CN115669244A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN115669244A
CN115669244A CN202180036092.7A CN202180036092A CN115669244A CN 115669244 A CN115669244 A CN 115669244A CN 202180036092 A CN202180036092 A CN 202180036092A CN 115669244 A CN115669244 A CN 115669244A
Authority
CN
China
Prior art keywords
bracket
heat sink
electronic device
substrate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180036092.7A
Other languages
English (en)
Chinese (zh)
Inventor
黑木涉
堀越真一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of CN115669244A publication Critical patent/CN115669244A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180036092.7A 2020-05-20 2021-05-14 电子装置 Pending CN115669244A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088123 2020-05-20
JP2020-088123 2020-05-20
PCT/JP2021/018318 WO2021235329A1 (ja) 2020-05-20 2021-05-14 電子装置

Publications (1)

Publication Number Publication Date
CN115669244A true CN115669244A (zh) 2023-01-31

Family

ID=78708387

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180036092.7A Pending CN115669244A (zh) 2020-05-20 2021-05-14 电子装置

Country Status (5)

Country Link
US (1) US20230189480A1 (https=)
JP (1) JP7397184B2 (https=)
CN (1) CN115669244A (https=)
DE (1) DE112021001973T5 (https=)
WO (1) WO2021235329A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151684A (ja) * 2023-04-12 2024-10-25 三菱電機株式会社 ヒートシンクおよび半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232778A (ja) * 1996-02-20 1997-09-05 Matsushita Electric Ind Co Ltd 電力制御装置
CN1199505A (zh) * 1995-10-13 1998-11-18 热合金公司 可焊式晶体管夹子和散热器
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) * 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造
CN102548360A (zh) * 2010-11-22 2012-07-04 三星电机株式会社 散热器
CN203279444U (zh) * 2012-05-18 2013-11-06 控制技术有限公司 一种可安装在印刷电路板上的散热片及散热组件
CN105191495A (zh) * 2013-05-21 2015-12-23 松下知识产权经营株式会社 感应加热烹调器
CN109119391A (zh) * 2017-06-23 2019-01-01 矢崎总业株式会社 电子元件的固定构造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529360U (https=) * 1975-07-08 1977-01-22
JP6337812B2 (ja) 2015-03-18 2018-06-06 株式会社安川電機 制御装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1199505A (zh) * 1995-10-13 1998-11-18 热合金公司 可焊式晶体管夹子和散热器
JPH09232778A (ja) * 1996-02-20 1997-09-05 Matsushita Electric Ind Co Ltd 電力制御装置
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) * 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造
CN102548360A (zh) * 2010-11-22 2012-07-04 三星电机株式会社 散热器
CN203279444U (zh) * 2012-05-18 2013-11-06 控制技术有限公司 一种可安装在印刷电路板上的散热片及散热组件
CN105191495A (zh) * 2013-05-21 2015-12-23 松下知识产权经营株式会社 感应加热烹调器
CN109119391A (zh) * 2017-06-23 2019-01-01 矢崎总业株式会社 电子元件的固定构造

Also Published As

Publication number Publication date
US20230189480A1 (en) 2023-06-15
DE112021001973T5 (de) 2023-01-12
JP7397184B2 (ja) 2023-12-12
WO2021235329A1 (ja) 2021-11-25
JPWO2021235329A1 (https=) 2021-11-25

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