JP6676947B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6676947B2 JP6676947B2 JP2015243077A JP2015243077A JP6676947B2 JP 6676947 B2 JP6676947 B2 JP 6676947B2 JP 2015243077 A JP2015243077 A JP 2015243077A JP 2015243077 A JP2015243077 A JP 2015243077A JP 6676947 B2 JP6676947 B2 JP 6676947B2
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- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
- H01L27/0664—Vertical bipolar transistor in combination with diodes
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- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
[先行技術文献]
[特許文献]
[特許文献1] 特開2015−138789号公報
[特許文献2] 特開2012−190938号公報
次に、半導体基板40の表面に所定のパターンのエッチングマスクを設け、ゲートトレンチ部10、ダミートレンチ部20およびエミッタトレンチ部30の溝部を形成する。
Claims (12)
- 半導体基板のおもて面側に設けられ、内部に設けられた電極にエミッタ電位が与えられる複数のダミートレンチ部と、
前記半導体基板のおもて面側において前記複数のダミートレンチ部のうち2以上のダミートレンチ部に囲まれて設けられ、内部に設けられた電極にゲート電位が与えられるゲートトレンチ部と
前記ゲートトレンチ部の少なくとも一部が直下の領域に配置され、前記エミッタ電位が与えられるエミッタ電極と、
少なくとも一部が前記エミッタ電極の下に設けられ、前記ゲートトレンチ部の内部に設けられた電極が電気的に接続するゲートランナーと
を備え、
前記ゲートランナーは、前記エミッタ電極の直下の領域から外周方向に延伸し、
前記ゲートトレンチ部と前記ダミートレンチ部とは、前記ゲートランナーの延伸方向において交互に設けられる
半導体装置。 - 前記ゲートトレンチ部は、前記ゲートランナーの延伸方向に伸びるゲート直線部を有し、
前記ダミートレンチ部は、前記ゲートランナーの延伸方向に直交する方向に伸びるダミー直線部を有する
請求項1に記載の半導体装置。 - 半導体基板のおもて面側に設けられ、内部に設けられた電極にエミッタ電位が与えられる複数のダミートレンチ部と、
前記半導体基板のおもて面側において前記複数のダミートレンチ部のうち2以上のダミートレンチ部に囲まれて設けられ、内部に設けられた電極にゲート電位が与えられるゲートトレンチ部と
前記ゲートトレンチ部の少なくとも一部が直下の領域に配置され、前記エミッタ電位が与えられるエミッタ電極と、
少なくとも一部が前記エミッタ電極の下に設けられ、前記ゲートトレンチ部の内部に設けられた電極が電気的に接続するゲートランナーと
を備え、
前記ゲートランナーは、前記エミッタ電極の直下の領域から外周方向に延伸し、
前記ゲートトレンチ部は、
前記ゲートランナーの延伸方向に伸びる第1のゲート直線部と、
前記ゲートランナーの延伸方向に直交する方向に伸びる第2のゲート直線部と
を有し、
前記ダミートレンチ部は、
前記ゲートランナーの延伸方向に伸びる第1のダミー直線部と、
前記ゲートランナーの延伸方向に直交する方向に伸びる第2のダミー直線部と
を有する
半導体装置。 - 前記ダミートレンチ部の内部に設けられた電極と前記エミッタ電極とを電気的に接続するためのコンタクト部をさらに備え、
前記コンタクト部は、前記ダミートレンチ部上のうち、前記ゲートランナー上以外の位置に設けられる
請求項2または3に記載の半導体装置。 - 前記ダミートレンチ部の内部に設けられた電極と前記エミッタ電極とを電気的に接続するためのコンタクト部をさらに備え、
前記コンタクト部は、前記ゲートランナーの延伸方向に直交する方向において前記ダミー直線部の端部上に設けられる
請求項2に記載の半導体装置。 - 前記ダミートレンチ部の内部に設けられた電極と前記エミッタ電極とを電気的に接続するためのコンタクト部をさらに備え、
前記コンタクト部は、前記ゲートランナーの延伸方向に直交する方向において前記第2のダミー直線部の端部上に設けられる
請求項3に記載の半導体装置。 - 半導体基板のおもて面側に設けられ、内部に設けられた電極にエミッタ電位が与えられる複数のダミートレンチ部と、
前記半導体基板のおもて面側において前記複数のダミートレンチ部のうち2以上のダミートレンチ部に囲まれて設けられ、内部に設けられた電極にゲート電位が与えられるゲートトレンチ部と
を備え、
前記ゲートトレンチ部と前記ダミートレンチ部とは、最近接距離がトレンチ絶縁膜の厚さ以上、ゲートトレンチ部の短手方向の幅以下である領域を有する
半導体装置。 - 半導体基板のおもて面側に設けられ、内部に設けられた電極にエミッタ電位が与えられる複数のダミートレンチ部と、
前記半導体基板のおもて面側において前記複数のダミートレンチ部のうち2以上のダミートレンチ部に囲まれて設けられ、内部に設けられた電極にゲート電位が与えられるゲートトレンチ部と
を備え、
前記ゲートトレンチ部は、前記半導体基板のおもて面に対して環状に設けられる
半導体装置。 - 前記ゲートトレンチ部と前記ダミートレンチ部とは、前記ゲートランナーの延伸方向に直交する方向においても交互に設けられる
請求項1に記載の半導体装置。 - 前記半導体基板のおもて面に対して、環状の前記ゲートトレンチ部を囲むように、環状の不純物注入領域をさらに備え、
前記ゲートトレンチ部の内部に設けられた電極が電気的に接続するゲートランナーの延伸方向に直交する方向において隣接する環状の前記不純物注入領域は、前記ゲートランナーの延伸方向に半ピッチずれて設けられる
請求項8に記載の半導体装置。 - 半導体基板のおもて面側に設けられ、内部に設けられた電極にエミッタ電位が与えられる複数のダミートレンチ部と、
前記半導体基板のおもて面側において前記複数のダミートレンチ部のうち2以上のダミートレンチ部に囲まれて設けられ、内部に設けられた電極にゲート電位が与えられるゲートトレンチ部と
を備え、
前記複数のダミートレンチ部は、
第1方向に延伸し、且つ、前記第1方向と直交する方向において前記ゲートトレンチ部を挟んで配置された第1ダミートレンチ部と、
前記第1ダミートレンチ部に挟まれた領域において、前記ゲートトレンチ部と前記第1方向に交互に設けられた第2ダミートレンチ部と
を含む半導体装置。 - 半導体基板のおもて面側に設けられ、内部に設けられた電極にエミッタ電位が与えられる複数のダミートレンチ部と、
前記半導体基板のおもて面側において前記複数のダミートレンチ部のうち2以上のダミートレンチ部に囲まれて設けられ、内部に設けられた電極にゲート電位が与えられるゲートトレンチ部と
を備え、
前記ゲートトレンチ部は、
第1方向に延伸し、且つ、前記第1方向において前記ダミートレンチ部と交互に設けられた
半導体装置。
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JP2015243077A JP6676947B2 (ja) | 2015-12-14 | 2015-12-14 | 半導体装置 |
US15/335,444 US10256303B2 (en) | 2015-12-14 | 2016-10-27 | Semiconductor device |
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CN105226090B (zh) * | 2015-11-10 | 2018-07-13 | 株洲中车时代电气股份有限公司 | 一种绝缘栅双极晶体管及其制作方法 |
JP6634860B2 (ja) * | 2016-02-10 | 2020-01-22 | 株式会社デンソー | 半導体装置 |
KR102471273B1 (ko) * | 2017-08-22 | 2022-11-28 | 삼성전자주식회사 | 적층 구조체와 트렌치들을 갖는 반도체 소자 |
JP6777245B2 (ja) * | 2017-11-16 | 2020-10-28 | 富士電機株式会社 | 半導体装置 |
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WO2020031551A1 (ja) * | 2018-08-10 | 2020-02-13 | 富士電機株式会社 | 半導体装置 |
WO2021049499A1 (ja) * | 2019-09-11 | 2021-03-18 | 富士電機株式会社 | 半導体装置および製造方法 |
WO2022249753A1 (ja) * | 2021-05-24 | 2022-12-01 | 富士電機株式会社 | 半導体装置 |
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