JPWO2023153387A1 - - Google Patents

Info

Publication number
JPWO2023153387A1
JPWO2023153387A1 JP2023580256A JP2023580256A JPWO2023153387A1 JP WO2023153387 A1 JPWO2023153387 A1 JP WO2023153387A1 JP 2023580256 A JP2023580256 A JP 2023580256A JP 2023580256 A JP2023580256 A JP 2023580256A JP WO2023153387 A1 JPWO2023153387 A1 JP WO2023153387A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023580256A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023153387A1 publication Critical patent/JPWO2023153387A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
JP2023580256A 2022-02-08 2023-02-07 Pending JPWO2023153387A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022017939 2022-02-08
PCT/JP2023/003928 WO2023153387A1 (ja) 2022-02-08 2023-02-07 重合性組成物、封止材、画像表示装置および画像表示装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2023153387A1 true JPWO2023153387A1 (https=) 2023-08-17

Family

ID=87564414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023580256A Pending JPWO2023153387A1 (https=) 2022-02-08 2023-02-07

Country Status (5)

Country Link
JP (1) JPWO2023153387A1 (https=)
KR (1) KR20240107367A (https=)
CN (1) CN118451124A (https=)
TW (1) TW202344616A (https=)
WO (1) WO2023153387A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024204248A1 (ja) * 2023-03-29 2024-10-03 三井化学株式会社 硬化性組成物、封止剤、枠封止剤、表示パネル及びその製造方法
CN120858127A (zh) * 2023-03-29 2025-10-28 三井化学株式会社 固化性组合物、密封剂、框密封剂、显示面板及其制造方法
JP2025119211A (ja) * 2024-02-01 2025-08-14 味の素株式会社 樹脂組成物

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292606A (ja) * 2002-04-05 2003-10-15 Riso Kagaku Corp カチオン重合性組成物
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP2006249153A (ja) * 2005-03-08 2006-09-21 Fuji Photo Film Co Ltd インク組成物、インクジェット記録方法、印刷物、平版印刷版の作製方法及び平版印刷版
JP2008031324A (ja) * 2006-07-31 2008-02-14 Asahi Kasei Chemicals Corp カチオン系感光性組成物およびその硬化物
JP2009013315A (ja) * 2007-07-06 2009-01-22 Toyo Ink Mfg Co Ltd 封止用組成物
JP2009275080A (ja) * 2008-05-13 2009-11-26 Konica Minolta Ij Technologies Inc 活性エネルギー線硬化性組成物及びインクジェット用インク
JP2011080017A (ja) * 2009-10-09 2011-04-21 Denso Corp カチオン重合性組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2019070106A (ja) * 2017-10-06 2019-05-09 株式会社Adeka 組成物及び硬化性組成物
WO2021006070A1 (ja) * 2019-07-05 2021-01-14 三井化学株式会社 有機ｅｌ表示素子用封止剤および有機ｅｌ表示装置
JP2021059640A (ja) * 2019-10-03 2021-04-15 昭和電工マテリアルズ株式会社 光硬化性樹脂組成物及び樹脂硬化物の形成方法
WO2021133972A1 (en) * 2019-12-27 2021-07-01 Cytec Industries Inc. Uv resistant surfacing materials for composite parts

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292606A (ja) * 2002-04-05 2003-10-15 Riso Kagaku Corp カチオン重合性組成物
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP2006249153A (ja) * 2005-03-08 2006-09-21 Fuji Photo Film Co Ltd インク組成物、インクジェット記録方法、印刷物、平版印刷版の作製方法及び平版印刷版
JP2008031324A (ja) * 2006-07-31 2008-02-14 Asahi Kasei Chemicals Corp カチオン系感光性組成物およびその硬化物
JP2009013315A (ja) * 2007-07-06 2009-01-22 Toyo Ink Mfg Co Ltd 封止用組成物
JP2009275080A (ja) * 2008-05-13 2009-11-26 Konica Minolta Ij Technologies Inc 活性エネルギー線硬化性組成物及びインクジェット用インク
JP2011080017A (ja) * 2009-10-09 2011-04-21 Denso Corp カチオン重合性組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2019070106A (ja) * 2017-10-06 2019-05-09 株式会社Adeka 組成物及び硬化性組成物
WO2021006070A1 (ja) * 2019-07-05 2021-01-14 三井化学株式会社 有機ｅｌ表示素子用封止剤および有機ｅｌ表示装置
JP2021059640A (ja) * 2019-10-03 2021-04-15 昭和電工マテリアルズ株式会社 光硬化性樹脂組成物及び樹脂硬化物の形成方法
WO2021133972A1 (en) * 2019-12-27 2021-07-01 Cytec Industries Inc. Uv resistant surfacing materials for composite parts

Also Published As

Publication number Publication date
CN118451124A (zh) 2024-08-06
KR20240107367A (ko) 2024-07-09
WO2023153387A1 (ja) 2023-08-17
TW202344616A (zh) 2023-11-16

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