TW202219224A - 硬化性樹脂組成物、暫時固定材、及電子零件之製造方法 - Google Patents

硬化性樹脂組成物、暫時固定材、及電子零件之製造方法 Download PDF

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TW202219224A
TW202219224A TW110135354A TW110135354A TW202219224A TW 202219224 A TW202219224 A TW 202219224A TW 110135354 A TW110135354 A TW 110135354A TW 110135354 A TW110135354 A TW 110135354A TW 202219224 A TW202219224 A TW 202219224A
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resin composition
curable resin
compound
weight
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髙橋駿夫
七里徳重
林聡史
大同和泉
星野文香
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日商積水化學工業股份有限公司
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    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
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    • C08K5/3415—Five-membered rings
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    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C07D207/452—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
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  • Chemical & Material Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesive Tapes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Polymerisation Methods In General (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
TW110135354A 2020-09-23 2021-09-23 硬化性樹脂組成物、暫時固定材、及電子零件之製造方法 TW202219224A (zh)

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JP2020159179 2020-09-23
JP2020159181 2020-09-23
JPJP2020-159181 2020-09-23
JP2020159180 2020-09-23
JPJP2020-159179 2020-09-23
JPJP2020-159180 2020-09-23

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JP (5) JP7194313B2 (https=)
KR (1) KR20230074064A (https=)
CN (3) CN115702212B (https=)
TW (1) TW202219224A (https=)
WO (1) WO2022065376A1 (https=)

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WO2024063112A1 (ja) * 2022-09-21 2024-03-28 積水化学工業株式会社 樹脂組成物、仮固定材、及び、電子部品の製造方法
CN119855851A (zh) * 2022-10-14 2025-04-18 日本化药株式会社 树脂组合物、硬化物、半导体元件及干膜抗蚀剂
KR20250083463A (ko) * 2022-10-14 2025-06-10 니폰 가야꾸 가부시끼가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치
JP7396742B1 (ja) 2022-11-10 2023-12-12 ユニチカ株式会社 ビスマレイミドおよびその製造方法
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WO2024157629A1 (ja) * 2023-01-25 2024-08-02 積水化学工業株式会社 光硬化性材料、光硬化性フィルム、及び、硬化物
TW202449021A (zh) 2023-04-07 2024-12-16 日商味之素股份有限公司 樹脂組成物
TW202528480A (zh) * 2023-09-11 2025-07-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件、以及化合物
WO2025058045A1 (ja) * 2023-09-15 2025-03-20 積水化学工業株式会社 接着性フィルム、接着性フィルムの製造方法、接着性樹脂組成物、及び、半導体装置の製造方法
WO2025063226A1 (ja) * 2023-09-19 2025-03-27 積水化学工業株式会社 イミド樹脂材料、硬化性樹脂組成物、接着性フィルム、仮固定材、及び、イミド樹脂材料の製造方法

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