WO2021235329A1 - 電子装置 - Google Patents

電子装置 Download PDF

Info

Publication number
WO2021235329A1
WO2021235329A1 PCT/JP2021/018318 JP2021018318W WO2021235329A1 WO 2021235329 A1 WO2021235329 A1 WO 2021235329A1 JP 2021018318 W JP2021018318 W JP 2021018318W WO 2021235329 A1 WO2021235329 A1 WO 2021235329A1
Authority
WO
WIPO (PCT)
Prior art keywords
stay
electronic device
radiator
substrate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/018318
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
黒木渉
堀越眞一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Priority to JP2022524430A priority Critical patent/JP7397184B2/ja
Priority to DE112021001973.2T priority patent/DE112021001973T5/de
Priority to US17/925,933 priority patent/US20230189480A1/en
Priority to CN202180036092.7A priority patent/CN115669244A/zh
Publication of WO2021235329A1 publication Critical patent/WO2021235329A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device

Definitions

  • the clip 50 may be any clip 50 having an elastic force that cannot be easily removed by hand and can be removed only by a tool in order to improve vibration resistance.
  • the material of the clip 50 and the rivet may be made of metal or resin.
  • various clips and rivets such as scribets, trim clips, push turn rivets, plastic rivets, canoe clips, anchor clips, etc. are suitably adopted as fastening members for fixing the stay 18 to the radiator 16. Can be done.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
PCT/JP2021/018318 2020-05-20 2021-05-14 電子装置 Ceased WO2021235329A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022524430A JP7397184B2 (ja) 2020-05-20 2021-05-14 電子装置
DE112021001973.2T DE112021001973T5 (de) 2020-05-20 2021-05-14 Elektronische Vorrichtung
US17/925,933 US20230189480A1 (en) 2020-05-20 2021-05-14 Electronic device
CN202180036092.7A CN115669244A (zh) 2020-05-20 2021-05-14 电子装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020088123 2020-05-20
JP2020-088123 2020-05-20

Publications (1)

Publication Number Publication Date
WO2021235329A1 true WO2021235329A1 (ja) 2021-11-25

Family

ID=78708387

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/018318 Ceased WO2021235329A1 (ja) 2020-05-20 2021-05-14 電子装置

Country Status (5)

Country Link
US (1) US20230189480A1 (https=)
JP (1) JP7397184B2 (https=)
CN (1) CN115669244A (https=)
DE (1) DE112021001973T5 (https=)
WO (1) WO2021235329A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151684A (ja) * 2023-04-12 2024-10-25 三菱電機株式会社 ヒートシンクおよび半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) * 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529360U (https=) * 1975-07-08 1977-01-22
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
JP3022301B2 (ja) * 1996-02-20 2000-03-21 松下電器産業株式会社 電力制御装置
KR101287755B1 (ko) * 2010-11-22 2013-07-18 삼성전기주식회사 히트싱크
GB2502148B (en) * 2012-05-18 2015-04-29 Control Tech Ltd Printed circuit board heatsink mounting
JP6273619B2 (ja) * 2013-05-21 2018-02-07 パナソニックＩｐマネジメント株式会社 誘導加熱調理器
JP6337812B2 (ja) 2015-03-18 2018-06-06 株式会社安川電機 制御装置
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
JP3098236U (ja) * 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造

Also Published As

Publication number Publication date
JP7397184B2 (ja) 2023-12-12
JPWO2021235329A1 (https=) 2021-11-25
CN115669244A (zh) 2023-01-31
DE112021001973T5 (de) 2023-01-12
US20230189480A1 (en) 2023-06-15

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