CN1174665C - 多层挠性布线板 - Google Patents
多层挠性布线板 Download PDFInfo
- Publication number
- CN1174665C CN1174665C CNB001313924A CN00131392A CN1174665C CN 1174665 C CN1174665 C CN 1174665C CN B001313924 A CNB001313924 A CN B001313924A CN 00131392 A CN00131392 A CN 00131392A CN 1174665 C CN1174665 C CN 1174665C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- wiring board
- flexible wiring
- bonding pad
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28101799A JP3205548B2 (ja) | 1999-10-01 | 1999-10-01 | 多層フレキシブル配線板 |
JP281017/1999 | 1999-10-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1291070A CN1291070A (zh) | 2001-04-11 |
CN1174665C true CN1174665C (zh) | 2004-11-03 |
Family
ID=17633136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001313924A Expired - Fee Related CN1174665C (zh) | 1999-10-01 | 2000-09-30 | 多层挠性布线板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6395993B1 (zh) |
JP (2) | JP3205548B2 (zh) |
KR (1) | KR100773288B1 (zh) |
CN (1) | CN1174665C (zh) |
TW (1) | TW499826B (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6840430B2 (en) * | 1998-07-30 | 2005-01-11 | Sony Chemicals, Corp. | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards |
US6596947B1 (en) * | 2000-01-28 | 2003-07-22 | Sony Chemicals Corp. | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards |
JP3250216B2 (ja) * | 1998-08-13 | 2002-01-28 | ソニーケミカル株式会社 | フレキシブルプリント配線板及びその製造方法 |
JP4045143B2 (ja) * | 2002-02-18 | 2008-02-13 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | 配線膜間接続用部材の製造方法及び多層配線基板の製造方法 |
US6881072B2 (en) * | 2002-10-01 | 2005-04-19 | International Business Machines Corporation | Membrane probe with anchored elements |
JP3879651B2 (ja) * | 2002-10-21 | 2007-02-14 | ソニー株式会社 | 積層配線基板、タッチパネル及びこれらの製造方法 |
KR101012239B1 (ko) * | 2002-11-27 | 2011-02-08 | 스미토모 베이클리트 컴퍼니 리미티드 | 회로 기판, 다층 배선판, 회로 기판의 제조 방법 및 다층배선판의 제조 방법 |
WO2004093508A1 (ja) * | 2003-04-18 | 2004-10-28 | Ibiden Co., Ltd. | フレックスリジッド配線板 |
US7220920B1 (en) | 2004-01-23 | 2007-05-22 | Hutchinson Technology Incorporated | Flexible electrical circuit with slotted coverlay |
JP4536430B2 (ja) | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
JP4345598B2 (ja) * | 2004-07-15 | 2009-10-14 | パナソニック株式会社 | 回路基板の接続構造体とその製造方法 |
JP4351129B2 (ja) * | 2004-09-01 | 2009-10-28 | 日東電工株式会社 | 配線回路基板 |
JP4646661B2 (ja) * | 2005-03-18 | 2011-03-09 | 株式会社リコー | プリント配線基板印刷方法と実装方法ならびにプログラム |
JP5105736B2 (ja) * | 2005-10-31 | 2012-12-26 | 株式会社東芝 | プリント回路板、電子機器、およびプリント回路板の製造方法 |
TWI298989B (en) | 2005-12-01 | 2008-07-11 | Au Optronics Corp | Circuit board module and forming ethod thereof |
NL1032636C2 (nl) * | 2006-10-06 | 2008-04-08 | Thales Nederland Bv | Een werkwijze voor het verbinden van printplaten en een meerlaagse printplaatsamenstelling. |
TWI320680B (en) * | 2007-03-07 | 2010-02-11 | Phoenix Prec Technology Corp | Circuit board structure and fabrication method thereof |
CN101312620B (zh) * | 2007-05-24 | 2011-06-22 | 巨擘科技股份有限公司 | 多层基板金属线路制造方法及其结构 |
US20110048786A1 (en) * | 2009-08-31 | 2011-03-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having a bump and a method of manufacturing the same |
WO2011146258A2 (en) * | 2010-05-20 | 2011-11-24 | 3M Innovative Properties Company | Flexible circuit coverfilm adhesion enhancement |
US9040837B2 (en) * | 2011-12-14 | 2015-05-26 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP2013183079A (ja) * | 2012-03-02 | 2013-09-12 | Sumitomo Wiring Syst Ltd | プリント回路板及びその製造方法 |
TWI514530B (zh) * | 2013-08-28 | 2015-12-21 | Via Tech Inc | 線路基板、半導體封裝結構及線路基板製程 |
JP2015159242A (ja) * | 2014-02-25 | 2015-09-03 | 京セラ株式会社 | 配線基板およびそれを備えた多層配線基板 |
TWI616121B (zh) * | 2014-06-26 | 2018-02-21 | 軟性電路板的溢膠導流結構 | |
JP6053190B2 (ja) * | 2014-09-30 | 2016-12-27 | 株式会社フジクラ | プリント配線板 |
KR20170083823A (ko) * | 2016-01-11 | 2017-07-19 | 에스케이하이닉스 주식회사 | 측면 범프 결합 구조를 갖는 반도체 패키지 |
JP2019121774A (ja) * | 2017-12-28 | 2019-07-22 | 株式会社フジクラ | 金属片付き配線基板および金属片付き配線基板の製造方法 |
WO2019138855A1 (ja) * | 2018-01-15 | 2019-07-18 | パイクリスタル株式会社 | フレキシブル基板、電子デバイス、電子デバイスの製造方法 |
JP2021082723A (ja) * | 2019-11-20 | 2021-05-27 | 昭和電工マテリアルズ株式会社 | 多層配線板の製造方法 |
WO2021108724A1 (en) * | 2019-11-26 | 2021-06-03 | Hsio Technologies, Llc | Stud bumped printed circuit assembly |
JP2021190193A (ja) * | 2020-05-26 | 2021-12-13 | 富士通株式会社 | バスバーの接続構造 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778530A (en) * | 1971-04-01 | 1973-12-11 | W Reimann | Flatpack lead positioning device |
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
JPS5931238B2 (ja) | 1975-12-17 | 1984-07-31 | 住友電気工業株式会社 | フレキシブルプリントカイロ |
JPS53149763A (en) * | 1977-06-01 | 1978-12-27 | Citizen Watch Co Ltd | Mounting method of semiconductor integrate circuit |
US5007163A (en) * | 1990-04-18 | 1991-04-16 | International Business Machines Corporation | Non-destructure method of performing electrical burn-in testing of semiconductor chips |
JPH0410696A (ja) | 1990-04-27 | 1992-01-14 | Nitto Denko Corp | 多層配線基板の製造方法 |
US5296649A (en) * | 1991-03-26 | 1994-03-22 | The Furukawa Electric Co., Ltd. | Solder-coated printed circuit board and method of manufacturing the same |
US5374469A (en) | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
JP3059556B2 (ja) | 1991-11-26 | 2000-07-04 | 日東電工株式会社 | 多層基板およびその製造方法 |
JP2817530B2 (ja) * | 1992-08-19 | 1998-10-30 | 日本電気株式会社 | ポリイミド多層配線基板の製造方法 |
US5342207A (en) * | 1992-12-14 | 1994-08-30 | Hughes Aircraft Company | Electrical interconnection method and apparatus utilizing raised connecting means |
JP2665134B2 (ja) * | 1993-09-03 | 1997-10-22 | 日本黒鉛工業株式会社 | フレキシブル回路基板及びその製造方法 |
US5468917A (en) * | 1994-03-23 | 1995-11-21 | International Business Machines Corporation | Circuitized structure including flexible circuit with elastomeric member bonded thereto |
JPH08111578A (ja) * | 1994-10-07 | 1996-04-30 | Nippon Avionics Co Ltd | ボールグリッドアレイパッケージ実装用基板の製造方法 |
JPH08213729A (ja) | 1995-01-31 | 1996-08-20 | Mitsumi Electric Co Ltd | フレキシブル配線板 |
US5776824A (en) * | 1995-12-22 | 1998-07-07 | Micron Technology, Inc. | Method for producing laminated film/metal structures for known good die ("KG") applications |
US6225569B1 (en) * | 1996-11-15 | 2001-05-01 | Ngk Spark Plug Co., Ltd. | Wiring substrate and method of manufacturing the same |
JP3559418B2 (ja) * | 1997-03-17 | 2004-09-02 | 株式会社東芝 | プリント回路基板を備えた磁気ヘッド組立体、およびこれを備えた磁気ディスク装置 |
JPH1117315A (ja) * | 1997-06-26 | 1999-01-22 | Nippon Mektron Ltd | 可撓性回路基板の製造法 |
JPH11274687A (ja) * | 1998-03-20 | 1999-10-08 | Sony Chem Corp | フレキシブルプリント配線板の製造方法 |
JP3195590B2 (ja) * | 1999-04-27 | 2001-08-06 | 日東電工株式会社 | フレキシブル配線板 |
-
1999
- 1999-10-01 JP JP28101799A patent/JP3205548B2/ja not_active Expired - Fee Related
-
2000
- 2000-05-22 JP JP2000150201A patent/JP3741593B2/ja not_active Expired - Fee Related
- 2000-09-28 US US09/671,260 patent/US6395993B1/en not_active Expired - Lifetime
- 2000-09-29 KR KR1020000057238A patent/KR100773288B1/ko not_active IP Right Cessation
- 2000-09-30 CN CNB001313924A patent/CN1174665C/zh not_active Expired - Fee Related
- 2000-10-11 TW TW089120527A patent/TW499826B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20010050732A (ko) | 2001-06-15 |
JP2001102734A (ja) | 2001-04-13 |
JP2001111227A (ja) | 2001-04-20 |
JP3205548B2 (ja) | 2001-09-04 |
KR100773288B1 (ko) | 2007-11-05 |
JP3741593B2 (ja) | 2006-02-01 |
TW499826B (en) | 2002-08-21 |
CN1291070A (zh) | 2001-04-11 |
US6395993B1 (en) | 2002-05-28 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NANKAI UNIVERSITY Free format text: FORMER OWNER: + Effective date: 20130329 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: + Free format text: FORMER NAME: SONY CHEMICALS CORPORATION |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: SONY CHEMICAL & INFORMATION DEVICE Corp. Address before: Tokyo, Japan Patentee before: Sony Chemicals Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20130329 Address after: Tokyo, Japan Patentee after: Sony Corp. Address before: Tokyo, Japan Patentee before: SONY CHEMICAL & INFORMATION DEVICE Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041103 Termination date: 20150930 |
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EXPY | Termination of patent right or utility model |