CN114945618B - 转注成形用环氧树脂组合物及其制造方法、压缩成形用环氧树脂组合物和电子零件装置 - Google Patents

转注成形用环氧树脂组合物及其制造方法、压缩成形用环氧树脂组合物和电子零件装置

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Publication number
CN114945618B
CN114945618B CN202180007355.1A CN202180007355A CN114945618B CN 114945618 B CN114945618 B CN 114945618B CN 202180007355 A CN202180007355 A CN 202180007355A CN 114945618 B CN114945618 B CN 114945618B
Authority
CN
China
Prior art keywords
epoxy resin
resin composition
inorganic filler
mass
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180007355.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN114945618A (zh
Inventor
姜东哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Resonac Corp
Original Assignee
Showa Denko KK
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Resonac Corp filed Critical Showa Denko KK
Publication of CN114945618A publication Critical patent/CN114945618A/zh
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Publication of CN114945618B publication Critical patent/CN114945618B/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180007355.1A 2020-02-06 2021-02-03 转注成形用环氧树脂组合物及其制造方法、压缩成形用环氧树脂组合物和电子零件装置 Active CN114945618B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020-019082 2020-02-06
JP2020019082 2020-02-06
JP2020019083 2020-02-06
JP2020-019083 2020-02-06
PCT/JP2021/003980 WO2021157623A1 (ja) 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置

Publications (2)

Publication Number Publication Date
CN114945618A CN114945618A (zh) 2022-08-26
CN114945618B true CN114945618B (zh) 2026-04-10

Family

ID=77200504

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180007355.1A Active CN114945618B (zh) 2020-02-06 2021-02-03 转注成形用环氧树脂组合物及其制造方法、压缩成形用环氧树脂组合物和电子零件装置

Country Status (5)

Country Link
JP (1) JP7841248B2 (https=)
KR (1) KR102951894B1 (https=)
CN (1) CN114945618B (https=)
TW (1) TWI864231B (https=)
WO (1) WO2021157623A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101133120A (zh) * 2005-03-10 2008-02-27 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
CN109071780A (zh) * 2016-04-28 2018-12-21 日立化成株式会社 环氧树脂组合物及电子部件装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224328A (ja) 1993-01-26 1994-08-12 Nippon Steel Corp 半導体封止用樹脂組成物
JP2006143784A (ja) * 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2007153969A (ja) 2005-12-02 2007-06-21 Showa Denko Kk 高熱伝導性樹脂組成物および配線用基板
JP5029063B2 (ja) 2007-02-26 2012-09-19 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5185218B2 (ja) * 2009-06-30 2013-04-17 エムテックスマツムラ株式会社 半導体装置用中空パッケージおよび半導体部品装置
JP5189606B2 (ja) 2010-01-26 2013-04-24 パナソニック株式会社 半導体封止用エポキシ樹脂組成物、及び半導体装置
JP6770793B2 (ja) * 2015-08-19 2020-10-21 日鉄ケミカル＆マテリアル株式会社 難燃性エポキシ樹脂組成物及びその硬化物
JP6804227B2 (ja) * 2016-07-25 2020-12-23 スリーエム イノベイティブ プロパティズ カンパニー 成形体、電気機器部品及び電気機器部品の製造方法
MY198033A (en) * 2017-03-31 2023-07-27 Resonac Corp Epoxy resin composition, curable resin composition and electronic component device
SG10202110711TA (en) * 2017-10-04 2021-11-29 Showa Denko Materials Co Ltd Curable resin composition, electronic component device, and production method for electronic component device
CN113195582A (zh) * 2018-12-21 2021-07-30 昭和电工材料株式会社 密封用树脂组合物及电子零件装置
JPWO2020129249A1 (ja) * 2018-12-21 2021-11-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物及び電子部品装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101133120A (zh) * 2005-03-10 2008-02-27 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
CN109071780A (zh) * 2016-04-28 2018-12-21 日立化成株式会社 环氧树脂组合物及电子部件装置

Also Published As

Publication number Publication date
JP7841248B2 (ja) 2026-04-07
KR102951894B1 (ko) 2026-04-10
JPWO2021157623A1 (https=) 2021-08-12
KR20220139855A (ko) 2022-10-17
WO2021157623A1 (ja) 2021-08-12
TWI864231B (zh) 2024-12-01
CN114945618A (zh) 2022-08-26
TW202231704A (zh) 2022-08-16

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