DE112021002956T5 - Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils - Google Patents

Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils Download PDF

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Publication number
DE112021002956T5
DE112021002956T5 DE112021002956.8T DE112021002956T DE112021002956T5 DE 112021002956 T5 DE112021002956 T5 DE 112021002956T5 DE 112021002956 T DE112021002956 T DE 112021002956T DE 112021002956 T5 DE112021002956 T5 DE 112021002956T5
Authority
DE
Germany
Prior art keywords
layer
insulating layer
thickness direction
penetrating
main part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112021002956.8T
Other languages
German (de)
English (en)
Inventor
Kazunori Fuji
Xiaopeng Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112021002956T5 publication Critical patent/DE112021002956T5/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6525—Cross-sectional shapes for securing the interconnections to the substrate, e.g. to prevent peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112021002956.8T 2020-05-26 2021-05-21 Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils Withdrawn DE112021002956T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020091169 2020-05-26
JP2020-091169 2020-05-26
PCT/JP2021/019392 WO2021241447A1 (ja) 2020-05-26 2021-05-21 半導体装置、および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112021002956T5 true DE112021002956T5 (de) 2023-03-09

Family

ID=78744674

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021002956.8T Withdrawn DE112021002956T5 (de) 2020-05-26 2021-05-21 Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils

Country Status (5)

Country Link
US (1) US12431399B2 (https=)
JP (1) JP7709435B2 (https=)
CN (1) CN115699295A (https=)
DE (1) DE112021002956T5 (https=)
WO (1) WO2021241447A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089081A (ja) 2014-11-07 2016-05-23 日東電工株式会社 半導体装置の製造方法及び半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100336426C (zh) 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
JP2001291721A (ja) * 2000-04-06 2001-10-19 Nec Corp 配線構造、導電パターンの形成方法、半導体装置および半導体装置の製造方法
JP2001308478A (ja) * 2000-04-14 2001-11-02 Three M Innovative Properties Co 両面配線基板及びその製造方法
JP4361222B2 (ja) * 2001-03-19 2009-11-11 株式会社フジクラ 半導体パッケージおよび半導体パッケージの製造方法
JP2008294415A (ja) * 2007-04-27 2008-12-04 Sanyo Electric Co Ltd 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器
JP2009177072A (ja) * 2008-01-28 2009-08-06 Fujikura Ltd 半導体装置及びその製造方法
US8970046B2 (en) * 2011-07-18 2015-03-03 Samsung Electronics Co., Ltd. Semiconductor packages and methods of forming the same
JP2017069257A (ja) * 2015-09-28 2017-04-06 日立化成株式会社 半導体装置の製造方法
JP2018019071A (ja) * 2016-07-14 2018-02-01 住友ベークライト株式会社 半導体装置の製造方法
JP6477925B2 (ja) * 2016-09-08 2019-03-06 住友ベークライト株式会社 半導体装置の製造方法
JP6904055B2 (ja) * 2017-05-19 2021-07-14 Tdk株式会社 半導体ｉｃ内蔵基板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089081A (ja) 2014-11-07 2016-05-23 日東電工株式会社 半導体装置の製造方法及び半導体装置

Also Published As

Publication number Publication date
JP7709435B2 (ja) 2025-07-16
CN115699295A (zh) 2023-02-03
WO2021241447A1 (ja) 2021-12-02
JPWO2021241447A1 (https=) 2021-12-02
US20230197544A1 (en) 2023-06-22
US12431399B2 (en) 2025-09-30

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