CN115971633A - 超声焊接系统及其使用方法 - Google Patents

超声焊接系统及其使用方法 Download PDF

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Publication number
CN115971633A
CN115971633A CN202310078303.4A CN202310078303A CN115971633A CN 115971633 A CN115971633 A CN 115971633A CN 202310078303 A CN202310078303 A CN 202310078303A CN 115971633 A CN115971633 A CN 115971633A
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CN
China
Prior art keywords
axis
ultrasonic welding
welding system
workpiece
forcer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310078303.4A
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English (en)
Chinese (zh)
Inventor
T·J·科伯提特
H·H·冯特莱斯科
C·R·朗利
S·D·卡塔利亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Publication of CN115971633A publication Critical patent/CN115971633A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/32—Wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN202310078303.4A 2018-11-28 2019-11-25 超声焊接系统及其使用方法 Pending CN115971633A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862772113P 2018-11-28 2018-11-28
US62/772,113 2018-11-28
CN201980078598.7A CN113165102B (zh) 2018-11-28 2019-11-25 超声焊接系统及其使用方法
PCT/US2019/063007 WO2020112635A1 (en) 2018-11-28 2019-11-25 Ultrasonic welding systems and methods of using the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201980078598.7A Division CN113165102B (zh) 2018-11-28 2019-11-25 超声焊接系统及其使用方法

Publications (1)

Publication Number Publication Date
CN115971633A true CN115971633A (zh) 2023-04-18

Family

ID=70771461

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202310078303.4A Pending CN115971633A (zh) 2018-11-28 2019-11-25 超声焊接系统及其使用方法
CN201980078598.7A Active CN113165102B (zh) 2018-11-28 2019-11-25 超声焊接系统及其使用方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201980078598.7A Active CN113165102B (zh) 2018-11-28 2019-11-25 超声焊接系统及其使用方法

Country Status (5)

Country Link
US (3) US11285561B2 (https=)
EP (2) EP4403292A3 (https=)
JP (2) JP7541806B2 (https=)
CN (2) CN115971633A (https=)
WO (1) WO2020112635A1 (https=)

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EP4681866A3 (en) * 2017-04-04 2026-04-29 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
WO2020163694A1 (en) * 2019-02-07 2020-08-13 T.A. Systems, Inc. Ultrasonic sonotrode with workpiece clamping tool
US11626677B2 (en) * 2020-05-13 2023-04-11 Semiconductor Components Industries, Llc Bonding module pins to an electronic substrate
US11850676B2 (en) 2020-06-03 2023-12-26 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins
DE102022108397A1 (de) * 2022-04-07 2023-10-12 Herrmann Ultraschalltechnik Gmbh & Co. Kg Vorrichtung zum Ultraschallschweißen eines Werkstücks und Verfahren zum Betreiben einer solchen Vorrichtung
CN115420412B (zh) * 2022-08-05 2025-08-26 上海骄成超声波技术股份有限公司 一种用于超声波焊头的压力检测组件及其检测装置
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE
CN120981314A (zh) * 2023-04-19 2025-11-18 库利克和索夫工业公司 用于导电引脚的超声焊接系统和相关方法
CN116652356A (zh) * 2023-07-11 2023-08-29 广东铭基高科电子股份有限公司 一种超声波焊接机构
CN117680867B (zh) * 2024-02-04 2024-05-24 南京航空航天大学 一种基于纳米颗粒植入与微量元素补偿的高强焊丝的焊接方法
US20260103123A1 (en) * 2024-10-10 2026-04-16 Evenflo Company, Inc. Child safety seat with multiple configurations

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US20140048584A1 (en) * 2010-03-31 2014-02-20 Orthodyne Electronics Corporation Ultrasonic bonding systems and methods of using the same
CN103887192A (zh) * 2012-12-21 2014-06-25 贝思瑞士股份公司 用于在衬底上安装半导体芯片的热压结合方法及装置
US20160052194A1 (en) * 2013-04-10 2016-02-25 Adwelds Corporation Welding device and welding method
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WO2016199621A1 (ja) 2015-06-11 2016-12-15 三菱電機株式会社 電力用半導体装置の製造方法および電力用半導体装置
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US20040211812A1 (en) * 2003-04-23 2004-10-28 Matsushita Electric Industrial Co., Ltd. Bonding device and bonding tool
US20090289098A1 (en) * 2005-12-06 2009-11-26 Katsumi Terada Chip Mounting Apparatus and Chip Mounting Method
US20070215673A1 (en) * 2006-03-17 2007-09-20 Fujitsu Limited Bonding apparatus and bonding method
US20140048584A1 (en) * 2010-03-31 2014-02-20 Orthodyne Electronics Corporation Ultrasonic bonding systems and methods of using the same
JP2013063521A (ja) * 2011-09-15 2013-04-11 Seidensha Electronics Co Ltd 超音波溶着装置、超音波接合装置、布線装置
CN103887192A (zh) * 2012-12-21 2014-06-25 贝思瑞士股份公司 用于在衬底上安装半导体芯片的热压结合方法及装置
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Also Published As

Publication number Publication date
US11958124B2 (en) 2024-04-16
EP4403292A3 (en) 2024-11-06
US20200164460A1 (en) 2020-05-28
CN113165102B (zh) 2022-11-25
EP3887085B1 (en) 2024-03-13
JP7541806B2 (ja) 2024-08-29
US11285561B2 (en) 2022-03-29
US20230043068A1 (en) 2023-02-09
WO2020112635A1 (en) 2020-06-04
EP4403292A2 (en) 2024-07-24
JP2022510882A (ja) 2022-01-28
JP2024157013A (ja) 2024-11-06
US20220143737A1 (en) 2022-05-12
CN113165102A (zh) 2021-07-23
US11504800B2 (en) 2022-11-22
EP3887085A4 (en) 2022-11-02
EP3887085A1 (en) 2021-10-06

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