 58
- 230000008569 process Effects 0.000 claims description 24
- 230000003028 elevating effect Effects 0.000 claims description 11
- 238000007654 immersion Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 description 37
- 230000032258 transport Effects 0.000 description 29
- 238000009736 wetting Methods 0.000 description 23
- 238000001035 drying Methods 0.000 description 9
- 238000007598 dipping method Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000002203 pretreatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Definitions
- This application relates to a pre-wet module and a pre-wet method.
- Plating equipment for plating substrates (for example, semiconductor wafers) consists of a pre-wet module that performs various pretreatments such as degassing on substrates, and a plating module that performs plating on pretreated substrates. module and;
- Patent Document 1 a holder holding a substrate is placed in a pre-wetting tank, and pre-treatment is performed by supplying a pre-wetting liquid to the space while evacuating the space where the surface to be processed of the substrate is exposed.
- a pre-wet module is disclosed.
- the conventional technology has room for improvement in efficiently pre-treating the substrate.
- the conventional technology is configured such that one substrate is held by a substrate holder and pre-treated in the pre-wet tank, the pre-treatment of the substrates is sequentially performed one by one in the pre-wet module. . Therefore, for example, when pre-treating a certain substrate, the pre-wet module is exclusively used for that substrate, and only after the substrate is unloaded from the pre-wet module is the subsequent substrate loaded into the pre-wet module and pre-processed. can be done. As a result, the prior art leaves room for improvement in terms of increasing the throughput of pre-wet modules.
- one of the purposes of the present application is to efficiently perform pretreatment on substrates.
- a degassing vessel configured to contain the degassed liquid, a first holding member configured to hold the first substrate, and a and driving the substrate holder so that the first substrate and the second substrate are sequentially immersed in the degassing liquid in the degassing tank.
- a pre-wet module is disclosed that includes a drive mechanism configured to.
- FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment.
- FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment.
- FIG. 3 is a vertical cross-sectional view schematically showing the configuration of the pre-wet module of one embodiment.
- FIG. 4A schematically illustrates a pre-wetting method using a pre-wet module of one embodiment.
- FIG. 4B schematically illustrates a pre-wetting method using the pre-wet module of one embodiment.
- FIG. 4C schematically illustrates a pre-wetting method using the pre-wet module of one embodiment.
- FIG. 4D schematically illustrates a pre-wetting method using the pre-wet module of one embodiment.
- FIG. 4A schematically illustrates a pre-wetting method using a pre-wet module of one embodiment.
- FIG. 4B schematically illustrates a pre-wetting method using the pre-wet module of one embodiment.
- FIG. 4C schematically illustrates
- FIG. 4E schematically illustrates a pre-wetting method using the pre-wet module of one embodiment.
- FIG. 4F schematically illustrates a pre-wetting method using the pre-wet module of one embodiment.
- FIG. 5 is a vertical cross-sectional view schematically showing the configuration of a pre-wet module of another embodiment.
- FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment.
- FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment.
- the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, and a transfer device. 700 and a control module 800 .
- the load port 100 is a module for loading substrates stored in cassettes such as FOUPs (not shown) into the plating apparatus 1000 and for unloading substrates from the plating apparatus 1000 to cassettes. Although four load ports 100 are arranged horizontally in this embodiment, the number and arrangement of the load ports 100 are arbitrary.
- the transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates among the load port 100 , the aligner 120 and the transport device 700 . When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary placement table (not shown).
- the aligner 120 is a module for aligning the positions of orientation flats, notches, etc. of the substrate in a predetermined direction. Although two aligners 120 are arranged horizontally in this embodiment, the number and arrangement of the aligners 120 are arbitrary.
- the pre-wet module 200 replaces the air inside the pattern formed on the substrate surface with the treatment liquid by wetting the surface to be plated of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water.
- the pre-wet module 200 is configured to perform a pre-wet process that facilitates the supply of the plating solution to the inside of the pattern by replacing the treatment solution inside the pattern with the plating solution during plating. Although two pre-wet modules 200 are arranged vertically in this embodiment, the number and arrangement of the pre-wet modules 200 are arbitrary.
- the presoak module 300 for example, an oxide film having a large electric resistance existing on the surface of a seed layer formed on the surface to be plated of the substrate before plating is removed by etching with a treatment liquid such as sulfuric acid or hydrochloric acid, and the surface of the plating substrate is cleaned.
- a treatment liquid such as sulfuric acid or hydrochloric acid
- it is configured to perform a pre-soak process for activation.
- two presoak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the presoak modules 300 are arbitrary.
- the plating module 400 applies plating to the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged vertically and four horizontally, and a total of 24 plating modules 400 are provided. The number and arrangement of are arbitrary.
- the cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating process.
- the spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. Although two spin rinse dryers are arranged vertically in this embodiment, the number and arrangement of the spin rinse dryers are arbitrary.
- the transport device 700 is a device for transporting substrates between a plurality of modules within the plating apparatus 1000 .
- Control module 800 is configured to control a plurality of modules of plating apparatus 1000 and may comprise, for example, a general purpose or dedicated computer with input/output interfaces to an operator.
- a substrate stored in a cassette is loaded into the load port 100 .
- the transport robot 110 takes out the substrate from the cassette of the load port 100 and transports the substrate to the aligner 120 .
- the aligner 120 aligns orientation flats, notches, etc. of the substrate in a predetermined direction.
- the transport robot 110 transfers the substrate aligned by the aligner 120 to the transport device 700 .
- the transport device 700 transports the substrate received from the transport robot 110 to the pre-wet module 200 .
- the pre-wet module 200 pre-wets the substrate.
- the transport device 700 transports the pre-wet processed substrate to the pre-soak module 300 .
- the presoak module 300 applies a presoak treatment to the substrate.
- the transport device 700 transports the presoaked substrate to the plating module 400 .
- the plating module 400 applies plating to the substrate.
- the transport device 700 transports the plated substrate to the cleaning module 500 .
- the cleaning module 500 performs a cleaning process on the substrate.
- the transport device 700 transports the cleaned substrate to the spin rinse dryer 600 .
- a spin rinse dryer 600 performs a drying process on the substrate.
- the transport device 700 delivers the dried substrate to the transport robot 110 .
- the transport robot 110 transports the substrate received from the transport device 700 to the cassette of the load port 100 . Finally, the cassette containing the substrates is unloaded from the load port 100 .
- FIG. 3 is a longitudinal sectional view schematically showing the configuration of the pre-wet module of one embodiment.
- the pre-wet module 200 comprises a degassing vessel 210 configured to contain a degassed liquid (eg, degassed water).
- the degassing tank 210 has an open upper surface and has a shape capable of storing the degassed liquid.
- a space in the degassing tank 210 is partitioned into two areas by a vertically extending partition plate 212 .
- the degassing tank 210 is divided into a degassing area 214 for degassing the substrate WF and an overflow area 216 configured to store the degassed liquid overflowing from the degassing area 214. partitioned.
- the pre-wet module 200 includes a substrate holder 220 arranged above the deaeration tank 210 .
- the substrate holder 220 is configured to hold a substrate WF to be preprocessed.
- the substrate holder 220 includes a cylindrical first holding member 222 configured to hold a disk-shaped first substrate WF-1 and a cylindrical second holding member 222 configured to hold a disk-shaped second substrate WF-2. and a cylindrical second holding member 224 configured to:
- the first holding member 222 and the second holding member 224 are configured to be able to hold the back surface of the substrate to be processed by vacuum adsorption or the like.
- the first holding member 222 and the second holding member 224 are arranged such that the surface to be processed WF-1a of the first substrate WF-1 and the surface to be processed WF-2a of the second substrate WF-2 are It is configured to hold the first substrate WF-1 and the second substrate WF-2 so as to face opposite to each other (vertically opposite in the state of FIG. 3).
- first substrate WF-1 and second substrate WF-2 are used, but this is merely for distinguishing different substrates, and the It does not imply order.
- the pre-wet module 200 comprises a drive mechanism 230 configured to drive the substrate holder 220 .
- the drive mechanism 230 drives the substrate holder 220 so that the first substrate WF- 1 and the second substrate WF- 2 are sequentially immersed in the degassing liquid in the degassing tank 210 .
- the drive mechanism 230 specifically includes a rotation mechanism 240 configured to rotate the substrate holder 220 and an elevating mechanism 248 configured to elevate the substrate holder 220 .
- the rotation mechanism 240 is configured to rotate the substrate holder 220 around a shaft 242 extending horizontally from the substrate holder 220 .
- the rotation mechanism 240 can be set to the first state in which the surface to be processed WF-1a of the first substrate WF-1 faces the degassed liquid in the degassing tank 210, and the state in which the surface to be processed WF-1a of the first substrate WF-1 faces the degassed liquid in the degassing tank 210.
- the substrate holder 220 is configured to rotate between a second state in which the processing surface WF-2a faces the degassed liquid in the degassing tank 210 .
- the rotating mechanism 240 can be implemented by a known mechanism such as a motor.
- the elevating mechanism 248 can immerse the first substrate WF-1 in the degassing liquid by lowering the substrate holder 220 from the first state, and can lower the substrate holder 220 from the second state to the second substrate WF-1.
- 2 substrate WF-2 can be immersed in the degassing liquid.
- the lifting mechanism 248 can be implemented by a known mechanism such as a motor. In this embodiment, an example in which the drive mechanism 230 includes the rotation mechanism 240 and the lifting mechanism 248 is shown, but the configuration is not limited to this.
- the pre-wet module 200 applies a predetermined process to one of the first substrate WF-1 and the second substrate WF-2 while the other substrate is immersed in the degassing liquid in the degassing tank 210.
- a processor 258 configured to perform The processing apparatus 258 includes a substrate station 250 positioned above the substrate holder 220 and a cleaning apparatus 260 positioned above the substrate station 250 in this embodiment.
- the substrate station 250 is a member for holding a substrate when transferring the substrate to and from the transport device 700 and when performing a cleaning process, which will be described later, on the substrate.
- the substrate station 250 comprises a first arm member 250-1 and a second arm member 250-2 for holding the back surface of the substrate to be processed.
- Each of the first arm member 250-1 and the second arm member 250-2 has a projecting member 250a for holding the outer edge of the back surface of the substrate to be processed.
- the first arm member 250-1 and the second arm member 250-2 are horizontally arranged side by side and spaced apart.
- the first arm member 250-1 and the second arm member 250-2 are movable toward and away from each other.
- First arm member 250-1 and second arm member 250-2 are configured to hold a substrate when in a substrate holding position proximate each other.
- the cleaning apparatus 260 includes a disk-shaped ceiling member 262 arranged to face the substrate held in the substrate station 250, a cylindrical side wall member 264 attached to the outer edge of the lower surface of the ceiling member 262, and a ceiling member 264. and a plurality of nozzles 268 attached to the lower surface of member 262 .
- a vertically extending shaft 266 is attached to the center of the upper surface of the ceiling member 262 .
- the shaft 266 and the ceiling member 262 are formed with a channel 267 for passing cleaning liquid (for example, pure water), and the channel 267 communicates with a plurality of nozzles 268 .
- the plurality of nozzles 268 are configured to supply cleaning liquid sent from a cleaning liquid source (not shown) through the channel 267 to the surface to be processed of the substrate held by the substrate station 250 .
- the pre-wet module 200 comprises a horizontal drive member 270 for driving the cleaning device 260 horizontally.
- Horizontal drive member 270 moves cleaning device 260 horizontally via a horizontally extending shaft 272 fixed to shaft 266 . Thereby, the cleaning device 260 can clean the entire surface to be processed of the substrate.
- the horizontal drive member 270 can be implemented by a known mechanism such as a motor.
- the plurality of nozzles 268 hold the surface to be processed WF-2a vertically upward while the first substrate WF-1 is immersed in the degassing liquid in the degassing tank 210.
- the cleaning liquid is supplied to the surface to be processed WF-2a of the second substrate WF-2.
- the cleaning process may be performed on a substrate (a substrate held with the surface to be processed facing upward in the vertical direction).
- the substrate holder 220 has shielding members 225 arranged between the plurality of nozzles 268 and the deaeration tank 210 .
- the shield member 225 has an outer edge larger than the opening 210a formed in the upper part of the deaeration tank 210 (the upper opening of the deaeration region 214), and is configured to shield between the plurality of nozzles 268 and the opening 210a. It is a disc-shaped member with By providing the shield member 225, it is possible to prevent the cleaning liquid supplied from the plurality of nozzles 268 from dropping into the degassing tank 210 (degassing area 214).
- the substrate holder 220 includes a first holding member 222 and a second holding member 224, and the driving mechanism 230 holds the first substrate WF-1 and the second substrate WF-1.
- WF-2 is configured to drive the substrate holder 220 so that it is immersed in the degassing liquid in the degassing tank 210 in sequence. Therefore, the pre-wet module 200 can concurrently perform different processes (eg, cleaning process and degassing process) on the first substrate WF-1 and the second substrate WF-2 within the pre-wet module 200. . Therefore, according to this embodiment, the substrate can be pretreated efficiently, and the throughput of the prewet module 200 can be improved.
- the substrate station 250 and the cleaning device 260 are described as an example of the processing device 258 that is executed in parallel with the deaeration process, but the present invention is not limited to this.
- the processing device 258 may be a drying device that dries the outer edge of the surface to be processed of the substrate that has undergone the degassing process.
- the processing apparatus 258 is a surface modification apparatus configured to perform UV processing or plasma processing on the surface to be processed in order to modify the surface to be processed of the substrate before performing the degassing treatment so that the surface to be processed is hydrophilic. It may be a device.
- the pre-wet module 200 may not be provided with processing equipment such as cleaning equipment 260, substrate station 250, drying equipment, or surface modification equipment. In this case, for example, the process of holding the second substrate on the second holding member 224 (substrate transfer process) can be performed in parallel with the degassing process of the first substrate. As a result, after the degassing process of the first substrate is completed, the degassing process can be quickly performed on the second substrate. Throughput of the pre-wet module 200 can be improved.
- FIG. 4A schematically illustrate a pre-wetting method using the pre-wet module of one embodiment.
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 closer together to a substrate holding position (step 101).
- the prewetting method holds the first substrate WF-1 loaded into the prewetting module 200 by the transport device 700 at the substrate station 250 (step 102).
- the surface to be processed of the first substrate WF-1 held by the substrate station 250 is cleaned by the cleaning device 260 (step 103).
- the substrate holder 220 is lifted using the elevating mechanism 248 to bring the first holding member 222 into contact with the back surface of the surface to be processed of the first substrate WF-1.
- the first substrate WF-1 is held (step 104).
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 away from each other (step 105).
- the pre-wetting method uses the rotation mechanism 240 to rotate the substrate holder 220 180 degrees so that the substrate holder 220 is turned upside down (step 106).
- the substrate holder 220 is lowered using the elevating mechanism 248, so that the first substrate held by the first holding member 222 is exposed to the degassed liquid contained in the degassing tank 210. WF-1 is soaked (first soak step 107).
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 closer together to the substrate holding position (step 108).
- the pre-wet method transfers the second substrate WF-2 loaded into the pre-wet module 200 by the transport device 700 to the substrate station 250 in parallel with the execution of the first dipping step 107 .
- step 109 the pre-wetting method performs predetermined processing on the second substrate WF-2 held by the second holding member 224 in subsequent processing, in parallel with the execution of the first dipping step 107.
- first processing step 110 the surface to be processed of the second substrate WF-2 held by the substrate station 250 (the substrate held with the surface to be processed facing upward in the vertical direction) is cleaned by the cleaning device 260.
- the substrate holder 220 is lifted using the elevating mechanism 248 to bring the second holding member 224 into contact with the back surface of the surface to be processed of the second substrate WF-2.
- the second substrate WF-2 is held by vacuum-sucking the rear surface (step 111).
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 away from each other (step 112).
- the surface to be processed of the second substrate WF-2 held by the second holding member 224 faces the degassed liquid contained in the degassing tank 210.
- the substrate holder 220 is rotated by 180 degrees (upside down) using the rotation mechanism 240 (rotation step 113).
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 closer together to the substrate holding position to place the first substrate WF-1 on the substrate. Hold at station 250 (step 114).
- the substrate holder 220 is lowered using the elevating mechanism 248 so that the second substrate held by the second holding member 224 is exposed to the degassed liquid contained in the degassing tank 210 .
- WF-2 is soaked (second soak step 115).
- the pre-wet method unloads the first substrate WF-1 held at the substrate station 250 by the transport device 700 (step 116).
- the pre-wet method transfers the third substrate WF-3 loaded into the pre-wet module 200 by the transport device 700 to the substrate station 250 in parallel with the execution of the second dipping step 115 .
- step 117 the pre-wetting method performs predetermined processing on the third substrate WF-3, which is held by the first holding member 222 in subsequent processing, in parallel with the execution of the second dipping step 115.
- second processing step 118 the cleaning device 260 is applied to the surface to be processed of the third substrate WF-3 held in the substrate station 250 (the substrate held with the surface to be processed facing upward in the vertical direction).
- the substrate holder 220 is lifted using the elevating mechanism 248 to bring the first holding member 222 into contact with the back surface of the surface to be processed of the third substrate WF-3.
- the third substrate WF-3 is held by vacuum-sucking the rear surface (step 119).
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 away from each other (step 120).
- the surface to be processed of the third substrate WF-3 held by the first holding member 222 faces the degassed liquid contained in the degassing tank 210.
- the substrate holder 220 is rotated by 180 degrees (upside down) using the rotation mechanism 240 (rotation step 121).
- the pre-wet method moves the first arm member 250-1 and the second arm member 250-2 of the substrate station 250 closer to each other to the substrate holding position to place the second substrate WF-2 on the substrate. Hold at station 250 (step 122).
- the substrate holder 220 is lowered using the elevating mechanism 248, so that the third substrate held by the first holding member 222 is exposed to the degassed liquid contained in the degassing tank 210.
- WF-3 is soaked (third soak step 123).
- the pre-wet method unloads the second substrate WF-2 held at the substrate station 250 by the transport device 700 (step 124). After step 124, the pre-wet method returns to FIG. 4C to repeat the pre-treatment for subsequent substrates.
- the pre-wetting method of the present embodiment is configured such that different processes (cleaning process and degassing process) are simultaneously performed on a plurality of substrates in the pre-wet module 200 . Therefore, according to this embodiment, the substrate can be pretreated efficiently, and the throughput of the prewet module 200 can be improved.
- FIG. 5 is a vertical cross-sectional view schematically showing the configuration of a pre-wet module of another embodiment. Description of the same configuration as that of the embodiment shown in FIG. 3 will be omitted.
- the substrate holder 220 includes a first holding member 222 for holding the first substrate WF-1, a second holding member 224 for holding the second substrate WF-2, It has a third holding member 226 for holding the third substrate WF-3 and a fourth holding member 228 for holding the fourth substrate WF-4.
- a rotation mechanism not shown in FIG. 5 can rotate the substrate holder 220 around the axis of the shaft 242 .
- the rotation mechanism is set to the first state in which the surface to be processed of the first substrate WF-1 faces the deaerated liquid in the deaeration tank 210, and the state in which the surface to be processed of the second substrate WF-2 is degassed.
- a fourth state opposite to By elevating the substrate holder 220 by an elevating mechanism (not shown in FIG. 5), the first substrate WF-1 to the first substrate WF-4 can be sequentially immersed in the deaerated liquid.
- the first holding member 222 to the fourth holding member 228 are arranged with their positions shifted by 90 degrees around the axis of the shaft 242 .
- the surfaces to be processed of the first substrate WF-1 and the third substrate WF-3 of the first holding member 222 and the third holding member 226 face vertically opposite to each other. are configured to hold a first substrate WF-1 and a third substrate WF-3 in such a manner.
- the second holding member 224 and the fourth holding member 228 hold the second substrate WF-2 and the fourth substrate WF-4 so that the surfaces to be processed of the second substrate WF-2 and the fourth substrate WF-4 face opposite horizontal directions. 2 and a fourth substrate WF-4.
- the pre-wet module 200 is configured to perform predetermined processing on the other substrates while any one of the first substrate WF-1 to the fourth substrate WF-4 is immersed in the degassing liquid. and a processed processor 258 .
- the cleaning device 260 which is one form of the processing device 258, is configured to supply the cleaning liquid to the second substrate WF-2 whose surface to be processed is oriented in the horizontal direction.
- the second holding member 224 is arranged such that when the surface to be processed WF-2a of the second substrate WF-2 faces the horizontal direction, the surface to be processed of the second substrate WF-2 is positioned in the degassing tank.
- the 210 is configured to hold the second substrate WF-2 so as to be positioned outside the opening 210a formed in the upper portion of the substrate 210; As a result, the cleaning liquid that has collided with the surface to be processed of the second substrate WF-2 falls outside the deaeration tank 210, so that the cleaning liquid can be prevented from being mixed with the deaeration liquid.
- the first holding member 222 , the third holding member 226 and the fourth holding member 228 is configured to hold the second substrate WF-2 so as to be positioned outside the opening 210a formed in the upper portion of the substrate 210;
- the first holding member 222, the third holding member 226, and the fourth holding member 228 are arranged at the same position as the second holding member 224 by rotating the substrate holder 220, the first substrate WF -1, the third substrate WF-3, and the fourth substrate WF-4 are located outside the opening 210a.
- the processing device 258 includes a drying device 280 configured to dry a substrate (fourth substrate WF-4 in FIG. 5) whose surface to be processed faces the horizontal direction. Prepare.
- the drying device 280 is configured to dry the outer edge of the processed surface of the substrate after the degassing process has been performed. By providing the drying device 280, the feed contacts can be prevented from contacting the wet outer edge of the surface of the substrate during the subsequent plating process.
- the processing apparatus 258 is configured to perform UV processing or plasma processing on a substrate (the first substrate WF-1 in FIG. 5) whose surface to be processed faces the vertically upward direction. and a surface modification device 290 .
- the surface modification device 290 By providing the surface modification device 290, the surface to be processed of the substrate before the cleaning treatment and the degassing treatment can be modified to be hydrophilic.
- the pre-wet module 200 surface modification processing, cleaning processing, degassing processing, and drying processing can be performed on a plurality of substrates in parallel. Therefore, according to this embodiment, the substrate can be pretreated efficiently, and the throughput of the prewet module 200 can be improved.
- the present application holds a degassing tank configured to contain a degassed liquid, a first holding member configured to hold a first substrate, and a second substrate. a substrate holder having a second holding member configured as above; and a drive mechanism configured to drive the pre-wet module.
- the drive mechanism is configured to have a first state in which the surface to be processed of the first substrate faces the deaerated liquid in the deaeration tank, and a first state in which the surface to be processed of the first substrate a rotating mechanism configured to rotate the substrate holder between a second state in which the processing surface faces the degassed liquid in the degassing tank; and a rotating mechanism configured to move the substrate holder up and down.
- a lift mechanism configured to and a pre-wet module.
- the present application applies a predetermined treatment to one of the first substrate and the second substrate while the other substrate is immersed in the degassing liquid in the degassing tank.
- a pre-wet module is disclosed that further includes a processing device configured to:
- the processing apparatus is configured such that, when one of the first substrate and the second substrate is immersed in the degassing liquid in the degassing tank, the other substrate is A pre-wet module is disclosed that includes a nozzle configured to supply a cleaning liquid to the surface to be treated of the.
- the first holding member and the second holding member are configured such that the surface to be processed of the first substrate and the surface to be processed of the second substrate are vertically opposite to each other.
- the first substrate and the second substrate are held so as to face toward each other, and the nozzle is configured to supply the cleaning liquid to the substrate held with the surface to be processed facing upward in the vertical direction.
- a pre-wet module is disclosed.
- the substrate holder has an outer edge larger than an opening formed in the upper part of the degassing tank and is configured to shield between the nozzle and the opening.
- a pre-wet module is disclosed that includes a member.
- the substrate holder further has a third holding member for holding a third substrate and a fourth holding member for holding a fourth substrate
- the driving mechanism moves the substrates such that the first substrate, the second substrate, the third substrate, and the fourth substrate are sequentially immersed in the degassed liquid in the degassing tank.
- a pre-wet module is disclosed that is configured to rotate the holder.
- the first to fourth holding members are arranged such that the surfaces to be processed of the first to fourth substrates are vertically opposite and horizontally opposite to each other. It is configured to hold the first substrate to the fourth substrate so as to face oppositely, and any one of the first substrate to the fourth substrate is in contact with the degassing liquid in the degassing tank.
- a pre-wet module is disclosed that further includes a processing device configured to perform predetermined processing on other substrates while being immersed.
- the first holding member to the fourth holding member are provided when the surfaces to be processed of the first substrate to the fourth substrate are oriented in the horizontal direction.
- the first to fourth substrates are held such that the surfaces to be processed of the substrates are positioned outside an opening formed in the upper part of the degassing tank, and the processing apparatus is configured to hold the substrates to be processed.
- a pre-wet module is disclosed that includes a nozzle configured to apply a cleaning liquid to a horizontally oriented substrate surface to be processed.
- the present application provides, as an embodiment, a first immersion step of immersing the first substrate held by the first holding member of the substrate holder in the degassed liquid contained in the degassing tank; a first processing step of performing a predetermined process on a second substrate held by a second holding member of the substrate holder in parallel with execution of one dipping step; and the first dipping step. and after the first processing step, the substrate holder is moved such that the surface to be processed of the second substrate held by the second holding member faces the deaerated liquid contained in the deaeration tank.
- a rotating step of rotating after the rotating step, a second immersion step of immersing the second substrate held by the second holding member in the degassed liquid contained in the degassing tank; and a second processing step of performing a predetermined process on the third substrate held by the first holding member in parallel with the execution of the second immersion step.
- the first processing step includes a cleaning step of supplying a cleaning liquid to the surface to be processed of the second substrate
- the second processing step includes the third substrate.
- a pre-wet method including a cleaning step of supplying a cleaning liquid to the surface to be processed of the.
- the first holding member and the second holding member are configured such that the surface to be processed of the first substrate and the surface to be processed of the second substrate are vertically opposite to each other.
- the first substrate and the second substrate are held so as to face toward the above, and in the cleaning step, a cleaning liquid is supplied to the substrate held with the surface to be processed facing upward in the vertical direction.
- a pre-wet method is disclosed, comprising:
- pre-wet module 210 deaeration tank 210a opening 220 substrate holder 222 first holding member 224 second holding member 225 shielding member 226 third holding member 228 fourth holding member 230 driving mechanism 240 rotating mechanism 248 lifting mechanism 250 Substrate station 250-1 First arm member 250-2 Second arm member 260 Cleaning device 268 Nozzle 280 Drying device 290 Surface modification device 1000 Plating device WF Substrate WF-1 First substrate WF-2 Second substrate WF-3 Third substrate WF-4 Fourth substrate
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Abstract
Description
図1は、本実施形態のめっき装置の全体構成を示す斜視図である。図2は、本実施形態のめっき装置の全体構成を示す平面図である。図1、2に示すように、めっき装置1000は、ロードポート100、搬送ロボット110、アライナ120、プリウェットモジュール200、プリソークモジュール300、めっきモジュール400、洗浄モジュール500、スピンリンスドライヤ600、搬送装置700、および、制御モジュール800を備える。
次に、プリウェットモジュール200の構成を説明する。本実施形態における2台のプリウェットモジュール200は同一の構成であるので、1台のプリウェットモジュール200のみを説明する。
210 脱気槽
210a 開口
220 基板ホルダ
222 第1の保持部材
224 第2の保持部材
225 遮蔽部材
226 第3の保持部材
228 第4の保持部材
230 駆動機構
240 回転機構
248 昇降機構
250 基板ステーション
250-1 第1のアーム部材
250-2 第2のアーム部材
260 洗浄装置
268 ノズル
280 乾燥装置
290 表面改質装置
1000 めっき装置
WF 基板
WF-1 第1の基板
WF-2 第2の基板
WF-3 第3の基板
WF-4 第4の基板
Claims (12)
- 脱気液を収容するように構成された脱気槽と、
第1の基板を保持するように構成された第1の保持部材、および第2の基板を保持するように構成された第2の保持部材を有する基板ホルダと、
前記第1の基板と前記第2の基板が順次、前記脱気槽内の脱気液に浸漬されるように、前記基板ホルダを駆動するように構成された駆動機構と、
を含む、
プリウェットモジュール。 - 前記駆動機構は、前記第1の基板の被処理面が前記脱気槽内の脱気液に対向する第1の状態と、前記第2の基板の被処理面が前記脱気槽内の脱気液に対向する第2の状態と、の間で前記基板ホルダを回転させるように構成された回転機構と、
前記基板ホルダを昇降させるように構成された昇降機構と、
を含む、
請求項1に記載のプリウェットモジュール。 - 前記第1の基板および前記第2の基板のいずれか一方が前記脱気槽内の脱気液に浸漬されているときに他方の基板に所定の処理を行うように構成された処理装置をさらに含む、
請求項1または2に記載のプリウェットモジュール。 - 前記処理装置は、前記第1の基板および前記第2の基板のいずれか一方が前記脱気槽内の脱気液に浸漬されているときに他方の基板の被処理面に洗浄液を供給するように構成されたノズルを含む、
請求項3に記載のプリウェットモジュール。 - 前記第1の保持部材および前記第2の保持部材は、前記第1の基板の被処理面および前記第2の基板の被処理面が互いに鉛直方向の反対に向くように前記第1の基板および前記第2の基板を保持するように構成され、
前記ノズルは、被処理面が鉛直方向の上向きに保持された基板に対して洗浄液を供給するように構成される、
請求項4に記載のプリウェットモジュール。 - 前記基板ホルダは、前記脱気槽の上部に形成された開口よりも大きな外縁を有し前記ノズルと前記開口との間を遮蔽するように構成された遮蔽部材を含む、
請求項5に記載のプリウェットモジュール。 - 前記基板ホルダは、第3の基板を保持するための第3の保持部材、および第4の基板を保持するための第4の保持部材をさらに有し、
前記駆動機構は、前記第1の基板、前記第2の基板、前記第3の基板、および前記第4の基板が順次、前記脱気槽内の脱気液に浸漬されるように、前記基板ホルダを回転させるように構成される、
請求項1または2に記載のプリウェットモジュール。 - 前記第1の保持部材から前記第4の保持部材は、前記第1の基板から前記第4の基板の被処理面がそれぞれ鉛直方向の反対および水平方向の反対に向くように前記第1の基板から前記第4の基板を保持するように構成され、
前記第1の基板から前記第4の基板のいずれか1つが前記脱気槽内の脱気液に浸漬されているときに他の基板に対して所定の処理を行うように構成された処理装置をさらに含む、
請求項7に記載のプリウェットモジュール。 - 前記第1の保持部材から前記第4の保持部材はそれぞれ、前記第1の基板から前記第4の基板の被処理面が水平方向に向いたときに当該基板の被処理面が前記脱気槽の上部に形成された開口の外側に位置するように前記第1の基板から前記第4の基板を保持するように構成され、
前記処理装置は、被処理面が水平方向に向いた状態の基板の被処理面に洗浄液を供給するように構成されたノズルを含む、
請求項8に記載のプリウェットモジュール。 - 脱気槽に収容された脱気液に、基板ホルダの第1の保持部材に保持された第1の基板を浸漬させる第1の浸漬ステップと、
前記第1の浸漬ステップの実行と並行して、前記基板ホルダの第2の保持部材に保持される第2の基板に対して所定の処理を実行する第1の処理ステップと、
前記第1の浸漬ステップおよび前記第1の処理ステップの後に、前記第2の保持部材に保持された前記第2の基板の被処理面が前記脱気槽に収容された脱気液に対向するように前記基板ホルダを回転させる回転ステップと、
前記回転ステップの後に、前記脱気槽に収容された脱気液に、前記第2の保持部材に保持された前記第2の基板を浸漬させる第2の浸漬ステップと、
前記第2の浸漬ステップの実行と並行して、前記第1の保持部材に保持される第3の基板に対して所定の処理を実行する第2の処理ステップと、
を含む、プリウェット方法。 - 前記第1の処理ステップは、前記第2の基板の被処理面に洗浄液を供給する洗浄ステップを含み、
前記第2の処理ステップは、前記第3の基板の被処理面に洗浄液を供給する洗浄ステップを含む、
請求項10に記載のプリウェット方法。 - 前記第1の保持部材および前記第2の保持部材は、前記第1の基板の被処理面および前記第2の基板の被処理面が互いに鉛直方向の反対に向くように前記第1の基板および前記第2の基板を保持するように構成され、
前記洗浄ステップは、被処理面が鉛直方向の上向きに保持された基板に対して洗浄液を供給するように構成される、
請求項11に記載のプリウェット方法。
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CN114752976A (zh) | 2022-07-15 |
US20220379352A1 (en) | 2022-12-01 |
US20240050992A1 (en) | 2024-02-15 |
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