CN116458021A - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN116458021A
CN116458021A CN202180075683.5A CN202180075683A CN116458021A CN 116458021 A CN116458021 A CN 116458021A CN 202180075683 A CN202180075683 A CN 202180075683A CN 116458021 A CN116458021 A CN 116458021A
Authority
CN
China
Prior art keywords
light
substrate
semiconductor light
transmitting
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180075683.5A
Other languages
English (en)
Chinese (zh)
Inventor
坂本晃辉
富士和则
山口敦司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN116458021A publication Critical patent/CN116458021A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Led Device Packages (AREA)
CN202180075683.5A 2020-11-13 2021-10-27 半导体发光装置 Pending CN116458021A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-189361 2020-11-13
JP2020189361 2020-11-13
PCT/JP2021/039707 WO2022102411A1 (ja) 2020-11-13 2021-10-27 半導体発光装置

Publications (1)

Publication Number Publication Date
CN116458021A true CN116458021A (zh) 2023-07-18

Family

ID=81601050

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180075683.5A Pending CN116458021A (zh) 2020-11-13 2021-10-27 半导体发光装置

Country Status (5)

Country Link
US (1) US20230420909A1 (https=)
JP (1) JPWO2022102411A1 (https=)
CN (1) CN116458021A (https=)
DE (1) DE112021005241B4 (https=)
WO (1) WO2022102411A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023229021A1 (https=) * 2022-05-27 2023-11-30
JPWO2025028177A1 (https=) * 2023-07-28 2025-02-06
JPWO2025028178A1 (https=) * 2023-07-28 2025-02-06

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276679A (ja) * 1991-03-05 1992-10-01 Rohm Co Ltd レーザダイオード
JPH0685116A (ja) * 1992-08-31 1994-03-25 Kyocera Corp 電子部品用ポッティング材及びそれを用いた電子部品
JP2002368323A (ja) * 2001-06-06 2002-12-20 Matsushita Electric Ind Co Ltd 半導体レーザ装置
US20040017978A1 (en) * 2002-07-25 2004-01-29 Yoshiki Kuhara Optical module
CN101315911A (zh) * 2007-05-30 2008-12-03 恩益禧电子股份有限公司 半导体装置
JP2017208421A (ja) * 2016-05-17 2017-11-24 ローム株式会社 半導体装置
JP2020092150A (ja) * 2018-12-04 2020-06-11 スタンレー電気株式会社 半導体発光装置及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226052A (en) * 1990-05-08 1993-07-06 Rohm, Ltd. Laser diode system for cutting off the environment from the laser diode
JP3637228B2 (ja) * 1999-02-09 2005-04-13 住友電気工業株式会社 光送受信モジュール
JP4134499B2 (ja) 2000-08-07 2008-08-20 住友電気工業株式会社 光学装置
JP3921940B2 (ja) * 2000-12-07 2007-05-30 住友電気工業株式会社 光送受信モジュール
US6847053B2 (en) * 2001-02-05 2005-01-25 Sumitomo Electric Industries, Ltd. Optical transmitter
JP3890999B2 (ja) * 2002-02-14 2007-03-07 住友電気工業株式会社 光送信モジュール
JP2004119493A (ja) * 2002-09-24 2004-04-15 Sumitomo Electric Ind Ltd 光モジュール
JP4180537B2 (ja) 2003-10-31 2008-11-12 シャープ株式会社 光学素子の封止構造体および光結合器ならびに光学素子の封止方法
JP2005332983A (ja) * 2004-05-20 2005-12-02 Citizen Electronics Co Ltd 光半導体パッケージ及びその製造方法
JP4717598B2 (ja) * 2004-12-16 2011-07-06 キヤノン株式会社 レーザー回路基板
JP5262118B2 (ja) 2008-01-10 2013-08-14 日立電線株式会社 光モジュールの製造方法
JP5272999B2 (ja) * 2009-09-30 2013-08-28 凸版印刷株式会社 光基板の製造方法
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
WO2013130580A2 (en) 2012-03-02 2013-09-06 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
WO2015033633A1 (ja) 2013-09-03 2015-03-12 株式会社村田製作所 垂直共振面発光レーザ素子、それを備えた半導体ウエハおよび発光モジュール、ならびに垂直共振面発光レーザ素子の製造方法
DE102015114292A1 (de) 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
US20180278011A1 (en) * 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module
JP6652111B2 (ja) * 2017-07-18 2020-02-19 トヨタ自動車株式会社 太陽電池の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276679A (ja) * 1991-03-05 1992-10-01 Rohm Co Ltd レーザダイオード
JPH0685116A (ja) * 1992-08-31 1994-03-25 Kyocera Corp 電子部品用ポッティング材及びそれを用いた電子部品
JP2002368323A (ja) * 2001-06-06 2002-12-20 Matsushita Electric Ind Co Ltd 半導体レーザ装置
US20040017978A1 (en) * 2002-07-25 2004-01-29 Yoshiki Kuhara Optical module
CN101315911A (zh) * 2007-05-30 2008-12-03 恩益禧电子股份有限公司 半导体装置
JP2017208421A (ja) * 2016-05-17 2017-11-24 ローム株式会社 半導体装置
JP2020092150A (ja) * 2018-12-04 2020-06-11 スタンレー電気株式会社 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
US20230420909A1 (en) 2023-12-28
JPWO2022102411A1 (https=) 2022-05-19
WO2022102411A1 (ja) 2022-05-19
DE112021005241T5 (de) 2023-09-07
DE112021005241B4 (de) 2024-05-08

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