DE112021001973T5 - Elektronische Vorrichtung - Google Patents

Elektronische Vorrichtung Download PDF

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Publication number
DE112021001973T5
DE112021001973T5 DE112021001973.2T DE112021001973T DE112021001973T5 DE 112021001973 T5 DE112021001973 T5 DE 112021001973T5 DE 112021001973 T DE112021001973 T DE 112021001973T DE 112021001973 T5 DE112021001973 T5 DE 112021001973T5
Authority
DE
Germany
Prior art keywords
substrate
electronic device
radiator
brackets
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021001973.2T
Other languages
German (de)
English (en)
Inventor
Wataru KUROKI
Shinichi Horikoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE112021001973T5 publication Critical patent/DE112021001973T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112021001973.2T 2020-05-20 2021-05-14 Elektronische Vorrichtung Pending DE112021001973T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088123 2020-05-20
JP2020-088123 2020-05-20
PCT/JP2021/018318 WO2021235329A1 (ja) 2020-05-20 2021-05-14 電子装置

Publications (1)

Publication Number Publication Date
DE112021001973T5 true DE112021001973T5 (de) 2023-01-12

Family

ID=78708387

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021001973.2T Pending DE112021001973T5 (de) 2020-05-20 2021-05-14 Elektronische Vorrichtung

Country Status (5)

Country Link
US (1) US20230189480A1 (https=)
JP (1) JP7397184B2 (https=)
CN (1) CN115669244A (https=)
DE (1) DE112021001973T5 (https=)
WO (1) WO2021235329A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151684A (ja) * 2023-04-12 2024-10-25 三菱電機株式会社 ヒートシンクおよび半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178132A (ja) 2015-03-18 2016-10-06 株式会社安川電機 制御装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529360U (https=) * 1975-07-08 1977-01-22
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
JP3022301B2 (ja) * 1996-02-20 2000-03-21 松下電器産業株式会社 電力制御装置
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造
KR101287755B1 (ko) * 2010-11-22 2013-07-18 삼성전기주식회사 히트싱크
GB2502148B (en) * 2012-05-18 2015-04-29 Control Tech Ltd Printed circuit board heatsink mounting
WO2014188698A1 (ja) * 2013-05-21 2014-11-27 パナソニックＩｐマネジメント株式会社 誘導加熱調理器
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178132A (ja) 2015-03-18 2016-10-06 株式会社安川電機 制御装置

Also Published As

Publication number Publication date
US20230189480A1 (en) 2023-06-15
JP7397184B2 (ja) 2023-12-12
CN115669244A (zh) 2023-01-31
WO2021235329A1 (ja) 2021-11-25
JPWO2021235329A1 (https=) 2021-11-25

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