JP7397184B2 - 電子装置 - Google Patents

電子装置 Download PDF

Info

Publication number
JP7397184B2
JP7397184B2 JP2022524430A JP2022524430A JP7397184B2 JP 7397184 B2 JP7397184 B2 JP 7397184B2 JP 2022524430 A JP2022524430 A JP 2022524430A JP 2022524430 A JP2022524430 A JP 2022524430A JP 7397184 B2 JP7397184 B2 JP 7397184B2
Authority
JP
Japan
Prior art keywords
stay
electronic device
radiator
substrate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022524430A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021235329A1 (https=
Inventor
渉 黒木
眞一 堀越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of JPWO2021235329A1 publication Critical patent/JPWO2021235329A1/ja
Application granted granted Critical
Publication of JP7397184B2 publication Critical patent/JP7397184B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP2022524430A 2020-05-20 2021-05-14 電子装置 Active JP7397184B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088123 2020-05-20
JP2020088123 2020-05-20
PCT/JP2021/018318 WO2021235329A1 (ja) 2020-05-20 2021-05-14 電子装置

Publications (2)

Publication Number Publication Date
JPWO2021235329A1 JPWO2021235329A1 (https=) 2021-11-25
JP7397184B2 true JP7397184B2 (ja) 2023-12-12

Family

ID=78708387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524430A Active JP7397184B2 (ja) 2020-05-20 2021-05-14 電子装置

Country Status (5)

Country Link
US (1) US20230189480A1 (https=)
JP (1) JP7397184B2 (https=)
CN (1) CN115669244A (https=)
DE (1) DE112021001973T5 (https=)
WO (1) WO2021235329A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151684A (ja) * 2023-04-12 2024-10-25 三菱電機株式会社 ヒートシンクおよび半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3098236U (ja) 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529360U (https=) * 1975-07-08 1977-01-22
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
JP3022301B2 (ja) * 1996-02-20 2000-03-21 松下電器産業株式会社 電力制御装置
JP2000022370A (ja) * 1998-07-01 2000-01-21 Honetsuki No Os:Kk ヒートシンクのプリント基板への固定方法及びこれに使用するヒートシンクとその固定用クリップ
KR101287755B1 (ko) * 2010-11-22 2013-07-18 삼성전기주식회사 히트싱크
GB2502148B (en) * 2012-05-18 2015-04-29 Control Tech Ltd Printed circuit board heatsink mounting
JP6273619B2 (ja) * 2013-05-21 2018-02-07 パナソニックＩｐマネジメント株式会社 誘導加熱調理器
JP6337812B2 (ja) 2015-03-18 2018-06-06 株式会社安川電機 制御装置
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3098236U (ja) 2003-05-30 2004-02-26 船井電機株式会社 電子回路素子の放熱板取付構造

Also Published As

Publication number Publication date
JPWO2021235329A1 (https=) 2021-11-25
CN115669244A (zh) 2023-01-31
DE112021001973T5 (de) 2023-01-12
WO2021235329A1 (ja) 2021-11-25
US20230189480A1 (en) 2023-06-15

Similar Documents

Publication Publication Date Title
JP3810458B2 (ja) ヒートシンクアッセンブリー及びその製造方法
WO2008044485A1 (fr) Structure de montage pour module d'alimentation et dispositif de contrôle du moteur la comportant
JP4804472B2 (ja) 組合せｉｇｂｔ実装方法
US6950310B2 (en) System and method for self-leveling heat sink for multiple height devices
JP5551206B2 (ja) 基板装置
JP7397184B2 (ja) 電子装置
JP2002500826A (ja) トーションバークランプ装置および積み重ね電子部品間の熱的および機械的接触を向上させる方法
JP7097780B2 (ja) 半導体装置、及び、半導体装置の製造方法
JP2005142323A (ja) 半導体モジュール
JPH08181474A (ja) パワー構成部分と放熱子の緊締装置及びその装置のプリント回路板への取付け方法
JP2011124452A (ja) 発熱部品の取り付け装置と発熱部品の取り付け装置をヒートシンクに実装する方法
JP2015228400A (ja) 基板素子の放熱構造
JP4193618B2 (ja) 放熱構造
JPH09139448A (ja) 半導体の取付具及びその取付方法並びにこれを用いた半導体装置
JP4818193B2 (ja) 電子装置の組立方法
EP4486078B1 (en) Method for mounting a power semiconductor device to a printed circuit board using an alignment device
JP7518006B2 (ja) 基板モジュール
JP4051620B2 (ja) パワーモジュールの電気的接続構造
JP4337137B2 (ja) 回路基板の固定構造
JP2006310552A (ja) 放熱器取付構造
CN112788843A (zh) 锁合组件及应用其的电子装置
JP4681469B2 (ja) 電子装置及び照明器具
JPH11274772A (ja) 放熱板付き半導体装置及びその製造方法
JP2024115963A (ja) 半導体モジュール及びサーボドライバ
JPH0356078Y2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230613

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230720

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231031

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231130

R150 Certificate of patent or registration of utility model

Ref document number: 7397184

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150