CN116601229A - 具有耐水性的粘接性聚有机硅氧烷组合物 - Google Patents

具有耐水性的粘接性聚有机硅氧烷组合物 Download PDF

Info

Publication number
CN116601229A
CN116601229A CN202180086288.7A CN202180086288A CN116601229A CN 116601229 A CN116601229 A CN 116601229A CN 202180086288 A CN202180086288 A CN 202180086288A CN 116601229 A CN116601229 A CN 116601229A
Authority
CN
China
Prior art keywords
group
curable
composition
component
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180086288.7A
Other languages
English (en)
Chinese (zh)
Inventor
高梨正则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Momentive Performance Materials Japan LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Momentive Performance Materials Japan LLC filed Critical Momentive Performance Materials Japan LLC
Publication of CN116601229A publication Critical patent/CN116601229A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202180086288.7A 2020-12-21 2021-12-21 具有耐水性的粘接性聚有机硅氧烷组合物 Pending CN116601229A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020211566 2020-12-21
JP2020-211566 2020-12-21
PCT/JP2021/047284 WO2022138627A1 (ja) 2020-12-21 2021-12-21 耐水性を有する接着性ポリオルガノシロキサン組成物

Publications (1)

Publication Number Publication Date
CN116601229A true CN116601229A (zh) 2023-08-15

Family

ID=82159381

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180086288.7A Pending CN116601229A (zh) 2020-12-21 2021-12-21 具有耐水性的粘接性聚有机硅氧烷组合物

Country Status (7)

Country Link
US (1) US20240052140A1 (https=)
EP (1) EP4265688A4 (https=)
JP (1) JP7626312B2 (https=)
KR (1) KR20230122088A (https=)
CN (1) CN116601229A (https=)
TW (1) TWI904309B (https=)
WO (1) WO2022138627A1 (https=)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3824071B2 (ja) 2001-12-25 2006-09-20 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP2003221506A (ja) 2002-01-31 2003-08-08 Dow Corning Toray Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP3900267B2 (ja) 2002-05-09 2007-04-04 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP5105308B2 (ja) * 2008-06-04 2012-12-26 信越化学工業株式会社 低温加熱時における硬化速度を促進した熱伝導性シリコーン組成物
JP2010013521A (ja) * 2008-07-02 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物
JP5574532B2 (ja) * 2009-10-08 2014-08-20 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
JP5434795B2 (ja) 2010-05-25 2014-03-05 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5843368B2 (ja) * 2013-05-07 2016-01-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP2015067647A (ja) 2013-09-27 2015-04-13 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
CN103881393A (zh) * 2014-03-20 2014-06-25 东莞优邦材料科技有限公司 双组分加成型有机聚硅氧烷组合物及其制备方法及应用
JP6264307B2 (ja) * 2015-02-19 2018-01-24 信越化学工業株式会社 付加硬化型シリコーン組成物
JP2016199687A (ja) 2015-04-10 2016-12-01 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
WO2018079215A1 (ja) * 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 １液硬化型熱伝導性シリコーングリース組成物及び電子・電装部品
WO2019021826A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
KR102625362B1 (ko) * 2017-07-24 2024-01-18 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
JP6945934B2 (ja) 2018-03-01 2021-10-06 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 接着性ポリオルガノシロキサン組成物
WO2020203299A1 (ja) * 2019-03-29 2020-10-08 ダウ・東レ株式会社 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
JP7444856B2 (ja) * 2019-03-29 2024-03-06 ダウ・東レ株式会社 多成分型硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
JPWO2020213306A1 (https=) * 2019-04-15 2020-10-22

Also Published As

Publication number Publication date
JPWO2022138627A1 (https=) 2022-06-30
TWI904309B (zh) 2025-11-11
EP4265688A1 (en) 2023-10-25
KR20230122088A (ko) 2023-08-22
WO2022138627A1 (ja) 2022-06-30
US20240052140A1 (en) 2024-02-15
JP7626312B2 (ja) 2025-02-07
TW202239872A (zh) 2022-10-16
EP4265688A4 (en) 2024-12-11

Similar Documents

Publication Publication Date Title
TWI720245B (zh) 硬化性有機聚矽氧烷組成物及電氣電子零件的保護劑或接著劑組成物
JP6472094B2 (ja) 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
CN104662100B (zh) 光半导体元件密封用有机硅组合物以及光半导体装置
JP5002075B2 (ja) 硬化性ポリオルガノシロキサン組成物
CN106459492B (zh) 粘合促进剂、含有该粘合促进剂的固化性聚有机硅氧烷组合物
KR101802736B1 (ko) 가교결합성 실리콘 조성물 및 그의 가교결합 생성물
CN104870568A (zh) 固化性聚有机硅氧烷组合物
JP7444857B2 (ja) 室温硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
JP4680274B2 (ja) 高硬度シリコーンゴムを与える組成物およびそれを封止材として用いた半導体装置
CN114144477B (zh) 可固化有机聚硅氧烷组合物、固化产物和电气/电子设备
KR20210091754A (ko) 접착성 폴리오르가노실록산 조성물
TWI893161B (zh) 抗硫化被覆材料、抗硫化被覆材料的硬化物及電子器件
JP2015199851A (ja) 電気・電子部品の保護剤または接着剤組成物
CN116601229A (zh) 具有耐水性的粘接性聚有机硅氧烷组合物
TWI838442B (zh) 接著性聚有機矽氧烷組成物
JP2023037984A (ja) 付加型シリコーン組成物
CN114630879A (zh) 聚苯硫醚树脂粘接用聚有机硅氧烷组合物
TW202449071A (zh) 用於較低溫黏著之矽氧烷組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination