CN118451124A - 聚合性组合物、密封材料、图像显示装置和图像显示装置的制造方法 - Google Patents

聚合性组合物、密封材料、图像显示装置和图像显示装置的制造方法 Download PDF

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Publication number
CN118451124A
CN118451124A CN202380015731.0A CN202380015731A CN118451124A CN 118451124 A CN118451124 A CN 118451124A CN 202380015731 A CN202380015731 A CN 202380015731A CN 118451124 A CN118451124 A CN 118451124A
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CN
China
Prior art keywords
polymerizable composition
mass
tertiary amine
parts
image display
Prior art date
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Pending
Application number
CN202380015731.0A
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English (en)
Chinese (zh)
Inventor
馆野航太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN118451124A publication Critical patent/CN118451124A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
CN202380015731.0A 2022-02-08 2023-02-07 聚合性组合物、密封材料、图像显示装置和图像显示装置的制造方法 Pending CN118451124A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022017939 2022-02-08
JP2022-017939 2022-02-08
PCT/JP2023/003928 WO2023153387A1 (ja) 2022-02-08 2023-02-07 重合性組成物、封止材、画像表示装置および画像表示装置の製造方法

Publications (1)

Publication Number Publication Date
CN118451124A true CN118451124A (zh) 2024-08-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380015731.0A Pending CN118451124A (zh) 2022-02-08 2023-02-07 聚合性组合物、密封材料、图像显示装置和图像显示装置的制造方法

Country Status (5)

Country Link
JP (1) JPWO2023153387A1 (https=)
KR (1) KR20240107367A (https=)
CN (1) CN118451124A (https=)
TW (1) TW202344616A (https=)
WO (1) WO2023153387A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024204248A1 (ja) * 2023-03-29 2024-10-03 三井化学株式会社 硬化性組成物、封止剤、枠封止剤、表示パネル及びその製造方法
CN120858127A (zh) * 2023-03-29 2025-10-28 三井化学株式会社 固化性组合物、密封剂、框密封剂、显示面板及其制造方法
JP2025119211A (ja) * 2024-02-01 2025-08-14 味の素株式会社 樹脂組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4012426B2 (ja) * 2002-04-05 2007-11-21 理想科学工業株式会社 カチオン重合性組成物
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP4606907B2 (ja) * 2005-03-08 2011-01-05 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、平版印刷版の作製方法及び平版印刷版
JP4999393B2 (ja) * 2006-07-31 2012-08-15 旭化成ケミカルズ株式会社 カチオン系感光性組成物およびその硬化物
JP2009013315A (ja) * 2007-07-06 2009-01-22 Toyo Ink Mfg Co Ltd 封止用組成物
JP2009275080A (ja) * 2008-05-13 2009-11-26 Konica Minolta Ij Technologies Inc 活性エネルギー線硬化性組成物及びインクジェット用インク
JP2011080017A (ja) * 2009-10-09 2011-04-21 Denso Corp カチオン重合性組成物
TWI480308B (zh) * 2010-11-05 2015-04-11 Nippon Catalytic Chem Ind Cationic hardening resin composition
JP7228343B2 (ja) * 2017-10-06 2023-02-24 株式会社Adeka 組成物及び硬化性組成物
CN114008163A (zh) * 2019-07-05 2022-02-01 三井化学株式会社 有机el显示元件用密封剂及有机el显示装置
JP2021059640A (ja) * 2019-10-03 2021-04-15 昭和電工マテリアルズ株式会社 光硬化性樹脂組成物及び樹脂硬化物の形成方法
EP4081597B1 (en) * 2019-12-27 2023-10-11 Cytec Industries, Inc. Uv resistant surfacing materials for composite parts

Also Published As

Publication number Publication date
JPWO2023153387A1 (https=) 2023-08-17
KR20240107367A (ko) 2024-07-09
WO2023153387A1 (ja) 2023-08-17
TW202344616A (zh) 2023-11-16

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