DE112021005241B4 - Lichtemittierende halbleitervorrichtung - Google Patents

Lichtemittierende halbleitervorrichtung Download PDF

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Publication number
DE112021005241B4
DE112021005241B4 DE112021005241.1T DE112021005241T DE112021005241B4 DE 112021005241 B4 DE112021005241 B4 DE 112021005241B4 DE 112021005241 T DE112021005241 T DE 112021005241T DE 112021005241 B4 DE112021005241 B4 DE 112021005241B4
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DE
Germany
Prior art keywords
substrate
transparent
semiconductor light
main surface
emitting
Prior art date
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Application number
DE112021005241.1T
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German (de)
English (en)
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DE112021005241T5 (de
Inventor
Koki SAKAMOTO
Kazunori Fuji
Atsushi Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Publication of DE112021005241T5 publication Critical patent/DE112021005241T5/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Led Device Packages (AREA)
DE112021005241.1T 2020-11-13 2021-10-27 Lichtemittierende halbleitervorrichtung Active DE112021005241B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-189361 2020-11-13
JP2020189361 2020-11-13
PCT/JP2021/039707 WO2022102411A1 (ja) 2020-11-13 2021-10-27 半導体発光装置

Publications (2)

Publication Number Publication Date
DE112021005241T5 DE112021005241T5 (de) 2023-09-07
DE112021005241B4 true DE112021005241B4 (de) 2024-05-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021005241.1T Active DE112021005241B4 (de) 2020-11-13 2021-10-27 Lichtemittierende halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20230420909A1 (https=)
JP (1) JPWO2022102411A1 (https=)
CN (1) CN116458021A (https=)
DE (1) DE112021005241B4 (https=)
WO (1) WO2022102411A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023229021A1 (https=) * 2022-05-27 2023-11-30
JPWO2025028177A1 (https=) * 2023-07-28 2025-02-06
JPWO2025028178A1 (https=) * 2023-07-28 2025-02-06

Citations (6)

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Publication number Priority date Publication date Assignee Title
US20020037143A1 (en) 2000-08-07 2002-03-28 Yoshiki Kuhara Optical communication device
US20070114547A1 (en) 2003-10-31 2007-05-24 Sharp Kabushiki Kaisha Optical element sealing structure, optical coupler, and optical element sealing method
US20090180732A1 (en) 2008-01-10 2009-07-16 Toshiaki Takai Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module
WO2015033633A1 (ja) 2013-09-03 2015-03-12 株式会社村田製作所 垂直共振面発光レーザ素子、それを備えた半導体ウエハおよび発光モジュール、ならびに垂直共振面発光レーザ素子の製造方法
JP2015510277A (ja) 2012-03-02 2015-04-02 エクセリタス カナダ，インコーポレイテッド 基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法
JP6689363B2 (ja) 2015-08-27 2020-04-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ レーザ部品およびその製造方法

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US5226052A (en) * 1990-05-08 1993-07-06 Rohm, Ltd. Laser diode system for cutting off the environment from the laser diode
JP2542747B2 (ja) * 1991-03-05 1996-10-09 ローム株式会社 レ―ザダイオ―ド
JPH0685116A (ja) * 1992-08-31 1994-03-25 Kyocera Corp 電子部品用ポッティング材及びそれを用いた電子部品
JP3637228B2 (ja) * 1999-02-09 2005-04-13 住友電気工業株式会社 光送受信モジュール
JP3921940B2 (ja) * 2000-12-07 2007-05-30 住友電気工業株式会社 光送受信モジュール
US6847053B2 (en) * 2001-02-05 2005-01-25 Sumitomo Electric Industries, Ltd. Optical transmitter
JP3607220B2 (ja) * 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3890999B2 (ja) * 2002-02-14 2007-03-07 住友電気工業株式会社 光送信モジュール
JP4352661B2 (ja) * 2002-07-25 2009-10-28 住友電気工業株式会社 光モジュール
JP2004119493A (ja) * 2002-09-24 2004-04-15 Sumitomo Electric Ind Ltd 光モジュール
JP2005332983A (ja) * 2004-05-20 2005-12-02 Citizen Electronics Co Ltd 光半導体パッケージ及びその製造方法
JP4717598B2 (ja) * 2004-12-16 2011-07-06 キヤノン株式会社 レーザー回路基板
JP2008300554A (ja) * 2007-05-30 2008-12-11 Nec Electronics Corp 半導体装置
JP5272999B2 (ja) * 2009-09-30 2013-08-28 凸版印刷株式会社 光基板の製造方法
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2017208421A (ja) * 2016-05-17 2017-11-24 ローム株式会社 半導体装置
US20180278011A1 (en) * 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module
JP6652111B2 (ja) * 2017-07-18 2020-02-19 トヨタ自動車株式会社 太陽電池の製造方法
JP7211784B2 (ja) * 2018-12-04 2023-01-24 スタンレー電気株式会社 半導体発光装置及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020037143A1 (en) 2000-08-07 2002-03-28 Yoshiki Kuhara Optical communication device
US20070114547A1 (en) 2003-10-31 2007-05-24 Sharp Kabushiki Kaisha Optical element sealing structure, optical coupler, and optical element sealing method
US20090180732A1 (en) 2008-01-10 2009-07-16 Toshiaki Takai Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module
JP2015510277A (ja) 2012-03-02 2015-04-02 エクセリタス カナダ，インコーポレイテッド 基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法
WO2015033633A1 (ja) 2013-09-03 2015-03-12 株式会社村田製作所 垂直共振面発光レーザ素子、それを備えた半導体ウエハおよび発光モジュール、ならびに垂直共振面発光レーザ素子の製造方法
JP6689363B2 (ja) 2015-08-27 2020-04-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ レーザ部品およびその製造方法

Also Published As

Publication number Publication date
US20230420909A1 (en) 2023-12-28
CN116458021A (zh) 2023-07-18
JPWO2022102411A1 (https=) 2022-05-19
WO2022102411A1 (ja) 2022-05-19
DE112021005241T5 (de) 2023-09-07

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