1285006 玖、發明說明：1285006 玖, invention description:
【發明粧屬立技術領域L 一種固定一積體電路（IC)元件以電連接一插座之裝置，該 ic元件被封裝於一平台柵格陣列包裝内。 【先前技術1 荽邛刀的持續努力要增加積體電路（IC)諸如中央處理單元 (CPU)的功能性時，不斷有需求要在典型包含有1(：之封裝上 k供更多電觸點（通常被稱為“針腳”），讓此IC與其他元件之 間能有更多的互動。然而’為—特^的1(:增加電連結的數 目會造成一種挑戰，就是要找出一種在一 IC封裝上能容納 增加觸點的方法，而此方法將依然可以提供—可以實施的 万法以安裝1C封裝（且由此，安裝IC至一電路板内）至一電路 板，以致於建立與其他元件之電連結。 回應這種不斷增加的需求以提供更多電觸點給IC使用， 不同形式之導孔針腳、表面黏著觸點、錫箔觸點、錫球等 已經被發明一段時間了。當IC將被永久的安裝至一電路板 上時，有可能1至少在一 IC封裝表面上設計一電觸點佈線， 這將允許那些觸點被焊至電路板表面。 然而’有其他的情況是1C必須被可移除地安裝至一電路 板這k對裝有該電路板之產品不熟練的使用者必須能夠 安裝此1C至此電路板或自此電路板將IC拆卸而不需要藉助 大堆特殊的工具。在這種情況下，要求使用者焊接或解 丈干被包裝於一封裝内且具有非常多觸點之IC是很少被視為 可接受的或所想要的，且所以必須使用一插座，藉由此插 85201 1285006 座ic可以被可移除地安裝於電路板上。 能支援將針腳栅格陣列（PGA)封裝之1C可移除地固定至電 路板之插座已經被設計。為1C之PGA封裝中針腳之使用需 要插座被設計成要以相對的力向側邊沿著針腳長度“抓住，， 針腳而形成電連接。這需要在插座内的機械結構，其限制 針腳的可能密度且因此限制可以被支援的特定封裝上的實 際針腳數量。吾人所想要的是提供一沒有針腳的插座，且 因此不需要在插座内使用向側邊力量的此種機械結構。 由於1C封裝被壓抵著插座，插座可以被提供將根據插座 觸點被壓抵著對應的觸點。不幸地，將插座各針腳壓抵著 封裝各個對應針腳所需的壓力需要某一定量的力以確保一 良好的電連接，且此壓力是累積的，以便所需力量的總合 與必須被壓在一起的對應針腳對數量成正比。此力量的累 和總合會造成機構設計上的挑戰，包括需要平均分佈這力 里在所有對應針腳對，確保其接收所需的力量而沒有過量 的力。數1非常大的對應針腳對被包含於其中，造成需要 相當大的累積^力量，關心的是施力是否平均以至於不損壞 插座或1C封裝。 明内宠]_ ^雖然為了说明且提供下列描述一詳細瞭解提出許多的細 ^知通此技蟄者應該了解，為了如申請專利範圍實現本 發明實施例，這些特定的細h是必須的。合"口，雖然實 此/所纣順稱之為1C封裝具有一凸塊柵陣列（LGA)觸點，那 一知通此技蟄者因該可以輕易理解具有其他形式觸點之其 85201 1285006 他貫施例也可以被使用而 出之本發明的精神與範圍 不達背下面申請專利範圍 中所提 可移除地固定一 1(：封裝之裝 合而將1C封裝與插座兩者之觸 嚜合一插座之框架及一嚆合一 插座與1C封裝擠壓在一起，該 擇地被作用。 置被揭露，其以與一插座噶 點適當嚆合。具體地說，一 1C封裝之載入盤透過力量將 力量透過使用一載入槓桿選 【實施方式] 、圖1描述一1C至一插座之構件的實施例。構件1〇〇是由固 疋架110、載入盤120、載入槓桿13〇、電路板14〇、插座15〇 及IC160組成。敎架110、載入盤120及載入横桿130配合 以強制將1C 160及插座150擠壓在一起，以便將插座15〇之 上邰觸點159t與1C 160的下部觸點169u壓入嚆合。 在構件的製作中，載入槓桿13〇被設置於固定架11〇與電 路板140之間，將載入槓桿13〇之軸部137與固定架ιι〇之框 架邰111b中所形成之載入槓桿通道（未顯示）對準，且將槓桿 13 0之載入點1〗6對準以通過穿過固定架11〇之部mb形成之 載入點通道116_而最後突出。固定架11〇經由固定架11〇之扣 件113a被安裝至電路板14〇，該扣件丨13a嚆合電路板14〇之 固定孔143，且將載入槓桿13〇套入固定架11〇之載入槓桿通 道且位於固定架110與電路板14〇之間。 經由任何熟知技術將插座1 50下部i 59u之觸點焊接至電路 板140之插座表面位置I49t上的觸點，將插座150安裝至電 路板140。當插座150被安裝至電路板14〇時，插座150被定 85201 1285006 位在由框架部Ilia到11 ld所畫出的固定架中央所形成之缺 口區之中間，且插座150之突狀平台154被定位在固定架n〇 之相對突狀平台114。 1C 160被定位在載入盤ι2〇與插座ι5〇之間，將IC ι6〇下部 1 69u上之觸點與插座1 5〇上部丨59t對應的觸點對準，且將 1(：160凸升上部1691與穿過載入盤12〇所形成之缺口對準， 此缺口是經由盤部121&至121d所畫出的。載入盤12〇與1(： 16〇 亦被對準以允許載入盤120之盤部12 1 c及12 1 d上的載入點 124菌合環繞ic 160之凸升上部i69t之載入點164。凸升上部 169t相對於載入點164是向上凸升的，所以當載入點124與 164彼此接觸的方式被嚆合時，凸升上部169t凸出穿過在載 入盤i2〇中所形成之缺口。在不同的實施例中，lc 16〇之實 際電路是位在1C 160封裝内之陶製晶片上，其位置一般在 凸升上邵169t的背面中央，且載入點164的定位是在凸升上 部169t的四周位置，有助於避免由載入盤12〇抵住上部Η% 所產生 <應力（其比載入點164更易碎），因此避免損壞Μ 16〇 電路板的機會。穿過由載入盤12〇所形成缺口之上部““的 突出亦允許一散熱片或其他冷卻裝置被設置於此而與上部 169t接觸且清除由載入盤12〇所造成的任何阻塞物，所以π 160内之電路所產±的熱可以經由上部16域|除。載入般 120部分地經由載入盤12〇盤部12U上的鉸鏈口 125裝至固= 架11〇,其省合固定架u。框架部llla中所形成之鉸：通： 115，且將1C 160扣在載入盤12〇與插座15〇之間。 載入槓桿130是對於載人槓桿⑽軸部137之共轴線轉動， 85201 1285006 導致載入槓桿130之載入點136嚆合載入盤120盤部12 lb上的 載入點126，且以致於槓桿柄13 8嗡合插座11 〇之槓桿卡勾 U8。鉸鏈口 i25與鉸鏈通道U5之間、載入點136與載入點ι26 之間、突出平台154與114之間及載入點124與載入點164之 間的嚆合共同施加力量在1C 160的下部169U及上部159t，其 下壓下部169u抵著上部159t，所以下部16911及上部159t兩者 的觸點彼此被壓入嚷合，形成其之間的電連接。 插座150被固定架114包圍，在插座15〇的所有側邊上的突 出平台154及114的設置允許固定架11〇將插座15〇變硬，且 因此有助於防止插座150因將插座15〇與IC ι6〇壓擠在一起 所使用的力量反應而產生彎曲或不同的曲線。將插座丨5〇變 硬有助於確保下壓IC 160下部169u而抵著插座15〇上部159t 之力f被平均分配在下部l69u及上部159t各處，所以下部 1 69u上的所有針腳以相等大小的力量被壓抵著上部1 5%上 的對應針腳。經由扣件113 a噶合固定孔丨43，固定架11 〇至 電路板140之附著進一步有助於插座15〇之變硬，允許固定 架no被強化而=防止它本身彎曲，雖然固定架11〇得自附著 至電路板14 0的強度程度可能必須被限制以確保沒有這麼多 的力量被傳迗至扣件113&與固定孔143之間的附著，以致於 發生曼延不足（creeping failures)所以有助於包含冷卻裝置 至扣件之附著的扣件丨13&的能力被放棄。 在二貝知例中，固足架11 〇可以被設計成在載入點通道 116之附近具有一物理停點以限制載入盤12〇可以朝著插座 150被下壓的程度，且因此限制由在載入點124之載入盤ι2〇 85201 -11- 1285006 抵著在載入點164之IC 160所施加的力，為的是保護IC i6〇 不被不注意的損壞。在一些實施例中，載入槓桿13 〇可以以 此一方法製造，在載入槓桿130的材料中有足夠的彎曲性， 所以載入點13 6相對於軸邵13 7之共軸線上的載入柄丨3 8可以 彎曲至某些受限的角度，為的是提供某些較寬的力矩以容 納實例，其中載入點136嚆合載入點ι26且在載入柄138尚未 餐合載入卡勾118之前，已經有效地下壓載入盤12()就載入 盤12 0可以或必須走。 圖2a-c描述可移除式固定1C之硬體的實施例。為了幫助 瞭解且對應圖2a-c中所描述的構件與圖1中所描述的構件， 圖2a-c之標記2xx的後兩個數字表示對應圖1之1χχ的後兩個 數字。與圖1中所描述的方式相同，固定架21〇、載入盤220 及載入槓桿230合力以將一1C可移除式地固定在具有插座附 著於電路板之噶合（1C、插座及電路板未顯示）。 固定架210通常是由框架部211a-d所組成，其形成一矩形 框，具有一矩形缺口，且矩形的各個角落具有框架部212。 各個框架部21 la-d提供其中之一個突出平台214，其售合插 座之對應突出平台且形成由框架部21 la-d所畫出的矩形缺 口的邊緣。鉸鏈通道21 5是由框架部2 11 a所提供，當欽鍵口 225被插入鉸鏈通道215時，以嚆合載入盤22〇之鉸鏈口 225。 載入點通道216及槓桿通道217是由框架部211 b所提供，其 提供一位置，載入點236及載入槓桿230之軸部237被中間插 入，所以軸部237在槓桿通道217内可旋轉地靜止且載入點 236突出穿過載入點通道216。 85201 -12- 1285006 各個框架邵212具有扣件213a以將固定架210固定至電路 板，及扣件213b以能讓冷卻裝置（未顯示）固定及定位，其與 可移除式固定1C之上部表面噶合以冷卻此IC。雖然扣件2丨3a 被描述成是導孔用於固定，其藉由突出穿過電路板且被焊 入經由電路板所形成的孔，那些精通元件之固定技藝者將 輕易暸解在不同的實施例中，扣件213a可以是任何變化形 式，包括，但不受限，鉚釘、螺絲或其他螺紋狀的扣件、 鋸齒狀邊緣之基板夾等。 載入盤220通常是由盤邵221 a-d所組成，形成一矩形且在 其中間具有一矩形缺口。鉸鏈口 225位於盤部221a旁邊，其 與固定架210之鉸鏈通道215嚆合，如先前所述。載入點226 被提供於盤部221b，當鉸鏈口 225被插入鉸鏈通道21 5且載 入盤220依著鉸鏈口 225與鉸鏈通道215之組合所產生之鉸鏈 朝向固定架210旋轉時，其凸進固定架21〇載入點通道216的 近處。在不同的可能貫施例中，至少鉸鏈口 2 2 5及/或載入 盤220之載入點226可以以彈簧材料或任何提供相類似彈性 的其他材料製造。 盤部221c及2_21d提供載入點224，其嚆合環繞可移除式固 足ic之凸升上部之對應載入點。在一實施例中，盤部e 及221d通常是在同一平面，所以載入點224通常是各由各盤 邯221c及221d的整個表面所組成。在此一實施例中，可能 所有四個盤邵221c及22Id形成一共同平面，且因此，載入 點224可以是由一共同表面所組成，該表面延伸所有四個盤 部221a-d，所以可移除式固定IC以一矩形佈局在載入點被 85201 -13 - 1285006 嚆合，該矩形佈局通常採用由盤部221a_d所形成的矩形形 狀。在另一個實施例中，盤部221c&221d可以被彎曲，所 以載入點224各位在各盤部22lc&221d的彎曲部分的最外弓 部，所以可移除式固定職噶合於載入點，覆蓋㈣最小 的表面積。在此一實施例中，連同其他可能的實施例，至 少盤部22 1 c-d可以以彈簧材料或任何提供類似彈性之變化 材料被製造。在另一個實施例中，載入點224是在被各盤部 221 c-d中或所包含的小凹洞或其他形式的突出物，所以一 可移除式固定1C被嚆合在載入點，在該1〇封裝上的最小特 定位置。 載入槓桿230是一大L形桿，其由槓桿柄238、軸部237及 載入點236所組成，槓桿柄238組成“L”形一邊且軸部23 7與 載入點236組成“L，’开j另一邊。軸部237被載入點236分隔開， 但形狀仍為一共軸，在其附近載入槓桿23〇在被插入固定架 210之槓桿通道2丨7之後可以被轉動，如先前所述。此載入 相桿23 0插入槓桿通道217的動作是將載入槓桿230放至一位 置以沿著軸部237之共軸被轉動，導致載入盤220被朝向固 定架210轉動後、載入點23 6在載入點通道216附近嚆合載入 盤220之載入點226，如先前所述。槓桿柄23 8提供一機械結 構’利用這結構轉動可以被作用，同時提供機械槓桿作用， 用元^載入點2 3 6嘆合載入點2 2 6時，施加一力通過載入點 236。此載入點236與載入點226之嚆合及鉸鏈口 225與鉸趟 通道215之嚆合可以合力固定且下壓載入盤220抵住固定架 210 ’如可移除式固定一 1〇之部分。 85201 •14- 1285006 在圖3 c中，載入槓桿3 3 0被旋轉，所以載入點3 3 6現在利 用槓桿柄33 8朝向電路板340旋轉而嚆合載入點326且槓桿柄 338蜜合槓桿卡勾318。槓桿卡勾318的作用是抓住載入槓桿 330至定位，因此有助於通過載入點336之力量維持以下壓 載入點326進入載入點通道316且朝向電路板340。利用此載 入槓桿330之旋轉，1C 360與插座35〇嚆合而形成可移除地 固定，所以1C 360之觸點現在嚆合插座35〇之觸點形成它們 之間的電連接。嚆合1C 360之觸點之插座35〇觸點被與噶合 電路板340觸點之插座350觸點電連接，因此在1€ 36〇觸點 與電路板340之間透過插座350形成電連接。 圖4描述1C至插座之構件的另一個實施例。構件4〇〇是由 固定架410、載入槓桿430a及430b、電路板440、插座450及 1C 460所組成。固定架410與載入槓桿43〇a&43〇b合力將… 460與插座450強壓在一起，以便將插座45〇上部45%的觸點 壓入與1C 460下部469ιι上觸點的蜜合中。 在構件的準備中，載入槓桿43〇a_b被放在固定架41〇與電 路板440之間“位置，分別將載入槓桿43(^及43讪之軸部 437a及437b與固定架410框架部411a及4Ub中所形成之載入 槓桿通道417a及417b對準，且將槓桿43〇a&43〇b之載入點 436a及436b對準以最終地突出分別穿過固定架41〇框架部 411&及41113所形成之載入點通道416&及41讣。經由固定架 410之扣件413&瀹合電路板44〇之固定孔443且將載入槓桿 430a及430b抓住在固定架41〇之載入槓桿通道“乃及“几内 且位於固定架410與電路板44〇之間，而將固定架41〇安裝至 85201 -16- 1285006 電路板440。 經由任何熟知技術將插座45〇下部459u之觸點焊至電路板 440插座表面位置449t的觸點，插座45〇被安裝至電路板 440。當插座450被安裝至電路板44〇時，插座45〇是被放在 穿過固定架41〇中間所形成缺口區域的正中央，該區域是由 框架部411&至441(1所畫出的區域，且插座45〇的突出平台454 被放在固定架410之反向突出平台414的位置。 1C 460被放置於適當位置以便將IC 46〇下部私如上的觸點 與插座450上部459t上的對應觸點對準。此對準且允許在ic 460凸升上部469t四周的載入點464被置於載入點通道416a 及416b的附近區域，以便允許載入槓桿43〇a&43〇b之載入 點436a及436b分別最終噶合載入點464。 載入槓桿430a及430b分別以載入槓桿430a&43〇b之軸部 437a及437b之軸被旋轉，導致載入點436a及436b各噶合載 入點464且以至於槓桿柄438a及438b分別嚆合插座410之槓 桿卡勾41 8a及418b。突出平台454與4 14之間及載入點436a 及436b與載入點464之間的嚷合合力施加力量垂直ic 460下 部469u及上部459t，其將下部469u下壓抵住上部459t，所以 下部469u及上部459t上之觸點彼此被壓入嚆合，在它們之 間形成電連接。相對於載入點464，凸升上部469t上向上凸 出的’所以凸升上部469t凸出於載入槓桿430a及430b之載 入點436a及436b上方，載入槓桿430a及430b已經被旋轉以 導致載入點430a及436b嚆合載入點464。在不同的實施例 中’ 1C 460的實際電路是位於ic 460封裝内的陶製晶片上， 85201 -17- 1285006 在凸升上部469t的後面中央位置，且載入點4M的佈置是在 凸升上部469t四周的位置，這樣有助於避免由載入槓桿430a 及430b所施加之力量抵住上部469t(其可能比載入點牝4更易 碎），因此避免1C 460電路可能的損壞。超出載入點43以及 436b之上部469t的凸出亦允許一散熱片或冷卻裝置被安 裝，與上部469t接觸且清除可能由載入槓桿43〇a&43〇b所 造成之任何阻礙，所以在IC 46〇内電路所產生熱可以透過 上部469t被導除。 插座450四個邊上的突出平台454及414之定位允許固定架 410強化插座450，插座450是被固定架414所包圍，因此有 助於防止插座450變彎或因將插座450與1(： 46〇壓在一起之 力量作用而產生其他的彎曲。強化插座45〇有助於確保將IC 460下部469u下壓抵住插座450上部459t之力量平均分佈在 整個下邵469u及上邵459t上，所以下部469ii上的所有針腳 以等里的力被下壓抵住上部459t之對應針腳。要將插座450 ’交堅硬尚可以藉助將固定架41 〇裝至電路板44〇，其經由扣 件413a噶合固定孔443，允許固定架41〇變堅硬而不彎曲， 雖然固足架41 0從此至電路板440之安裝所得到變堅硬的程 度必須被限制以確保沒有這麼多的力被傳送至扣件4丨3 a與 固定孔443之間的安裝而導致蔓延不足發生，所以扣件413a 助於支撐冷卻裝置安裝至扣件4 13 b的能力被影響。 在一些實施例中，固定架41 0可以被設計成具有物理停點 (physical stop)，其位於載入點通道4 1 6a及416b的附近，限 制載入點43 6a及43 6b可以被旋轉朝向插座45〇的角度且進入 85201 -18- 1285006 與載入點464之噶合，且因此限制載入槓桿430a& 430b載入 點43 6a及43 6b抵住1C 460載入點464所施加之力以保護1C 46〇不小心被損壞。在一些實施例中，載入槓桿43〇&及43〇b 可以用具有足夠彈性的材料製造，所以載入點436a及436b 相對於分別在軸部437a及437b共軸線上的載入柄438a及 438b可以收縮至某些限制角度，提供一些較寬的容許度容 納載入點436a及436b其中之一或兩者嚅合載入點464之距離 且有效地將1C 460壓住，在一或其他的載入柄43 8 a及43 8b分 剎尚未被嚆合槓桿卡勾41 8a及418b前1C 460可以或應該被放 置。 圖5藉由一實施例描述1(：之可移除式固定。為了有助於瞭 解且說明圖5中所描述構件與圖4中所描述構件之關係，圖5 標記5xx的後兩個數字通常對應圖4標記4χχ的後兩·個數字。 與圖4中所描述的方式相同，固定架510及載入槓桿53〇a及 530b合力可移除是固定IC 560，1C 560與安裝在電路板540 之插座550嚆合。 固足架5 1 0已經被安裝至電路板540，其具有已經分別被 放置在槓桿通道517a及517b内之載入槓桿53〇a&53〇b，槓 桿通道517a及5 17b市在固定架510内所形成且位於固定架 5 10與電路板540之間。插座550已經被放置於適當位置，所 以插座550被組成固定架510之框架部所包圍，且被安裝至 黾路板540，插座550具有觸點能形成插座550與電路板540 之間的黾連接。1C 5 6 0已經被放至於插座5 5 〇頂端且與其接 觸，所以1C 560之觸點與插座550之觸點被對準。 85201 -19- 1285006 載入槓桿530a及530b相對固定架5 10且朝向電路板54〇被 万疋轉，所以載入槓桿53〇a及53叽之載入點53以及53讣分別 嚷合1C 560之各載入點564，且槓桿柄538a& 538b分別嚆合 t、桿卡勾518a及518b。槓桿卡勾518a及518b的作用是分別 將載入槓桿530a及530b保持在適當位置，因此有助於維持 透過載入點536a及536b隻力量以壓在各載入點564朝向電路 板540。藉由載入槓桿53〇&及53〇1)之旋轉，IC 56〇被可移除 地固疋在與插座550之嚆合中，所以IC 56〇之觸點現在嚆合 插座550之觸點，形成它們之間的電連接。嚆合ic 56〇觸點 之插座550觸點被電連接至嚆合電路板54〇觸點之插座55〇觸 點，因此透過插座550形成IC 56〇與電路板54〇觸點之間的 電連接。 圖6描述一實施例之流程圖，其為一構件至一電路板之安 裝的實施例。在方塊610，構件之載入槓桿被放置於構件之 固定架的槓桿通道内。方塊620中，構件之插座被放置於穿 過固定架所形成缺口之中央。方塊63〇中，被使用來允許構 件被取放機（pick-and-place machine)抓住以放置在電路板之 取放蓋被放置在與插座接觸的位置，這位置與稍後^安裝 於構件内的位置相同。方塊640中，構件載入盤之鉸鏈口被 插進固定架之鉸鏈通道内。方塊65〇中，載入盤在由鉸鏈口 及鉸鏈通道所產生之鉸鏈上朝向插座旋轉，同時允許取放 機抓住取放蓋之凸出部，凸出穿過載入盤所形成之缺口。 方塊660中，載入槓桿朝向插座旋轉，以至於載入槓桿上的 載入點嗡合載入盤上的載入點，且以至於載入槓桿之槓桿 85201 -20- 1285006 柄嚆合固定架上的槓桿卡勾。方塊670中，固定架、載入槓 桿、插座、取放蓋及載入盤被放置在電路板之表面上，在 此構件被安裝。方塊6 8 0中，插座被焊至電路板表面，且方 塊690中，固定架亦被安裝至電路板上，使用任何不同的可 能扣件。 圖7描述一流程圖，其為將1C安裝至一構件之實施例。方 塊710中，一 1C被放在與構件之插座接觸的位置，1C上針腳 與插座針腳對準，以便它們可以一起被壓入嚆合。方塊720 中，構件載入盤之鉸鏈口被插入包圍插座之構件固定架的 佼鏈通道内。方塊730中，載入盤朝向插座且朝向IC(IC依 然如稍早所述與插座對準）旋轉，導致載入盤之載入點嚆合 1C上的載入點且允許1C的凸升上部表面凸出穿過載入盤中 間所形成的缺口。方塊740中，載入槓桿朝向插座及固定架 旋轉，以便將載入槓桿上的載入點嚆合載入盤之載入點， 且載入槓桿之槓桿柄嚆合固定架上的槓桿卡勾。這樣會導 致載入盤嚆合1C載入點之載入點壓抵著1C載入點。載入盤 載入點與1C載入點之間的嚆合組合、載入盤鉸鏈口與固定 架鉸鏈通道之間的嚆合組合、載入槓桿與先前載入槓桿被 放置其内之固定架槓桿通道之間的嚆合組合及固定架上突 出平台與插座上突出平台之間的嚆合組合都一起將1C壓抵 著插座，所以與插座針腳對準之1C針腳嚜合那些插座針腳。 雖然1C透過插座被固定再電路板的實施例已經被討論， 但是藉由本發明，1C以外的不同元件/裝置可以被固定在PCB 以外的不同表面上，正如那些精通此技藝者所能輕易理解 85201 -21 - 1285006 的。 在此所教導的已經結合較佳貫施例被示範。經過先前^ 明，許多的替代、修改、變化及使用對精通此技藝者將是 顯而易見的。精通此技藝者應瞭解，如此後申請專利範圍 之發明可以被實施支援使用不同封裝之廣泛不同裝置，包 括，但不受限，針腳柵格陣列、平台柵格陣列及球狀柵格 陣列。 r圖式簡單說明】 鑑於下列的詳細說明，如下文所提出申請專利範圍之本 發明目的、功能及優點對精通此技藝者將是顯而易見的， 其中： 圖1描述一 1C及一插座之構件的實施例。 圖2a、2b及2c描述1C固定硬體之實施例。 圖3a、3b及3c描述將一 1C安裝至一插座之實施例。 圖4描述一 1C及一插座之構件的另一實施例。 圖5描述描述1C固定硬體之另一實施例。 圖6描述將一構件安裝至一電路板之實施例的流程圖。 圖7描述將ic安裝進入一構件之實施例的流程圖。 夺號說明1 100 構件 110 固定架 1 1 la-11 Id框架部 113a，113b 扣件 114 突出平台 85201 -22- 1285006 115 鉸鏈通道 116 載入點通道 118 槓桿卡勾 120 載入盤 121a-121d 盤部 124 載入點 125 鉸鏈口 126 載入點 130 載入槓桿 136 載入點 137 軸部 138 載入柄 140 電路板 143 固定孔 149t 插座表面位置 150 插座 154 突出平台 159t 上部 159u 下部 160 積體電路 164 載入點 169t 上部 169u 下部 210 固定架 85201 -23 - 1285006 211a-211d 212 213a， 213b 214 215 216 217 218 220 221a-221d 224 225 226 230 236 237 238 310 315 316 318 320 324 325 85201 框架部 框架部 扣件 突出平台 鉸鏈通道 載入點通道 槓桿通道 槓桿卡勾 載入盤 盤部 載入點 鉸鏈口 載入點 載入槓桿 載入點 軸部 槓桿柄 固定架 鉸鏈通道 載入點通道 槓桿卡勾 載入盤 載入點 鉸鏈口 -24- 1285006 326 載入點 330 載入槓桿 336 載入點 338 槓桿柄 340 電路板 350 插座 360 積體電路 364 載入點 400 構件 410 固定架 411a-411d 框架部 414 突出平台 416a，416b 載入點通道 417a，417b 載入槓桿通道 418a，418b 槓桿卡勾 430a，430b 載入槓桿 436a，436b 載入點 437a，437b 軸部 438a， 438b 槓桿柄 440 電路板 443 固定？L 449t 插座表面位置 450 插座 454 85201 突出平台 25- 1285006 459t 上部 459u 下部 460 積體電路 464 載入點 469t 凸升上部 469u 下部 510 固定架 517a， 517b 槓桿通道 518a， 518b 槓桿卡勾 530a， 530b 載入槓桿 536a， 536b 載入點 540 電路板 550 插座 560 積體電路 564 載入點 -26- 85201[Technical Field of the Invention] A device for fixing an integrated circuit (IC) component to electrically connect a socket, the ic component being packaged in a platform grid array package. [Prior Art 1 The continuous effort of the boring tool to increase the functionality of an integrated circuit (IC) such as a central processing unit (CPU) is constantly in demand to provide more electrical contact on a package that typically contains 1 (: Points (often referred to as "pins") allow for more interaction between this IC and other components. However, 'is a special one' (1: increasing the number of electrical connections creates a challenge, is to find out A method of accommodating an increased contact on an IC package, and this method will still be provided - a method that can be implemented to mount a 1C package (and thus mount the IC into a board) to a board Establishing electrical connections to other components. Responding to this ever-increasing demand to provide more electrical contacts for IC use, different forms of via pins, surface mount contacts, foil contacts, solder balls, etc. have been invented Time. When the IC will be permanently mounted on a board, it is possible to design an electrical contact trace on at least one IC package surface, which will allow those contacts to be soldered to the board surface. Other situations are 1C must Removably mounted to a circuit board. Users who are unfamiliar with the product containing the board must be able to install the 1C to the board or remove the IC from the board without the need for a large number of special tools. In this case, the user is required to solder or unpack the IC that is packaged in a package and has a very large number of contacts that are rarely considered acceptable or desirable, and therefore a socket must be used. The socket 201201 1285006 can be removably mounted on the circuit board. The socket that can support the removably fixing of the 1C of the pin grid array (PGA) package to the circuit board has been designed. The use of pins in a PGA package requires that the socket be designed to "catch," the pins along the length of the pins with relative force to form an electrical connection. This requires a mechanical structure within the socket that limits the possible density of the pins. And thus limit the actual number of pins on a particular package that can be supported. What we want is to provide a pinless socket, and thus there is no need to use such a mechanical structure to the side forces within the socket. The 1C package is pressed against the socket, and the socket can be provided to be pressed against the corresponding contact according to the socket contact. Unfortunately, the pressure required to press each pin of the socket against the corresponding pin of the package requires a certain amount of Force to ensure a good electrical connection, and this pressure is cumulative so that the sum of the required forces is proportional to the number of corresponding pairs of pins that must be pressed together. The cumulative sum of this force causes the design of the mechanism The challenge, including the need to evenly distribute this force in all the corresponding pin pairs, ensures that it receives the required force without excessive force. A very large number of corresponding pin pairs are included in it, resulting in a considerable cumulative power. The concern is whether the force is averaged so as not to damage the socket or the 1C package. In the case of the description and the following description, a detailed understanding of the proposed details is known. Scope Implementing embodiments of the invention, these particular details h are necessary. "口, although it is said that the 1C package has a bump grid array (LGA) contact, it is known that the technology can easily understand 85201 with other forms of contacts. 1285006 Other embodiments can also be used without departing from the spirit and scope of the present invention. Removably fix a 1 (the package fit and the 1C package and the socket) The frame of the touch-fit socket and the one-in-one socket are pressed together with the 1C package, and the ground is acted upon. It is disclosed that it is properly combined with a socket defect. Specifically, a 1C package The loading disk transmits power through the use of a loading lever. [Embodiment] FIG. 1 depicts an embodiment of a 1C to a socket member. The member 1 is composed of a solid frame 110, a loading plate 120, and The input lever 13 〇, the circuit board 14 〇, the socket 15 〇 and the IC 160 are composed. The truss 110, the loading tray 120 and the loading rail 130 cooperate to forcibly press the 1C 160 and the socket 150 together so as to press the socket 15 The upper contact 159t is press-fitted with the lower contact 169u of the 1C 160. In the production process, the loading lever 13 is disposed between the fixing frame 11A and the circuit board 140, and the loading lever channel formed in the frame 137111b of the loading lever 13〇 and the frame 邰111b of the fixing frame ι (not shown) aligned, and the loading point 1 6-1 of the lever 130 is aligned to finally protrude by the loading point passage 116_ formed through the portion mb of the holder 11 。. The fixing frame 11 〇 is fixed The fastener 113a of the frame 11 is mounted to the circuit board 14A, and the fastener 13a is fitted to the fixing hole 143 of the circuit board 14 and the loading lever 13 is inserted into the loading lever channel of the fixing frame 11 Located between the mount 110 and the circuit board 14A. The socket 150 is mounted to the circuit board 140 by soldering the contacts of the lower portion i59u of the socket 150 to the contacts on the socket surface location I49t of the circuit board 140 via any well known technique. When the socket 150 is mounted to the circuit board 14A, the socket 150 is positioned 85201 1285006 in the middle of the notch area formed by the center of the holder drawn by the frame portions Ilia to 11 ld, and the protruding platform 154 of the socket 150 Positioned on the opposite projection platform 114 of the fixed frame n. 1C 160 is positioned Between the input pad ι2〇 and the socket ι5〇, align the contacts on the lower part of the IC ι6〇1 69u with the contacts corresponding to the upper 丨59t of the socket 1 5,, and put 1 (:160 bulge upper 1691 and wear The gap formed by the loading disk 12 is aligned, and the notch is drawn through the disk portions 121 & to 121d. The loading trays 12 and 1 (: 16 〇 are also aligned to allow loading of the disk 120 The loading point 124 on the disk portions 12 1 c and 12 1 d is brought into the loading point 164 of the upper portion i69t of the ic 160. The raised upper portion 169t is upwardly raised relative to the loading point 164, so that when the loading points 124 and 164 are brought into contact with each other, the raised upper portion 169t protrudes through the loading disk i2〇. The gap. In various embodiments, the actual circuit of lc 16 is on a ceramic wafer in a 1C 160 package, typically located at the center of the back of the raised 169t, and the loading point 164 is positioned at the upper portion of the projection. The circumferential position of 169t helps to avoid the <stress (which is more fragile than the loading point 164) caused by the loading plate 12 〇 against the upper Η%, thus avoiding the chance of damaging the 〇16〇 board. The protrusion "" above the notch formed by the loading disk 12" also allows a heat sink or other cooling device to be placed there to contact the upper portion 169t and to remove any obstructions caused by the loading disk 12, Therefore, the heat generated by the circuit within π 160 can be divided by the upper 16 domain|. The loading portion 120 is attached to the solid frame 11 through the hinge port 125 on the disk portion 12U of the loading tray 12, which saves the holder u. The hinge formed in the frame portion 111a is: 115, and the 1C 160 is fastened between the loading tray 12A and the socket 15A. The loading lever 130 is rotated coaxially with respect to the shaft portion 137 of the passenger lever (10), and 85201 1285006 causes the loading point 136 of the loading lever 130 to engage the loading point 126 of the disk portion 12 lb of the loading disk 120, and The lever handle 13 8 is connected to the lever 11 8 of the socket 11 〇. The coupling between the hinge port i25 and the hinge channel U5, between the loading point 136 and the loading point ι26, between the protruding platforms 154 and 114, and between the loading point 124 and the loading point 164 exerts a force at 1C 160 The lower portion 169U and the upper portion 159t have a lower pressing portion 169u against the upper portion 159t, so that the contacts of the lower portion 16911 and the upper portion 159t are press-fitted to each other to form an electrical connection therebetween. The socket 150 is surrounded by the holder 114, and the arrangement of the protruding platforms 154 and 114 on all sides of the socket 15〇 allows the holder 11 to harden the socket 15 and thus helps prevent the socket 150 from being blocked by the socket 15 The force used in the extrusion with IC ι6 reacts to produce a curved or different curve. Hardening the socket 丨5〇 helps to ensure that the force f of the lower portion 169u of the IC 160 and the upper portion 159t of the socket 15 is equally distributed among the lower portion 169u and the upper portion 159t, so that all the pins on the lower portion 169u are equal. The strength of the size is pressed against the corresponding pin on the upper 5%. The fixing hole 43 is twisted via the fastener 113a, and the attachment of the fixing frame 11 to the circuit board 140 further contributes to the hardening of the socket 15, allowing the fixing frame no to be strengthened and preventing itself from being bent, although the fixing frame 11 The degree of strength of the self-adhesive to the board 140 may have to be limited to ensure that no such force is transferred to the attachment between the fastener 113& and the fixing hole 143, so that creeping failures occur. The ability to assist the fasteners 13& including the attachment of the cooling device to the fastener is discarded. In the second example, the solid frame 11 can be designed to have a physical stop near the load point channel 116 to limit the extent to which the loading disk 12 can be depressed toward the socket 150, and thus The force applied by the loading pad ι2 〇 85201 -11 - 1285006 at the loading point 124 against the IC 160 at the loading point 164 is such that the protection IC i6 is not inadvertently damaged. In some embodiments, the loading lever 13 can be manufactured in a manner that is sufficiently flexible in the material of the loading lever 130, so that the load point 13 6 is on a common axis with respect to the axis 13 7 The shank 38 can be bent to some limited angle in order to provide some wider torque to accommodate the instance, wherein the loading point 136 is coupled to the loading point ι26 and the loading handle 138 has not yet been loaded. Before entering the hook 118, the disk 12 () has been effectively loaded and loaded onto the disk 12 0 or may have to go. Figures 2a-c depict an embodiment of a removable fixed 1C hardware. To aid in understanding and corresponding to the components depicted in Figures 2a-c and the components depicted in Figure 1, the last two digits of the indicia 2xx of Figures 2a-c represent the last two digits corresponding to Figure 1 of Figure 1. In the same manner as described in FIG. 1, the holder 21, the loading tray 220 and the loading lever 230 are combined to removably fix a 1C to a coupling (1C, socket, and socket) having a socket attached to the circuit board. The board is not shown). The holder 210 is generally composed of frame portions 211a-d which form a rectangular frame having a rectangular notch and each corner of the rectangle has a frame portion 212. Each of the frame portions 21 la-d provides one of the projecting platforms 214 which sells the corresponding projecting platforms of the sockets and which form the edges of the rectangular cutouts drawn by the frame portions 21 la-d. The hinge channel 21 5 is provided by the frame portion 2 11 a to engage the hinge port 225 of the disk 22 when the key port 225 is inserted into the hinge channel 215. The loading point channel 216 and the lever channel 217 are provided by the frame portion 211b, which provides a position in which the loading point 236 and the shaft portion 237 of the loading lever 230 are interposed, so that the shaft portion 237 is within the lever passage 217. Rotating stationary and the loading point 236 protrudes through the loading point channel 216. 85201 -12- 1285006 Each frame SHA 212 has a fastener 213a for fixing the fixing bracket 210 to the circuit board, and a fastening member 213b for fixing and positioning the cooling device (not shown), which is fixed to the upper part of the removable fixing 1C The surface is twisted to cool the IC. Although the fastener 2丨3a is described as a guide hole for fixing, which protrudes through the circuit board and is soldered into the hole formed through the circuit board, those skilled in the art of fixing components will easily understand the different implementations. In the example, the fastener 213a can be any variation including, but not limited to, rivets, screws or other threaded fasteners, substrate holders with serrated edges, and the like. The loading tray 220 is typically comprised of discs 221a-d that form a rectangle with a rectangular indentation therebetween. The hinge port 225 is located beside the disk portion 221a and is coupled to the hinge channel 215 of the holder 210 as previously described. The loading point 226 is provided to the disk portion 221b, and when the hinge port 225 is inserted into the hinge channel 21 5 and the loading disk 220 is rotated toward the fixing frame 210 by the hinge generated by the combination of the hinge port 225 and the hinge channel 215 The insertion frame 21 is loaded into the vicinity of the point channel 216. In various possible embodiments, at least the hinge port 2 25 and/or the loading point 226 of the loading disk 220 can be fabricated from a spring material or any other material that provides similar elasticity. The disk portions 221c and 2_21d provide a loading point 224 that fits over a corresponding loading point that surrounds the upper portion of the removable solid foot ic. In one embodiment, the disc portions e and 221d are generally in the same plane, so the loading points 224 are typically each composed of the entire surface of each of the discs 221c and 221d. In this embodiment, it is possible that all four disk trays 221c and 22Id form a common plane, and therefore, the loading point 224 may be composed of a common surface that extends all four disk portions 221a-d, so The removable fixed IC is folded in a rectangular layout at the loading point by 85201 -13 - 1285006, which generally adopts a rectangular shape formed by the disk portions 221a-d. In another embodiment, the disk portions 221c & 221d can be bent, so that the loading point 224 is at the outermost bow portion of the curved portion of each of the disk portions 22lc & 221d, so the removable fixed position is suitable for loading. Point, cover (4) the smallest surface area. In this embodiment, along with other possible embodiments, at least the disk portions 22 1 c-d may be fabricated from a spring material or any varying material that provides similar elasticity. In another embodiment, the loading point 224 is a small recess or other form of protrusion contained in or contained by each disk portion 221 cd, so a removable fixed 1C is coupled to the loading point. The smallest specific location on the 1〇 package. The loading lever 230 is a large L-shaped rod composed of a lever handle 238, a shaft portion 237 and a loading point 236. The lever handle 238 constitutes an "L" shaped side and the shaft portion 23 7 and the loading point 236 constitute "L" , the other side of the opening j. The shaft portion 237 is separated by the loading point 236, but the shape is still a common axis, and the loading lever 23 is mounted in the vicinity thereof and can be rotated after being inserted into the lever passage 2丨7 of the fixing frame 210. As previously described, the action of the loading phase lever 23 into the lever passage 217 is to place the loading lever 230 to a position to be rotated along the common axis of the shaft portion 237, causing the loading disk 220 to be oriented toward the holder. After the rotation of 210, the loading point 23 6 kneads the loading point 226 of the loading disk 220 near the loading point channel 216, as previously described. The lever handle 23 8 provides a mechanical structure that can be acted upon by this structure. At the same time, a mechanical lever is provided. When the loading point 2 2 6 is used to load the point 2 2 6 , a force is applied through the loading point 236. The loading point 236 is coupled with the loading point 226 and the hinge port The coupling of 225 and the hinge channel 215 can be fixed together and the lower loading disk 220 is pressed against the holder 210' as a removable type Part of 1〇. 85201 • 14- 1285006 In Figure 3c, the loading lever 3 3 0 is rotated, so the loading point 3 3 6 is now rotated toward the board 340 by the lever handle 338 to fit the loading point 326 And the lever handle 338 is engaged with the lever hook 318. The lever hook 318 functions to grasp the loading lever 330 to the position, thereby helping to maintain the following pressure loading point 326 into the loading point channel by the force of the loading point 336. 316 and toward the circuit board 340. With the rotation of the loading lever 330, the 1C 360 is coupled to the socket 35 to form a removably fixed position, so that the contacts of the 1C 360 are now joined to the contacts of the socket 35 to form them. The electrical connection between the contacts of the 1C 360 contact 35 〇 contacts is electrically connected to the contacts 350 of the contacts of the splicing circuit board 340, thus passing between the 1 € 36 〇 contact and the circuit board 340 The socket 350 forms an electrical connection. Figure 4 depicts another embodiment of a 1C to socket member. The member 4A is comprised of a holder 410, loading levers 430a and 430b, a circuit board 440, a socket 450, and a 1C 460. The frame 410 and the loading lever 43〇a & 43〇b work together to force the 460 and the socket 450 Together, in order to press the upper 45% of the contacts of the socket 45 into the honey of the contacts on the lower part 469 of the 1C 460. In the preparation of the components, the loading lever 43〇a_b is placed on the holder 41 and the board Between the 440 positions, the loading levers 43 (the shaft portions 437a and 437b of the ^ and 43 分别 are respectively aligned with the loading lever passages 417a and 417b formed in the frame portions 411a and 4Ub of the fixing frame 410, and the lever 43 is used. The loading points 436a and 436b of 〇a & 43〇b are aligned to finally protrude through the loading point passages 416 & and 41 形成 formed by the frame members 411 & and 41113 respectively. The fastening holes 443 of the fixing circuit board 44 are clamped through the fasteners 413 of the fixing frame 410 and the loading levers 430a and 430b are grasped in the loading lever passages of the fixing frame 41 and are located in the fixing frame 410. Between the circuit board 44A and the mounting frame 41A is mounted to the 85201-16-1285006 circuit board 440. The contacts of the socket 45 lower portion 459u are soldered to the contacts of the board 440 socket surface location 449t via any well known technique, and the socket 45 is mounted to the circuit board 440. When the socket 450 is mounted to the circuit board 44, the socket 45 is placed in the center of the notch area formed through the middle of the holder 41, which is drawn by the frame portions 411 & 441 (1) The area, and the protruding platform 454 of the socket 45〇 is placed at the position of the reverse protruding platform 414 of the mounting frame 410. The 1C 460 is placed in position to place the IC 46 on the lower side of the contact and the upper portion of the socket 450 on the 459t. Corresponding contact alignment. This alignment and allows the loading point 464 around the ic 460 raised upper portion 469t to be placed in the vicinity of the load point channels 416a and 416b to allow the loading lever 43〇a&43〇b The loading points 436a and 436b are finally coupled to the loading point 464. The loading levers 430a and 430b are respectively rotated by the axes of the shaft portions 437a and 437b of the loading levers 430a & 43〇b, resulting in the loading points 436a and 436b. Each of the kneading load points 464 is such that the lever handles 438a and 438b respectively engage the lever hooks 41 8a and 418b of the socket 410. The protruding platforms 454 and 4 14 and the loading points 436a and 436b and the loading point 464 The combined force of the force exerts a vertical ic 460 lower 469u and an upper 459t, which will be under The 469u is pressed against the upper portion 459t, so the contacts on the lower portion 469u and the upper portion 459t are press-fitted into each other to form an electrical connection therebetween. With respect to the loading point 464, the upper portion 469t is convex upwardly. So the raised upper portion 469t protrudes above the loading points 436a and 436b of the loading levers 430a and 430b, and the loading levers 430a and 430b have been rotated to cause the loading points 430a and 436b to engage the loading point 464. In the embodiment, the actual circuit of '1C 460 is on the ceramic wafer in the ic 460 package, 85201 -17- 1285006 is at the center of the rear of the upper portion 469t, and the loading point 4M is arranged around the upper portion 469t. The position, which helps to avoid the force exerted by the loading levers 430a and 430b against the upper portion 469t (which may be more fragile than the loading point 牝4), thus avoiding possible damage to the 1C 460 circuit. Exceeding the loading point 43 and The projection of the upper portion 469t of the 436b also allows a heat sink or cooling device to be mounted, in contact with the upper portion 469t and clearing any obstruction that may be caused by the loading levers 43a & 43b, so in the IC 46 Produce heat through The upper portion 469t is deflected. The positioning of the protruding platforms 454 and 414 on the four sides of the socket 450 allows the holder 410 to strengthen the socket 450, which is surrounded by the holder 414, thereby helping to prevent the socket 450 from being bent or The socket 450 and 1 (: 46 〇 press together the force to produce other bending. Strengthening the socket 45〇 helps to ensure that the force of pressing the lower portion 469u of the IC 460 against the upper portion 459t of the socket 450 is evenly distributed over the entire lower 469u and upper 459t, so that all the pins on the lower 469ii are pressed in equal force. Press against the corresponding stitch of the upper 459t. To secure the socket 450', it is possible to attach the fixing frame 41 to the circuit board 44, which is folded by the fastening hole 443 via the fastener 413a, allowing the fixing frame 41 to be hardened without bending, although the fixing frame 41 0 The degree of hardening from the installation of the circuit board 440 must be limited to ensure that no such force is transmitted to the mounting between the fastener 4丨3a and the fixing hole 443, resulting in insufficient spread, so the fastener 413a The ability to assist in supporting the installation of the cooling device to the fastener 4 13 b is affected. In some embodiments, the mount 41 0 can be designed to have a physical stop located near the load point channels 4 16a and 416b, and the limit load points 43 6a and 43 6b can be rotated toward The angle of the socket 45 turns and enters the coupling of 85201 -18-1285006 with the loading point 464, and thus limits the force exerted by the loading lever 430a & 430b loading points 43 6a and 43 6b against the 1C 460 loading point 464 To protect 1C 46 〇 accidentally damaged. In some embodiments, the loading levers 43〇& and 43〇b can be made of a material that is sufficiently resilient so that the loading points 436a and 436b are relative to the loading handles 438a on the common axes of the shaft portions 437a and 437b, respectively. And 438b can be retracted to certain limiting angles, providing some wider tolerance to accommodate one or both of the loading points 436a and 436b to fit the loading point 464 and effectively press the 1C 460, in one or The other loading handles 43 8 a and 43 8b are not yet engaged with the lever hooks 41 8a and 418b. The front 1C 460 can or should be placed. Figure 5 is a removable fixation by an embodiment. To help understand and illustrate the relationship of the components depicted in Figure 5 to the components depicted in Figure 4, Figure 5 marks the last two digits of 5xx. Usually corresponds to the last two digits of Figure 4 in Figure 4. As in the manner described in Figure 4, the mounting bracket 510 and the loading levers 53A and 530b are collectively removable to be fixed IC 560, 1C 560 and mounted on the circuit. The socket 550 of the board 540 is engaged. The foot frame 510 has been mounted to the circuit board 540 with loading levers 53a & 53b, which have been placed in the lever channels 517a and 517b, respectively, lever channel 517a And the city of 5 17b is formed in the fixing frame 510 and is located between the fixing frame 5 10 and the circuit board 540. The socket 550 has been placed in a proper position, so the socket 550 is surrounded by the frame portion constituting the fixing frame 510 and is installed. To the circuit board 540, the socket 550 has contacts to form a 黾 connection between the socket 550 and the circuit board 540. The 1C 560 has been placed at the top of the socket 5 5 且 and is in contact therewith, so the contacts and sockets of the 1C 560 The contacts of the 550 are aligned. 85201 -19- 1285006 Loading lever 53 0a and 530b are rotated relative to the mounting bracket 5 10 and toward the circuit board 54. Therefore, the loading points 53 and 53 of the loading levers 53A and 53叽 respectively match the loading points 564 of the 1C 560, and The lever handles 538a & 538b respectively engage the t and lever hooks 518a and 518b. The lever hooks 518a and 518b function to hold the loading levers 530a and 530b in position, respectively, thereby helping to maintain the transmission point 536a and 536b only forces to press at each loading point 564 toward the circuit board 540. By loading the rotation of the levers 53〇 & and 53〇1), the IC 56 is removably secured to the socket 550. Medium, so the contacts of the IC 56〇 now blend the contacts of the socket 550 to form an electrical connection between them. The socket 550 contact of the ic 56 〇 contact is electrically connected to the socket 55 〇 contact of the 电路 电路 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 54 connection. Figure 6 depicts a flow diagram of an embodiment of an embodiment of a component to a circuit board. At block 610, the loading lever of the member is placed in the lever passage of the holder of the member. In block 620, the socket of the component is placed in the center of the gap formed by the mounting bracket. In block 63, it is used to allow the member to be grasped by a pick-and-place machine to be placed on the board where the pick-and-place cover is placed in contact with the socket, this position and later mounted on The locations within the components are the same. In block 640, the hinge opening of the component loading disk is inserted into the hinge channel of the mounting bracket. In block 65, the loading disk rotates toward the socket on the hinge generated by the hinge port and the hinge channel, and allows the pick and place machine to grasp the protrusion of the pick-and-place cover to protrude through the gap formed by the loading disk. . In block 660, the loading lever is rotated toward the socket such that the loading point on the loading lever is coupled to the loading point on the loading disk, and the lever lever 85201 -20- 1285006 is fitted to the mounting bracket. The lever on the hook. In block 670, the holder, the loading bar, the socket, the pick and place cover, and the loading tray are placed on the surface of the board where the component is mounted. In block 680, the socket is soldered to the surface of the board, and in block 690, the holder is also mounted to the board using any of a variety of possible fasteners. Figure 7 depicts a flow diagram of an embodiment in which 1C is mounted to a component. In block 710, a 1C is placed in contact with the socket of the component, and the pins on 1C are aligned with the socket pins so that they can be pressed together. In block 720, the hinge opening of the component loading disk is inserted into the chain channel of the component holder surrounding the socket. In block 730, the loading disk is oriented toward the socket and is rotated toward the IC (the IC remains aligned with the socket as described earlier), causing the loading point of the loading disk to match the loading point on 1C and allowing the upper portion of 1C to be raised. The surface protrudes through the gap formed in the middle of the loading disk. In block 740, the loading lever is rotated toward the socket and the holder to knead the loading point on the loading lever into the loading point of the disk, and the lever handle of the loading lever is engaged with the lever hook on the fixing frame. . This will cause the load point of the loading disc to match the 1C load point to be pressed against the 1C load point. Loading combination between the loading point of the disk and the 1C loading point, the combination of the loading plate hinge and the hinge channel of the holder, the loading lever and the holder in which the previous loading lever is placed The twisting combination between the lever passages and the twisting combination between the protruding platform on the mounting bracket and the protruding platform on the socket together press 1C against the socket, so the 1C stitches aligned with the socket pins engage those socket pins. Although the embodiment in which the 1C is fixed through the socket and the circuit board has been discussed, by the present invention, different components/devices other than the 1C can be fixed on different surfaces other than the PCB, as those skilled in the art can easily understand 85201. -21 - 1285006. What has been taught herein has been demonstrated in connection with preferred embodiments. Many alternatives, modifications, variations and uses will be apparent to those skilled in the art. Those skilled in the art will appreciate that the inventions of the scope of the claims can be implemented to support a wide variety of different devices using different packages, including, but not limited to, pin grid arrays, platform grid arrays, and ball grid arrays. BRIEF DESCRIPTION OF THE DRAWINGS The objects, functions, and advantages of the invention will be apparent to those skilled in the <RTIgt; Example. Figures 2a, 2b and 2c depict an embodiment of a 1C fixed hardware. Figures 3a, 3b and 3c depict an embodiment of mounting a 1C to a socket. Figure 4 depicts another embodiment of a 1C and a socket member. Figure 5 depicts another embodiment depicting a 1C fixed hardware. Figure 6 depicts a flow diagram of an embodiment of mounting a component to a circuit board. Figure 7 depicts a flow diagram of an embodiment of installing an ic into a component. Reminder description 1 100 member 110 holder 1 1 la-11 Id frame portion 113a, 113b fastener 114 protruding platform 85201 -22- 1285006 115 hinge channel 116 loading point channel 118 lever hook 120 loading tray 121a-121d disk Section 124 Load point 125 Hinge port 126 Load point 130 Load lever 136 Load point 137 Shaft 138 Load handle 140 Circuit board 143 Mounting hole 149t Socket surface position 150 Socket 154 Projection platform 159t Upper 159u Lower 160 Integrated circuit 164 Loading point 169t Upper 169u Lower 210 Fixing bracket 85201 -23 - 1285006 211a-211d 212 213a, 213b 214 215 216 217 218 220 221a-221d 224 225 226 230 236 237 238 310 315 318 318 320 324 325 85201 Frame frame Fasteners protruding platform hinge channel loading point channel lever channel lever hook loading disk loading point hinge port loading point loading lever loading point shaft part lever handle holder hinge channel loading point channel lever hook Load disk load point hinge port - 24 - 1285006 326 Load point 330 Load lever 336 Load point 338 Lever handle 340 Circuit board 350 Block 360 integrated circuit 364 loading point 400 member 410 mounting bracket 411a-411d frame portion 414 protruding platform 416a, 416b loading point channel 417a, 417b loading lever channel 418a, 418b lever hook 430a, 430b loading lever 436a, 436b loading point 437a, 437b shaft portion 438a, 438b lever handle 440 circuit board 443 fixed? L 449t socket surface position 450 socket 454 85201 protruding platform 25-1285006 459t upper 459u lower 460 integrated circuit 464 loading point 469t convex upper 469u lower 510 mounting bracket 517a, 517b lever channel 518a, 518b lever hook 530a, 530b Inlet lever 536a, 536b loading point 540 circuit board 550 socket 560 integrated circuit 564 loading point -26- 85201