CN118712879A - 发光元件 - Google Patents

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Publication number
CN118712879A
CN118712879A CN202411005409.2A CN202411005409A CN118712879A CN 118712879 A CN118712879 A CN 118712879A CN 202411005409 A CN202411005409 A CN 202411005409A CN 118712879 A CN118712879 A CN 118712879A
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CN
China
Prior art keywords
light
emitting element
layer
electrode
radiation
Prior art date
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Pending
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CN202411005409.2A
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English (en)
Chinese (zh)
Inventor
徐子杰
黄意雯
林羿宏
吕志强
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Epistar Corp
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Epistar Corp
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Publication of CN118712879A publication Critical patent/CN118712879A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/125—Distributed Bragg reflector [DBR] lasers
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
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    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
    • H01S5/04253—Electrodes, e.g. characterised by the structure characterised by the material having specific optical properties, e.g. transparent electrodes
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    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
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    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
    • H01S5/18322—Position of the structure
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    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18344—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] characterized by the mesa, e.g. dimensions or shape of the mesa
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    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
    • H01S5/18394—Apertures, e.g. defined by the shape of the upper electrode
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    • H01S5/185—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
    • H01S5/187—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL] using Bragg reflection
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    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2213—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on polyimide or resin
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    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
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    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
    • H01S5/2216—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides nitrides
    • H—ELECTRICITY
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    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
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    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01S2301/00—Functional characteristics
    • H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
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    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
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    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18344—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] characterized by the mesa, e.g. dimensions or shape of the mesa
    • H01S5/1835—Non-circular mesa
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    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
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    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Electroluminescent Light Sources (AREA)
CN202411005409.2A 2016-03-07 2017-03-07 发光元件 Pending CN118712879A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/062,995 US9837792B2 (en) 2016-03-07 2016-03-07 Light-emitting device
US15/062,995 2016-03-07
CN201710130811.7A CN107171180A (zh) 2016-03-07 2017-03-07 发光元件

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CN201710130811.7A Division CN107171180A (zh) 2016-03-07 2017-03-07 发光元件

Publications (1)

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CN118712879A true CN118712879A (zh) 2024-09-27

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CN201710130811.7A Pending CN107171180A (zh) 2016-03-07 2017-03-07 发光元件
CN202411005409.2A Pending CN118712879A (zh) 2016-03-07 2017-03-07 发光元件

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CN201710130811.7A Pending CN107171180A (zh) 2016-03-07 2017-03-07 发光元件

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Country Link
US (3) US9837792B2 (enExample)
JP (3) JP7068772B2 (enExample)
KR (1) KR102336974B1 (enExample)
CN (2) CN107171180A (enExample)
DE (1) DE102017101731A1 (enExample)
TW (4) TWI847513B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11381060B2 (en) 2017-04-04 2022-07-05 Apple Inc. VCSELs with improved optical and electrical confinement
CA3094046C (en) * 2018-03-19 2023-03-28 Ricoh Company, Ltd. Surface-emitting laser array, detection device, and laser device
KR102518449B1 (ko) 2019-02-21 2023-04-05 애플 인크. 유전체 dbr을 갖는 인듐 인화물 vcsel
WO2020205166A1 (en) * 2019-04-01 2020-10-08 Apple Inc. Vcsel array with tight pitch and high efficiency
US20200365767A1 (en) * 2019-05-17 2020-11-19 Shin-Etsu Opto Electronic Co., Ltd. Light-emitting diode structure and method for forming the same
US11374381B1 (en) 2019-06-10 2022-06-28 Apple Inc. Integrated laser module
JP7056628B2 (ja) * 2019-06-28 2022-04-19 セイコーエプソン株式会社 発光装置およびプロジェクター
JP7623563B2 (ja) * 2020-07-27 2025-01-29 日亜化学工業株式会社 垂直共振器面発光レーザ素子
CN113410349B (zh) * 2021-04-30 2022-05-13 华灿光电(苏州）有限公司 具有双层布拉格反射镜的发光二极管芯片及其制备方法
CN113488568B (zh) * 2021-05-12 2022-06-14 华灿光电（浙江）有限公司 倒装发光二极管芯片及其制备方法
TWI859532B (zh) * 2022-04-26 2024-10-21 晶元光電股份有限公司 半導體元件
US12494618B2 (en) 2022-09-14 2025-12-09 Apple Inc. Vertical emitters with integrated final-stage transistor switch
CN116565093A (zh) * 2023-07-11 2023-08-08 江西兆驰半导体有限公司 一种led芯片制备方法及led芯片

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835415A (en) * 1972-06-28 1974-09-10 Ibm High radiance semiconductor laser
US5008889A (en) * 1989-11-06 1991-04-16 Wilson Keith E High-accuracy wavelength stabilization of angled-stripe super luminescent laser diode sources
JP3635880B2 (ja) * 1997-07-25 2005-04-06 セイコーエプソン株式会社 面発光型半導体レーザおよびその製造方法
JP3551718B2 (ja) * 1997-08-18 2004-08-11 富士ゼロックス株式会社 面発光型半導体レーザ
JPH11121864A (ja) * 1997-10-08 1999-04-30 Seiko Epson Corp 面発光レーザ及びその製造方法
JP4114236B2 (ja) 1998-07-08 2008-07-09 沖電気工業株式会社 半導体発光装置
JP2000277852A (ja) 1999-03-24 2000-10-06 Fuji Xerox Co Ltd 表面発光型半導体レーザ、及びその製造方法
JP2000299492A (ja) 1999-04-15 2000-10-24 Daido Steel Co Ltd 量子井戸型発光ダイオード
JP3837969B2 (ja) * 1999-07-06 2006-10-25 富士ゼロックス株式会社 面発光型半導体レーザとその製造方法
JP3547344B2 (ja) * 1999-08-24 2004-07-28 シャープ株式会社 半導体発光素子
JP2001223384A (ja) * 2000-02-08 2001-08-17 Toshiba Corp 半導体発光素子
JP2002270960A (ja) * 2001-03-06 2002-09-20 Toshiba Corp 垂直共振器型発光ダイオード及びその発光ダイオードを用いた光モジュール
JP2002289976A (ja) * 2001-03-23 2002-10-04 Ricoh Co Ltd 半導体構造およびその製造方法および半導体レーザ素子および半導体レーザアレイおよび光インターコネクションシステムおよび光ｌａｎシステム
US6608849B2 (en) * 2001-06-13 2003-08-19 Wisconsin Alumni Research Foundation Vertical-cavity surface-emitting semiconductor laser arrays
JP4207781B2 (ja) * 2002-01-28 2009-01-14 日亜化学工業株式会社 支持基板を有する窒化物半導体素子及びその製造方法
JP4366522B2 (ja) * 2002-11-29 2009-11-18 信越半導体株式会社 発光素子
JP2004193330A (ja) * 2002-12-11 2004-07-08 Sharp Corp モノリシック多波長レーザ素子とその製法
JP2004288674A (ja) * 2003-03-19 2004-10-14 Fuji Xerox Co Ltd 面発光型半導体レーザおよびそれを用いた光通信システム
TW200505120A (en) * 2003-07-29 2005-02-01 Copax Photonics Corp Single transverse mode vertical cavity surface emitting laser device with array structure and method for fabricating the same
KR20050019485A (ko) * 2003-08-19 2005-03-03 삼성전자주식회사 광검출소자가 일체적으로 형성되는 수직 면발광 레이저
JP4138629B2 (ja) * 2003-11-06 2008-08-27 株式会社東芝 面発光型半導体素子及びその製造方法
DE102004004781A1 (de) * 2004-01-30 2005-08-18 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement
US7889774B2 (en) * 2004-03-05 2011-02-15 The Trustees Of Princeton University Organic polariton laser
JP4899344B2 (ja) 2004-06-29 2012-03-21 富士ゼロックス株式会社 表面発光型半導体レーザおよびその製造方法
US7366220B2 (en) * 2005-03-17 2008-04-29 Fujitsu Limited Tunable laser
JP2007294732A (ja) * 2006-04-26 2007-11-08 Matsushita Electric Ind Co Ltd 半導体レーザ装置及びその製造方法
JP2008028120A (ja) * 2006-07-20 2008-02-07 Sumitomo Electric Ind Ltd 面発光型半導体素子
JP2008172002A (ja) * 2007-01-11 2008-07-24 Fuji Xerox Co Ltd 光送信モジュール
JP4878322B2 (ja) * 2007-03-29 2012-02-15 古河電気工業株式会社 面発光レーザ素子および面発光レーザ素子の製造方法
JP2009065086A (ja) * 2007-09-10 2009-03-26 Seiko Epson Corp 面発光型半導体レーザ、面発光型半導体レーザアレイ、および、レーザプリンタ
DE102008012859B4 (de) * 2007-12-21 2023-10-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserlichtquelle mit einer Filterstruktur
JP2009246291A (ja) * 2008-03-31 2009-10-22 Furukawa Electric Co Ltd:The 面発光レーザアレイ素子
KR101438818B1 (ko) * 2008-04-01 2014-09-05 엘지이노텍 주식회사 발광다이오드 소자
JP2010219287A (ja) * 2009-03-17 2010-09-30 Sony Corp 半導体発光素子およびその製造方法
JP5475398B2 (ja) * 2009-05-15 2014-04-16 日本オクラロ株式会社 半導体発光素子
JP2011165869A (ja) * 2010-02-09 2011-08-25 Mitsubishi Electric Corp 半導体発光素子及びその製造方法
KR20120131983A (ko) * 2011-05-27 2012-12-05 삼성전자주식회사 전류제한층을 구비한 반도체 발광 소자
JP6303255B2 (ja) * 2011-12-02 2018-04-04 株式会社リコー 面発光レーザ素子及び原子発振器
JP2013171892A (ja) 2012-02-20 2013-09-02 Ricoh Co Ltd 光学センサ及び画像形成装置
JP2015103727A (ja) * 2013-11-27 2015-06-04 株式会社村田製作所 垂直共振器型面発光レーザの製造方法
US20150255954A1 (en) * 2014-03-05 2015-09-10 The Board Of Trustees Of The University Of Illinois Method And Device For Producing Laser Emission

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US20180358780A1 (en) 2018-12-13
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