CN115702212B - 固化性树脂组合物、临时固定材料、以及电子部件的制造方法 - Google Patents

固化性树脂组合物、临时固定材料、以及电子部件的制造方法 Download PDF

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CN115702212B
CN115702212B CN202180039607.9A CN202180039607A CN115702212B CN 115702212 B CN115702212 B CN 115702212B CN 202180039607 A CN202180039607 A CN 202180039607A CN 115702212 B CN115702212 B CN 115702212B
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resin composition
curable resin
compound
main chain
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CN115702212A (zh
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高桥骏夫
七里德重
林聪史
大同和泉
星野文香
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C07D207/452—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesive Tapes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Polymerisation Methods In General (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
CN202180039607.9A 2020-09-23 2021-09-22 固化性树脂组合物、临时固定材料、以及电子部件的制造方法 Active CN115702212B (zh)

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CN202410019252.2A CN117946520A (zh) 2020-09-23 2021-09-22 固化性树脂组合物、临时固定材料、以及电子部件的制造方法
CN202410019062.0A CN117946519A (zh) 2020-09-23 2021-09-22 固化性树脂组合物、临时固定材料、以及电子部件的制造方法

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JP2020-159180 2020-09-23
JP2020159179 2020-09-23
JP2020159181 2020-09-23
JP2020159180 2020-09-23
JP2020-159179 2020-09-23
JP2020-159181 2020-09-23
PCT/JP2021/034853 WO2022065376A1 (ja) 2020-09-23 2021-09-22 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法

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CN202410019062.0A Division CN117946519A (zh) 2020-09-23 2021-09-22 固化性树脂组合物、临时固定材料、以及电子部件的制造方法

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CN202410019252.2A Pending CN117946520A (zh) 2020-09-23 2021-09-22 固化性树脂组合物、临时固定材料、以及电子部件的制造方法
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JP2024002673A (ja) * 2022-06-24 2024-01-11 信越化学工業株式会社 硬化性樹脂組成物、半導体封止材、接着剤、接着フィルム、プリプレグ、層間絶縁材料及びプリント配線板
KR20250039328A (ko) * 2022-07-22 2025-03-20 가부시끼가이샤 레조낙 폴리말레이미드 수지, 수지 조성물, 경화물, 시트, 적층체, 및 프린트 배선판
US20250277087A1 (en) * 2022-07-22 2025-09-04 Resonac Corporation Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board
WO2024063112A1 (ja) * 2022-09-21 2024-03-28 積水化学工業株式会社 樹脂組成物、仮固定材、及び、電子部品の製造方法
CN119855851A (zh) * 2022-10-14 2025-04-18 日本化药株式会社 树脂组合物、硬化物、半导体元件及干膜抗蚀剂
KR20250083463A (ko) * 2022-10-14 2025-06-10 니폰 가야꾸 가부시끼가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치
JP7396742B1 (ja) 2022-11-10 2023-12-12 ユニチカ株式会社 ビスマレイミドおよびその製造方法
EP4629280A1 (en) 2022-12-01 2025-10-08 Nissan Chemical Corporation Composition for forming coating film for foreign substance removal, and semiconductor substrate
WO2024157629A1 (ja) * 2023-01-25 2024-08-02 積水化学工業株式会社 光硬化性材料、光硬化性フィルム、及び、硬化物
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