JP7541806B2 - 超音波溶接システムおよび当該システムを使用する方法 - Google Patents

超音波溶接システムおよび当該システムを使用する方法 Download PDF

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JP7541806B2
JP7541806B2 JP2021529685A JP2021529685A JP7541806B2 JP 7541806 B2 JP7541806 B2 JP 7541806B2 JP 2021529685 A JP2021529685 A JP 2021529685A JP 2021529685 A JP2021529685 A JP 2021529685A JP 7541806 B2 JP7541806 B2 JP 7541806B2
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axis
ultrasonic welding
welding system
movement
workpiece
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JP2022510882A5 (https=
JPWO2020112635A5 (https=
JP2022510882A (ja
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コッパーサイト、セオドア、ジェイ．
ヴォン、トレスコウ、ハンス、エイチ．
ロングリー、クリストファー、アール．
カタリア、シッダールス、ディー．
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クリック アンド ソッファ インダストリーズ、インク．
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Publication of JP2022510882A publication Critical patent/JP2022510882A/ja
Publication of JP2022510882A5 publication Critical patent/JP2022510882A5/ja
Publication of JPWO2020112635A5 publication Critical patent/JPWO2020112635A5/ja
Priority to JP2024137470A priority Critical patent/JP2024157013A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/32—Wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2021529685A 2018-11-28 2019-11-25 超音波溶接システムおよび当該システムを使用する方法 Active JP7541806B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024137470A JP2024157013A (ja) 2018-11-28 2024-08-17 超音波溶接システムおよび当該システムを使用する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862772113P 2018-11-28 2018-11-28
US62/772,113 2018-11-28
PCT/US2019/063007 WO2020112635A1 (en) 2018-11-28 2019-11-25 Ultrasonic welding systems and methods of using the same

Related Child Applications (1)

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JP2024137470A Division JP2024157013A (ja) 2018-11-28 2024-08-17 超音波溶接システムおよび当該システムを使用する方法

Publications (4)

Publication Number Publication Date
JP2022510882A JP2022510882A (ja) 2022-01-28
JP2022510882A5 JP2022510882A5 (https=) 2022-11-14
JPWO2020112635A5 JPWO2020112635A5 (https=) 2022-11-14
JP7541806B2 true JP7541806B2 (ja) 2024-08-29

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JP2021529685A Active JP7541806B2 (ja) 2018-11-28 2019-11-25 超音波溶接システムおよび当該システムを使用する方法
JP2024137470A Pending JP2024157013A (ja) 2018-11-28 2024-08-17 超音波溶接システムおよび当該システムを使用する方法

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JP2024137470A Pending JP2024157013A (ja) 2018-11-28 2024-08-17 超音波溶接システムおよび当該システムを使用する方法

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Country Link
US (3) US11285561B2 (https=)
EP (2) EP4403292A3 (https=)
JP (2) JP7541806B2 (https=)
CN (2) CN115971633A (https=)
WO (1) WO2020112635A1 (https=)

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WO2020163694A1 (en) * 2019-02-07 2020-08-13 T.A. Systems, Inc. Ultrasonic sonotrode with workpiece clamping tool
US11626677B2 (en) * 2020-05-13 2023-04-11 Semiconductor Components Industries, Llc Bonding module pins to an electronic substrate
US11850676B2 (en) 2020-06-03 2023-12-26 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins
DE102022108397A1 (de) * 2022-04-07 2023-10-12 Herrmann Ultraschalltechnik Gmbh & Co. Kg Vorrichtung zum Ultraschallschweißen eines Werkstücks und Verfahren zum Betreiben einer solchen Vorrichtung
CN115420412B (zh) * 2022-08-05 2025-08-26 上海骄成超声波技术股份有限公司 一种用于超声波焊头的压力检测组件及其检测装置
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE
CN120981314A (zh) * 2023-04-19 2025-11-18 库利克和索夫工业公司 用于导电引脚的超声焊接系统和相关方法
CN116652356A (zh) * 2023-07-11 2023-08-29 广东铭基高科电子股份有限公司 一种超声波焊接机构
CN117680867B (zh) * 2024-02-04 2024-05-24 南京航空航天大学 一种基于纳米颗粒植入与微量元素补偿的高强焊丝的焊接方法
US20260103123A1 (en) * 2024-10-10 2026-04-16 Evenflo Company, Inc. Child safety seat with multiple configurations

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JP2001105160A (ja) 1999-09-30 2001-04-17 Suzuki Motor Corp 超音波溶着装置
US20140048584A1 (en) 2010-03-31 2014-02-20 Orthodyne Electronics Corporation Ultrasonic bonding systems and methods of using the same
JP2013063521A (ja) 2011-09-15 2013-04-11 Seidensha Electronics Co Ltd 超音波溶着装置、超音波接合装置、布線装置
JP2015016504A (ja) 2013-04-10 2015-01-29 株式会社アドウェルズ 接合装置および接合方法
JP2016143826A (ja) 2015-02-04 2016-08-08 三菱電機株式会社 電力用半導体装置、超音波接合方法および超音波接合装置

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US11958124B2 (en) 2024-04-16
EP4403292A3 (en) 2024-11-06
US20200164460A1 (en) 2020-05-28
CN113165102B (zh) 2022-11-25
EP3887085B1 (en) 2024-03-13
US11285561B2 (en) 2022-03-29
US20230043068A1 (en) 2023-02-09
WO2020112635A1 (en) 2020-06-04
EP4403292A2 (en) 2024-07-24
JP2022510882A (ja) 2022-01-28
JP2024157013A (ja) 2024-11-06
US20220143737A1 (en) 2022-05-12
CN113165102A (zh) 2021-07-23
CN115971633A (zh) 2023-04-18
US11504800B2 (en) 2022-11-22
EP3887085A4 (en) 2022-11-02
EP3887085A1 (en) 2021-10-06

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