CN117837275A - 电子元件安装用基板、电子装置、以及电子模块 - Google Patents

电子元件安装用基板、电子装置、以及电子模块 Download PDF

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Publication number
CN117837275A
CN117837275A CN202280057383.9A CN202280057383A CN117837275A CN 117837275 A CN117837275 A CN 117837275A CN 202280057383 A CN202280057383 A CN 202280057383A CN 117837275 A CN117837275 A CN 117837275A
Authority
CN
China
Prior art keywords
component mounting
electronic component
frame portion
frame
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280057383.9A
Other languages
English (en)
Chinese (zh)
Inventor
小滨健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN117837275A publication Critical patent/CN117837275A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN202280057383.9A 2021-08-27 2022-08-17 电子元件安装用基板、电子装置、以及电子模块 Pending CN117837275A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021139371 2021-08-27
JP2021-139371 2021-08-27
PCT/JP2022/030999 WO2023026904A1 (ja) 2021-08-27 2022-08-17 電子素子実装用基板、電子装置および電子モジュール

Publications (1)

Publication Number Publication Date
CN117837275A true CN117837275A (zh) 2024-04-05

Family

ID=85321978

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280057383.9A Pending CN117837275A (zh) 2021-08-27 2022-08-17 电子元件安装用基板、电子装置、以及电子模块

Country Status (6)

Country Link
US (1) US20240355845A1 (https=)
EP (1) EP4395473A1 (https=)
JP (1) JP7652908B2 (https=)
KR (1) KR20240037326A (https=)
CN (1) CN117837275A (https=)
WO (1) WO2023026904A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63182570U (https=) * 1987-05-19 1988-11-24
JP3470852B2 (ja) * 1996-12-25 2003-11-25 日本特殊陶業株式会社 配線基板とその製造方法
JP2005203485A (ja) 2004-01-14 2005-07-28 Ngk Spark Plug Co Ltd 電子部品収納容器
JP2013120867A (ja) * 2011-12-08 2013-06-17 Seiko Epson Corp パッケージ、電子デバイス及び電子機器
CN105210183B (zh) 2014-04-23 2018-06-12 京瓷株式会社 电子元件安装用基板以及电子装置
JP6677595B2 (ja) * 2016-07-11 2020-04-08 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
JP2018019214A (ja) * 2016-07-27 2018-02-01 京セラ株式会社 水晶振動子
JP6818581B2 (ja) * 2017-02-20 2021-01-20 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP6955366B2 (ja) * 2017-04-25 2021-10-27 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
JP6625774B1 (ja) * 2019-02-20 2019-12-25 中央電子工業株式会社 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法

Also Published As

Publication number Publication date
KR20240037326A (ko) 2024-03-21
US20240355845A1 (en) 2024-10-24
JPWO2023026904A1 (https=) 2023-03-02
WO2023026904A1 (ja) 2023-03-02
JP7652908B2 (ja) 2025-03-27
EP4395473A1 (en) 2024-07-03

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