CN115699295A - 半导体装置以及半导体装置的制造方法 - Google Patents

半导体装置以及半导体装置的制造方法 Download PDF

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Publication number
CN115699295A
CN115699295A CN202180037156.5A CN202180037156A CN115699295A CN 115699295 A CN115699295 A CN 115699295A CN 202180037156 A CN202180037156 A CN 202180037156A CN 115699295 A CN115699295 A CN 115699295A
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CN
China
Prior art keywords
insulating layer
layer
semiconductor device
main
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180037156.5A
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English (en)
Chinese (zh)
Inventor
富士和则
吴小鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN115699295A publication Critical patent/CN115699295A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6525—Cross-sectional shapes for securing the interconnections to the substrate, e.g. to prevent peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202180037156.5A 2020-05-26 2021-05-21 半导体装置以及半导体装置的制造方法 Pending CN115699295A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020091169 2020-05-26
JP2020-091169 2020-05-26
PCT/JP2021/019392 WO2021241447A1 (ja) 2020-05-26 2021-05-21 半導体装置、および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN115699295A true CN115699295A (zh) 2023-02-03

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ID=78744674

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180037156.5A Pending CN115699295A (zh) 2020-05-26 2021-05-21 半导体装置以及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US12431399B2 (https=)
JP (1) JP7709435B2 (https=)
CN (1) CN115699295A (https=)
DE (1) DE112021002956T5 (https=)
WO (1) WO2021241447A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291721A (ja) * 2000-04-06 2001-10-19 Nec Corp 配線構造、導電パターンの形成方法、半導体装置および半導体装置の製造方法
WO2001080609A1 (en) * 2000-04-14 2001-10-25 3M Innovative Properties Company Double-sided wiring board and its manufacture method
JP2002280484A (ja) * 2001-03-19 2002-09-27 Fujikura Ltd 半導体パッケージおよび半導体パッケージの製造方法
JP2009177072A (ja) * 2008-01-28 2009-08-06 Fujikura Ltd 半導体装置及びその製造方法
WO2018047770A1 (ja) * 2016-09-08 2018-03-15 住友ベークライト株式会社 半導体装置の製造方法
CN108962843A (zh) * 2017-05-19 2018-12-07 Tdk株式会社 半导体ic内置基板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100336426C (zh) 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
JP2008294415A (ja) * 2007-04-27 2008-12-04 Sanyo Electric Co Ltd 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器
US8970046B2 (en) * 2011-07-18 2015-03-03 Samsung Electronics Co., Ltd. Semiconductor packages and methods of forming the same
JP5976073B2 (ja) 2014-11-07 2016-08-23 日東電工株式会社 半導体装置の製造方法
JP2017069257A (ja) * 2015-09-28 2017-04-06 日立化成株式会社 半導体装置の製造方法
JP2018019071A (ja) * 2016-07-14 2018-02-01 住友ベークライト株式会社 半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291721A (ja) * 2000-04-06 2001-10-19 Nec Corp 配線構造、導電パターンの形成方法、半導体装置および半導体装置の製造方法
WO2001080609A1 (en) * 2000-04-14 2001-10-25 3M Innovative Properties Company Double-sided wiring board and its manufacture method
JP2002280484A (ja) * 2001-03-19 2002-09-27 Fujikura Ltd 半導体パッケージおよび半導体パッケージの製造方法
JP2009177072A (ja) * 2008-01-28 2009-08-06 Fujikura Ltd 半導体装置及びその製造方法
WO2018047770A1 (ja) * 2016-09-08 2018-03-15 住友ベークライト株式会社 半導体装置の製造方法
CN108962843A (zh) * 2017-05-19 2018-12-07 Tdk株式会社 半导体ic内置基板及其制造方法

Also Published As

Publication number Publication date
JP7709435B2 (ja) 2025-07-16
WO2021241447A1 (ja) 2021-12-02
JPWO2021241447A1 (https=) 2021-12-02
DE112021002956T5 (de) 2023-03-09
US20230197544A1 (en) 2023-06-22
US12431399B2 (en) 2025-09-30

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