CN116457944A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN116457944A
CN116457944A CN202280007099.0A CN202280007099A CN116457944A CN 116457944 A CN116457944 A CN 116457944A CN 202280007099 A CN202280007099 A CN 202280007099A CN 116457944 A CN116457944 A CN 116457944A
Authority
CN
China
Prior art keywords
gate
wiring
semiconductor device
polysilicon
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280007099.0A
Other languages
English (en)
Chinese (zh)
Inventor
唐本祐树
三塚要
伊仓巧裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN116457944A publication Critical patent/CN116457944A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/115Resistive field plates, e.g. semi-insulating field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/422PN diodes having the PN junctions in mesas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts

Landscapes

  • Electrodes Of Semiconductors (AREA)
CN202280007099.0A 2021-05-24 2022-03-30 半导体装置 Pending CN116457944A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021087222 2021-05-24
JP2021-087222 2021-05-24
PCT/JP2022/016190 WO2022249753A1 (ja) 2021-05-24 2022-03-30 半導体装置

Publications (1)

Publication Number Publication Date
CN116457944A true CN116457944A (zh) 2023-07-18

Family

ID=84228642

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280007099.0A Pending CN116457944A (zh) 2021-05-24 2022-03-30 半导体装置

Country Status (5)

Country Link
US (1) US20230261096A1 (https=)
JP (1) JP7613576B2 (https=)
CN (1) CN116457944A (https=)
DE (1) DE112022000136T5 (https=)
WO (1) WO2022249753A1 (https=)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221230A (ja) * 2003-01-14 2004-08-05 Toyota Industries Corp トレンチ構造を有する半導体装置
US8502314B2 (en) * 2011-04-21 2013-08-06 Fairchild Semiconductor Corporation Multi-level options for power MOSFETS
US8872278B2 (en) * 2011-10-25 2014-10-28 Fairchild Semiconductor Corporation Integrated gate runner and field implant termination for trench devices
JP6115050B2 (ja) 2012-09-10 2017-04-19 トヨタ自動車株式会社 半導体装置
JP5935948B2 (ja) * 2013-08-06 2016-06-15 富士電機株式会社 トレンチゲートmos型半導体装置およびその製造方法
JP2017013524A (ja) 2015-06-26 2017-01-19 ヤマハ発動機株式会社 電動補助自転車
JP6686398B2 (ja) * 2015-12-03 2020-04-22 富士電機株式会社 半導体装置
JP6676947B2 (ja) * 2015-12-14 2020-04-08 富士電機株式会社 半導体装置
CN107086217B (zh) * 2016-02-16 2023-05-16 富士电机株式会社 半导体装置
US10522674B2 (en) * 2016-05-18 2019-12-31 Rohm Co., Ltd. Semiconductor with unified transistor structure and voltage regulator diode
US10692863B2 (en) * 2016-09-30 2020-06-23 Rohm Co., Ltd. Semiconductor device and semiconductor package
CN109314134B (zh) * 2016-12-16 2021-11-05 富士电机株式会社 半导体装置及制造方法
US11532737B2 (en) * 2017-03-15 2022-12-20 Fuji Electric Co., Ltd. Semiconductor device
JP7087280B2 (ja) 2017-05-31 2022-06-21 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
US10600897B2 (en) * 2017-11-08 2020-03-24 Fuji Electric Co., Ltd. Semiconductor device
CN111052393B (zh) 2018-02-14 2023-11-14 富士电机株式会社 半导体装置
CN110323273B (zh) * 2018-03-30 2025-02-25 富士电机株式会社 半导体装置、半导体封装、半导体模块及半导体电路装置

Also Published As

Publication number Publication date
JPWO2022249753A1 (https=) 2022-12-01
JP7613576B2 (ja) 2025-01-15
WO2022249753A1 (ja) 2022-12-01
US20230261096A1 (en) 2023-08-17
DE112022000136T5 (de) 2023-06-15

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