JP7652908B2 - 電子素子実装用基板、電子装置および電子モジュール - Google Patents

電子素子実装用基板、電子装置および電子モジュール Download PDF

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Publication number
JP7652908B2
JP7652908B2 JP2023543830A JP2023543830A JP7652908B2 JP 7652908 B2 JP7652908 B2 JP 7652908B2 JP 2023543830 A JP2023543830 A JP 2023543830A JP 2023543830 A JP2023543830 A JP 2023543830A JP 7652908 B2 JP7652908 B2 JP 7652908B2
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Japan
Prior art keywords
electronic device
frame
electronic
frame portion
device mounting
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JP2023543830A
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Japanese (ja)
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JPWO2023026904A1 (https=
JPWO2023026904A5 (https=
Inventor
健一 小濱
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Kyocera Corp
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Kyocera Corp
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Publication of JPWO2023026904A5 publication Critical patent/JPWO2023026904A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2023543830A 2021-08-27 2022-08-17 電子素子実装用基板、電子装置および電子モジュール Active JP7652908B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021139371 2021-08-27
JP2021139371 2021-08-27
PCT/JP2022/030999 WO2023026904A1 (ja) 2021-08-27 2022-08-17 電子素子実装用基板、電子装置および電子モジュール

Publications (3)

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JPWO2023026904A1 JPWO2023026904A1 (https=) 2023-03-02
JPWO2023026904A5 JPWO2023026904A5 (https=) 2024-05-21
JP7652908B2 true JP7652908B2 (ja) 2025-03-27

Family

ID=85321978

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JP2023543830A Active JP7652908B2 (ja) 2021-08-27 2022-08-17 電子素子実装用基板、電子装置および電子モジュール

Country Status (6)

Country Link
US (1) US20240355845A1 (https=)
EP (1) EP4395473A1 (https=)
JP (1) JP7652908B2 (https=)
KR (1) KR20240037326A (https=)
CN (1) CN117837275A (https=)
WO (1) WO2023026904A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013120867A (ja) 2011-12-08 2013-06-17 Seiko Epson Corp パッケージ、電子デバイス及び電子機器
WO2015163095A1 (ja) 2014-04-23 2015-10-29 京セラ株式会社 電子素子実装用基板および電子装置
JP2018010890A (ja) 2016-07-11 2018-01-18 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
JP2018019214A (ja) 2016-07-27 2018-02-01 京セラ株式会社 水晶振動子
JP2018137534A (ja) 2017-02-20 2018-08-30 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP2018186173A (ja) 2017-04-25 2018-11-22 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
JP2020136495A (ja) 2019-02-20 2020-08-31 中央電子工業株式会社 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63182570U (https=) * 1987-05-19 1988-11-24
JP3470852B2 (ja) * 1996-12-25 2003-11-25 日本特殊陶業株式会社 配線基板とその製造方法
JP2005203485A (ja) 2004-01-14 2005-07-28 Ngk Spark Plug Co Ltd 電子部品収納容器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013120867A (ja) 2011-12-08 2013-06-17 Seiko Epson Corp パッケージ、電子デバイス及び電子機器
WO2015163095A1 (ja) 2014-04-23 2015-10-29 京セラ株式会社 電子素子実装用基板および電子装置
JP2018010890A (ja) 2016-07-11 2018-01-18 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
JP2018019214A (ja) 2016-07-27 2018-02-01 京セラ株式会社 水晶振動子
JP2018137534A (ja) 2017-02-20 2018-08-30 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
JP2018186173A (ja) 2017-04-25 2018-11-22 京セラ株式会社 電子素子実装用基板、電子装置および電子モジュール
JP2020136495A (ja) 2019-02-20 2020-08-31 中央電子工業株式会社 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法

Also Published As

Publication number Publication date
KR20240037326A (ko) 2024-03-21
US20240355845A1 (en) 2024-10-24
JPWO2023026904A1 (https=) 2023-03-02
CN117837275A (zh) 2024-04-05
WO2023026904A1 (ja) 2023-03-02
EP4395473A1 (en) 2024-07-03

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