CN115151977A - 聚酰亚胺前体、树脂组合物、绝缘电线及柔性基板 - Google Patents

聚酰亚胺前体、树脂组合物、绝缘电线及柔性基板 Download PDF

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Publication number
CN115151977A
CN115151977A CN202080097108.0A CN202080097108A CN115151977A CN 115151977 A CN115151977 A CN 115151977A CN 202080097108 A CN202080097108 A CN 202080097108A CN 115151977 A CN115151977 A CN 115151977A
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China
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polyimide precursor
alicyclic
mol
diamine
tetracarboxylic dianhydride
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CN202080097108.0A
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English (en)
Chinese (zh)
Inventor
前野智亮
川端泰典
青柳翔太
山内有纱
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Resonac Holdings Corp
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Showa Denko KK
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Publication of CN115151977A publication Critical patent/CN115151977A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H01B13/16—Insulating conductors or cables by passing through or dipping in a liquid bath; by spraying

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Insulated Conductors (AREA)
  • Organic Insulating Materials (AREA)
CN202080097108.0A 2020-03-03 2020-11-25 聚酰亚胺前体、树脂组合物、绝缘电线及柔性基板 Pending CN115151977A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2020/008920 WO2021176560A1 (ja) 2020-03-03 2020-03-03 絶縁電線用ポリイミド前駆体、絶縁電線用樹脂組成物、及び絶縁電線
JPPCT/JP2020/008920 2020-03-03
PCT/JP2020/043829 WO2021176779A1 (ja) 2020-03-03 2020-11-25 ポリイミド前駆体、樹脂組成物、絶縁電線、及びフレキシブル基板

Publications (1)

Publication Number Publication Date
CN115151977A true CN115151977A (zh) 2022-10-04

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ID=77613165

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CN202080097108.0A Pending CN115151977A (zh) 2020-03-03 2020-11-25 聚酰亚胺前体、树脂组合物、绝缘电线及柔性基板

Country Status (6)

Country Link
US (1) US12577350B2 (https=)
EP (1) EP4116993A4 (https=)
JP (1) JP7439898B2 (https=)
CN (1) CN115151977A (https=)
TW (2) TW202544130A (https=)
WO (2) WO2021176560A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI893463B (zh) * 2023-09-27 2025-08-11 奇美實業股份有限公司 絕緣電線及其製造方法、線圈以及電子機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250304749A1 (en) * 2022-05-09 2025-10-02 Resonac Corporation Polyamic acid-containing liquid and method for producing polyamic acid containing liquid
JP2026060584A (ja) * 2024-09-27 2026-04-08 株式会社タムラ製作所 ポリイミド、ポリイミドフィルム、多層配線基板、樹脂付き銅箔、コイル構造体、磁気デバイス及び絶縁電線

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005113647A1 (ja) * 2004-05-21 2005-12-01 Manac Inc 低線熱膨張係数を有するポリエステルイミドとその前駆体
WO2009069688A1 (ja) * 2007-11-30 2009-06-04 Mitsui Chemicals, Inc. ポリイミド系複合材料およびそのフィルム
CN105143310A (zh) * 2013-04-25 2015-12-09 三井化学株式会社 嵌段聚酰亚胺和嵌段聚酰胺酸酰亚胺、以及其用途
US20190225754A1 (en) * 2018-01-25 2019-07-25 Fuji Xerox Co., Ltd. Polyimide precursor solution, molded article, and method for producing molded article
CN110382626A (zh) * 2017-03-22 2019-10-25 东丽株式会社 树脂组合物

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WO2005084948A1 (ja) * 2004-03-04 2005-09-15 Toray Industries, Inc. 耐熱性樹脂積層フィルム並びにこれを含む金属層付き積層フィルム及び半導体装置
WO2008010514A1 (en) * 2006-07-20 2008-01-24 Mitsubishi Gas Chemical Company, Inc. Thermocurable polyimide resin composition
JP5040254B2 (ja) * 2006-10-18 2012-10-03 東洋紡績株式会社 ポリイミド系樹脂およびそれを用いたフレキシブル配線板
JP2015134842A (ja) * 2012-03-30 2015-07-27 新日本理化株式会社 溶剤可溶性ポリイミド樹脂
JP6317733B2 (ja) 2013-04-03 2018-04-25 三井化学株式会社 ポリアミド酸、及びこれを含むワニス、並びにポリイミドフィルム
JP5708778B1 (ja) * 2013-12-16 2015-04-30 富士ゼロックス株式会社 ポリイミド前駆体組成物の製造方法
WO2016056595A1 (ja) * 2014-10-08 2016-04-14 宇部興産株式会社 ポリイミド前駆体組成物、およびそれを用いた絶縁被覆層の製造方法
US10174167B2 (en) * 2015-03-19 2019-01-08 Mitsubishi Gas Chemical Company, Inc. Polyimide resin
JP6760287B2 (ja) 2015-07-16 2020-09-23 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム
CN108701831B (zh) 2016-02-10 2021-06-04 日本电气株式会社 二次电池用粘合剂
JP6414258B2 (ja) * 2016-04-01 2018-10-31 三菱ケミカル株式会社 樹脂組成物
JP6781756B2 (ja) * 2016-07-22 2020-11-04 三井化学株式会社 医療用の袋状物およびその製造方法
EP3780015A4 (en) 2018-03-30 2021-12-22 Essex Furukawa Magnet Wire Japan Co., Ltd. INSULATED ELECTRIC CABLE

Patent Citations (5)

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WO2005113647A1 (ja) * 2004-05-21 2005-12-01 Manac Inc 低線熱膨張係数を有するポリエステルイミドとその前駆体
WO2009069688A1 (ja) * 2007-11-30 2009-06-04 Mitsui Chemicals, Inc. ポリイミド系複合材料およびそのフィルム
CN105143310A (zh) * 2013-04-25 2015-12-09 三井化学株式会社 嵌段聚酰亚胺和嵌段聚酰胺酸酰亚胺、以及其用途
CN110382626A (zh) * 2017-03-22 2019-10-25 东丽株式会社 树脂组合物
US20190225754A1 (en) * 2018-01-25 2019-07-25 Fuji Xerox Co., Ltd. Polyimide precursor solution, molded article, and method for producing molded article

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彭治汗等: "塑料工业手册聚酰胺", 31 December 2001, 化学工业出版社, pages: 660 - 661 *
藏雨等: "气体分离膜材料科学", 31 January 2017, 哈尔滨工业大学出版社, pages: 82 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI893463B (zh) * 2023-09-27 2025-08-11 奇美實業股份有限公司 絕緣電線及其製造方法、線圈以及電子機器

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WO2021176779A1 (ja) 2021-09-10
TW202134317A (zh) 2021-09-16
EP4116993A1 (en) 2023-01-11
EP4116993A4 (en) 2023-08-09
TW202544130A (zh) 2025-11-16
US20230116635A1 (en) 2023-04-13
JP7439898B2 (ja) 2024-02-28
TWI906236B (zh) 2025-12-01
JPWO2021176779A1 (https=) 2021-09-10
WO2021176560A1 (ja) 2021-09-10
US12577350B2 (en) 2026-03-17

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