CN115836101B - 硬化性树脂、硬化性树脂组合物及硬化物 - Google Patents

硬化性树脂、硬化性树脂组合物及硬化物

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Publication number
CN115836101B
CN115836101B CN202180038560.4A CN202180038560A CN115836101B CN 115836101 B CN115836101 B CN 115836101B CN 202180038560 A CN202180038560 A CN 202180038560A CN 115836101 B CN115836101 B CN 115836101B
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curable resin
group
general formula
represented
compound
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CN115836101A (zh
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松冈龙一
杨立宸
神成広义
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DIC Corp
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    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
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    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
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    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
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    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
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    • C08G2261/10Definition of the polymer structure
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    • C08G2261/10Definition of the polymer structure
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN202180038560.4A 2020-06-09 2021-05-13 硬化性树脂、硬化性树脂组合物及硬化物 Active CN115836101B (zh)

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JP2020100427 2020-06-09
JP2020-100427 2020-06-09
PCT/JP2021/018136 WO2021251052A1 (ja) 2020-06-09 2021-05-13 硬化性樹脂、硬化性樹脂組成物、及び、硬化物

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CN115836101B true CN115836101B (zh) 2025-07-29

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US (1) US20230272156A1 (https=)
JP (2) JPWO2021251052A1 (https=)
KR (1) KR102938970B1 (https=)
CN (1) CN115836101B (https=)
TW (1) TWI886286B (https=)
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US20250002632A1 (en) * 2021-08-18 2025-01-02 Mitsubishi Gas Chemical Company, Inc. Resin, method for producing resin, curable resin composition, and cured product
WO2023089976A1 (ja) * 2021-11-18 2023-05-25 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP7614243B2 (ja) * 2023-03-14 2025-01-15 日本化薬株式会社 硬化性樹脂、硬化性樹脂組成物、およびその硬化物
CN119110829A (zh) * 2023-04-10 2024-12-10 株式会社力森诺科 树脂组合物、预浸料、树脂膜、覆金属层叠板、印刷配线板、半导体封装体及苊均聚物
JP7572496B1 (ja) * 2023-04-20 2024-10-23 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
WO2025032689A1 (ja) * 2023-08-07 2025-02-13 株式会社レゾナック 封止用材料、封止材、及び半導体装置
CN121666902A (zh) * 2023-08-07 2026-03-13 株式会社力森诺科 封装用材料、封装材及半导体装置
WO2025062657A1 (ja) * 2023-09-22 2025-03-27 株式会社レゾナック 封止用液状樹脂組成物、及び電子部品装置
JP2025068484A (ja) 2023-10-16 2025-04-28 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、硬化物および物品

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CN107057065A (zh) * 2017-02-16 2017-08-18 中山大学 具有低介电常数的聚合物及降低聚合物介电常数的分子结构设计方法

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KR102938970B1 (ko) 2026-03-16
KR20230022397A (ko) 2023-02-15
US20230272156A1 (en) 2023-08-31
TW202146499A (zh) 2021-12-16
TWI886286B (zh) 2025-06-11
JP2022132699A (ja) 2022-09-09
JPWO2021251052A1 (https=) 2021-12-16
JP7524930B2 (ja) 2024-07-30
CN115836101A (zh) 2023-03-21
WO2021251052A1 (ja) 2021-12-16

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