KR20230074064A - 경화성 수지 조성물, 가고정재, 및 전자 부품의 제조 방법 - Google Patents

경화성 수지 조성물, 가고정재, 및 전자 부품의 제조 방법 Download PDF

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KR20230074064A
KR20230074064A KR1020227042835A KR20227042835A KR20230074064A KR 20230074064 A KR20230074064 A KR 20230074064A KR 1020227042835 A KR1020227042835 A KR 1020227042835A KR 20227042835 A KR20227042835 A KR 20227042835A KR 20230074064 A KR20230074064 A KR 20230074064A
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group
resin composition
curable resin
compound
weight
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Korean (ko)
Inventor
도시오 다카하시
도쿠시게 시치리
사토시 하야시
이즈미 다이도
후미카 호시노
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세키스이가가쿠 고교가부시키가이샤
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
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    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C07D207/452—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
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    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/02—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
    • C07D209/44—Iso-indoles; Hydrogenated iso-indoles
    • C07D209/48—Iso-indoles; Hydrogenated iso-indoles with oxygen atoms in positions 1 and 3, e.g. phthalimide
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    • C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
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    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
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    • C09J2479/08—Presence of polyamine or polyimide polyimide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesive Tapes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Polymerisation Methods In General (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
KR1020227042835A 2020-09-23 2021-09-22 경화성 수지 조성물, 가고정재, 및 전자 부품의 제조 방법 Pending KR20230074064A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020159179 2020-09-23
JP2020159181 2020-09-23
JPJP-P-2020-159180 2020-09-23
JPJP-P-2020-159179 2020-09-23
JPJP-P-2020-159181 2020-09-23
JP2020159180 2020-09-23
PCT/JP2021/034853 WO2022065376A1 (ja) 2020-09-23 2021-09-22 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法

Publications (1)

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KR20230074064A true KR20230074064A (ko) 2023-05-26

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JP (5) JP7194313B2 (https=)
KR (1) KR20230074064A (https=)
CN (3) CN115702212B (https=)
TW (1) TW202219224A (https=)
WO (1) WO2022065376A1 (https=)

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JP2024002673A (ja) * 2022-06-24 2024-01-11 信越化学工業株式会社 硬化性樹脂組成物、半導体封止材、接着剤、接着フィルム、プリプレグ、層間絶縁材料及びプリント配線板
KR20250039328A (ko) * 2022-07-22 2025-03-20 가부시끼가이샤 레조낙 폴리말레이미드 수지, 수지 조성물, 경화물, 시트, 적층체, 및 프린트 배선판
US20250277087A1 (en) * 2022-07-22 2025-09-04 Resonac Corporation Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board
WO2024063112A1 (ja) * 2022-09-21 2024-03-28 積水化学工業株式会社 樹脂組成物、仮固定材、及び、電子部品の製造方法
CN119855851A (zh) * 2022-10-14 2025-04-18 日本化药株式会社 树脂组合物、硬化物、半导体元件及干膜抗蚀剂
KR20250083463A (ko) * 2022-10-14 2025-06-10 니폰 가야꾸 가부시끼가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치
JP7396742B1 (ja) 2022-11-10 2023-12-12 ユニチカ株式会社 ビスマレイミドおよびその製造方法
EP4629280A1 (en) 2022-12-01 2025-10-08 Nissan Chemical Corporation Composition for forming coating film for foreign substance removal, and semiconductor substrate
WO2024157629A1 (ja) * 2023-01-25 2024-08-02 積水化学工業株式会社 光硬化性材料、光硬化性フィルム、及び、硬化物
TW202449021A (zh) 2023-04-07 2024-12-16 日商味之素股份有限公司 樹脂組成物
TW202528480A (zh) * 2023-09-11 2025-07-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件、以及化合物
WO2025058045A1 (ja) * 2023-09-15 2025-03-20 積水化学工業株式会社 接着性フィルム、接着性フィルムの製造方法、接着性樹脂組成物、及び、半導体装置の製造方法
WO2025063226A1 (ja) * 2023-09-19 2025-03-27 積水化学工業株式会社 イミド樹脂材料、硬化性樹脂組成物、接着性フィルム、仮固定材、及び、イミド樹脂材料の製造方法

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