JPWO2022102411A1 - - Google Patents

Info

Publication number
JPWO2022102411A1
JPWO2022102411A1 JP2022561379A JP2022561379A JPWO2022102411A1 JP WO2022102411 A1 JPWO2022102411 A1 JP WO2022102411A1 JP 2022561379 A JP2022561379 A JP 2022561379A JP 2022561379 A JP2022561379 A JP 2022561379A JP WO2022102411 A1 JPWO2022102411 A1 JP WO2022102411A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2022561379A
Other languages
Japanese (ja)
Other versions
JPWO2022102411A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022102411A1 publication Critical patent/JPWO2022102411A1/ja
Publication of JPWO2022102411A5 publication Critical patent/JPWO2022102411A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Led Device Packages (AREA)
JP2022561379A 2020-11-13 2021-10-27 Ceased JPWO2022102411A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020189361 2020-11-13
PCT/JP2021/039707 WO2022102411A1 (ja) 2020-11-13 2021-10-27 半導体発光装置

Publications (2)

Publication Number Publication Date
JPWO2022102411A1 true JPWO2022102411A1 (https=) 2022-05-19
JPWO2022102411A5 JPWO2022102411A5 (https=) 2024-01-11

Family

ID=81601050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022561379A Ceased JPWO2022102411A1 (https=) 2020-11-13 2021-10-27

Country Status (5)

Country Link
US (1) US20230420909A1 (https=)
JP (1) JPWO2022102411A1 (https=)
CN (1) CN116458021A (https=)
DE (1) DE112021005241B4 (https=)
WO (1) WO2022102411A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023229021A1 (https=) * 2022-05-27 2023-11-30
JPWO2025028177A1 (https=) * 2023-07-28 2025-02-06
JPWO2025028178A1 (https=) * 2023-07-28 2025-02-06

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000228555A (ja) * 1999-02-09 2000-08-15 Sumitomo Electric Ind Ltd 光送受信モジュール
JP2002048951A (ja) * 2000-08-07 2002-02-15 Sumitomo Electric Ind Ltd 光学装置
JP2002176185A (ja) * 2000-12-07 2002-06-21 Sumitomo Electric Ind Ltd 光送受信モジュール
WO2002063730A1 (fr) * 2001-02-05 2002-08-15 Sumitomo Electric Industries, Ltd. Emetteur optique
JP2004063580A (ja) * 2002-07-25 2004-02-26 Sumitomo Electric Ind Ltd 光モジュール
JP2004119493A (ja) * 2002-09-24 2004-04-15 Sumitomo Electric Ind Ltd 光モジュール
JP2005332983A (ja) * 2004-05-20 2005-12-02 Citizen Electronics Co Ltd 光半導体パッケージ及びその製造方法
JP2011075811A (ja) * 2009-09-30 2011-04-14 Toppan Printing Co Ltd 光基板の製造方法
US20180278011A1 (en) * 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226052A (en) * 1990-05-08 1993-07-06 Rohm, Ltd. Laser diode system for cutting off the environment from the laser diode
JP2542747B2 (ja) * 1991-03-05 1996-10-09 ローム株式会社 レ―ザダイオ―ド
JPH0685116A (ja) * 1992-08-31 1994-03-25 Kyocera Corp 電子部品用ポッティング材及びそれを用いた電子部品
JP3607220B2 (ja) * 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3890999B2 (ja) * 2002-02-14 2007-03-07 住友電気工業株式会社 光送信モジュール
JP4180537B2 (ja) 2003-10-31 2008-11-12 シャープ株式会社 光学素子の封止構造体および光結合器ならびに光学素子の封止方法
JP4717598B2 (ja) * 2004-12-16 2011-07-06 キヤノン株式会社 レーザー回路基板
JP2008300554A (ja) * 2007-05-30 2008-12-11 Nec Electronics Corp 半導体装置
JP5262118B2 (ja) 2008-01-10 2013-08-14 日立電線株式会社 光モジュールの製造方法
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
WO2013130580A2 (en) 2012-03-02 2013-09-06 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
WO2015033633A1 (ja) 2013-09-03 2015-03-12 株式会社村田製作所 垂直共振面発光レーザ素子、それを備えた半導体ウエハおよび発光モジュール、ならびに垂直共振面発光レーザ素子の製造方法
DE102015114292A1 (de) 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
JP2017208421A (ja) * 2016-05-17 2017-11-24 ローム株式会社 半導体装置
JP6652111B2 (ja) * 2017-07-18 2020-02-19 トヨタ自動車株式会社 太陽電池の製造方法
JP7211784B2 (ja) * 2018-12-04 2023-01-24 スタンレー電気株式会社 半導体発光装置及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000228555A (ja) * 1999-02-09 2000-08-15 Sumitomo Electric Ind Ltd 光送受信モジュール
JP2002048951A (ja) * 2000-08-07 2002-02-15 Sumitomo Electric Ind Ltd 光学装置
JP2002176185A (ja) * 2000-12-07 2002-06-21 Sumitomo Electric Ind Ltd 光送受信モジュール
WO2002063730A1 (fr) * 2001-02-05 2002-08-15 Sumitomo Electric Industries, Ltd. Emetteur optique
JP2004063580A (ja) * 2002-07-25 2004-02-26 Sumitomo Electric Ind Ltd 光モジュール
JP2004119493A (ja) * 2002-09-24 2004-04-15 Sumitomo Electric Ind Ltd 光モジュール
JP2005332983A (ja) * 2004-05-20 2005-12-02 Citizen Electronics Co Ltd 光半導体パッケージ及びその製造方法
JP2011075811A (ja) * 2009-09-30 2011-04-14 Toppan Printing Co Ltd 光基板の製造方法
US20180278011A1 (en) * 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module

Also Published As

Publication number Publication date
US20230420909A1 (en) 2023-12-28
CN116458021A (zh) 2023-07-18
WO2022102411A1 (ja) 2022-05-19
DE112021005241T5 (de) 2023-09-07
DE112021005241B4 (de) 2024-05-08

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