JPWO2021235329A1 - - Google Patents

Info

Publication number
JPWO2021235329A1
JPWO2021235329A1 JP2022524430A JP2022524430A JPWO2021235329A1 JP WO2021235329 A1 JPWO2021235329 A1 JP WO2021235329A1 JP 2022524430 A JP2022524430 A JP 2022524430A JP 2022524430 A JP2022524430 A JP 2022524430A JP WO2021235329 A1 JPWO2021235329 A1 JP WO2021235329A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022524430A
Other languages
Japanese (ja)
Other versions
JP7397184B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021235329A1 publication Critical patent/JPWO2021235329A1/ja
Application granted granted Critical
Publication of JP7397184B2 publication Critical patent/JP7397184B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022524430A 2020-05-20 2021-05-14 電子装置 Active JP7397184B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088123 2020-05-20
JP2020088123 2020-05-20
PCT/JP2021/018318 WO2021235329A1 (ja) 2020-05-20 2021-05-14 電子装置

Publications (2)

Publication Number Publication Date
JPWO2021235329A1 true JPWO2021235329A1 (https=) 2021-11-25
JP7397184B2 JP7397184B2 (ja) 2023-12-12

Family

ID=78708387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524430A Active JP7397184B2 (ja) 2020-05-20 2021-05-14 電子装置

Country Status (5)

Country Link
US (1) US20230189480A1 (https=)
JP (1) JP7397184B2 (https=)
CN (1) CN115669244A (https=)
DE (1) DE112021001973T5 (https=)
WO (1) WO2021235329A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151684A (ja) * 2023-04-12 2024-10-25 三菱電機株式会社 ヒートシンクおよび半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529360U (https=) * 1975-07-08 1977-01-22
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) * 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
JP3022301B2 (ja) * 1996-02-20 2000-03-21 松下電器産業株式会社 電力制御装置
KR101287755B1 (ko) * 2010-11-22 2013-07-18 삼성전기주식회사 히트싱크
GB2502148B (en) * 2012-05-18 2015-04-29 Control Tech Ltd Printed circuit board heatsink mounting
WO2014188698A1 (ja) * 2013-05-21 2014-11-27 パナソニックＩｐマネジメント株式会社 誘導加熱調理器
JP6337812B2 (ja) 2015-03-18 2018-06-06 株式会社安川電機 制御装置
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529360U (https=) * 1975-07-08 1977-01-22
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) * 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造

Also Published As

Publication number Publication date
US20230189480A1 (en) 2023-06-15
DE112021001973T5 (de) 2023-01-12
JP7397184B2 (ja) 2023-12-12
CN115669244A (zh) 2023-01-31
WO2021235329A1 (ja) 2021-11-25

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