JPWO2021157623A1 - - Google Patents

Info

Publication number
JPWO2021157623A1
JPWO2021157623A1 JP2021575838A JP2021575838A JPWO2021157623A1 JP WO2021157623 A1 JPWO2021157623 A1 JP WO2021157623A1 JP 2021575838 A JP2021575838 A JP 2021575838A JP 2021575838 A JP2021575838 A JP 2021575838A JP WO2021157623 A1 JPWO2021157623 A1 JP WO2021157623A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575838A
Other languages
Japanese (ja)
Other versions
JP7841248B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157623A1 publication Critical patent/JPWO2021157623A1/ja
Application granted granted Critical
Publication of JP7841248B2 publication Critical patent/JP7841248B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021575838A 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置 Active JP7841248B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020019082 2020-02-06
JP2020019082 2020-02-06
JP2020019083 2020-02-06
JP2020019083 2020-02-06
PCT/JP2021/003980 WO2021157623A1 (ja) 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2021157623A1 true JPWO2021157623A1 (https=) 2021-08-12
JP7841248B2 JP7841248B2 (ja) 2026-04-07

Family

ID=77200504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575838A Active JP7841248B2 (ja) 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置

Country Status (5)

Country Link
JP (1) JP7841248B2 (https=)
KR (1) KR102951894B1 (https=)
CN (1) CN114945618B (https=)
TW (1) TWI864231B (https=)
WO (1) WO2021157623A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143784A (ja) * 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2006095914A1 (ja) * 2005-03-10 2006-09-14 Sumitomo Bakelite Co., Ltd. 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2008208222A (ja) * 2007-02-26 2008-09-11 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2011012125A (ja) * 2009-06-30 2011-01-20 Mitsui Chemicals Inc 封止用エポキシ樹脂成形材料、および半導体装置用中空パッケージ、並びに半導体部品装置
JP2018016669A (ja) * 2016-07-25 2018-02-01 スリーエム イノベイティブ プロパティズ カンパニー 成形体、電気機器部品及び電気機器部品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224328A (ja) 1993-01-26 1994-08-12 Nippon Steel Corp 半導体封止用樹脂組成物
JP2007153969A (ja) 2005-12-02 2007-06-21 Showa Denko Kk 高熱伝導性樹脂組成物および配線用基板
JP5189606B2 (ja) 2010-01-26 2013-04-24 パナソニック株式会社 半導体封止用エポキシ樹脂組成物、及び半導体装置
JP6770793B2 (ja) * 2015-08-19 2020-10-21 日鉄ケミカル＆マテリアル株式会社 難燃性エポキシ樹脂組成物及びその硬化物
TWI724162B (zh) * 2016-04-28 2021-04-11 日商昭和電工材料股份有限公司 環氧樹脂組成物及電子零件裝置
MY198033A (en) * 2017-03-31 2023-07-27 Resonac Corp Epoxy resin composition, curable resin composition and electronic component device
SG10202110711TA (en) * 2017-10-04 2021-11-29 Showa Denko Materials Co Ltd Curable resin composition, electronic component device, and production method for electronic component device
CN113195582A (zh) * 2018-12-21 2021-07-30 昭和电工材料株式会社 密封用树脂组合物及电子零件装置
JPWO2020129249A1 (ja) * 2018-12-21 2021-11-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物及び電子部品装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143784A (ja) * 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2006095914A1 (ja) * 2005-03-10 2006-09-14 Sumitomo Bakelite Co., Ltd. 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2008208222A (ja) * 2007-02-26 2008-09-11 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2011012125A (ja) * 2009-06-30 2011-01-20 Mitsui Chemicals Inc 封止用エポキシ樹脂成形材料、および半導体装置用中空パッケージ、並びに半導体部品装置
JP2018016669A (ja) * 2016-07-25 2018-02-01 スリーエム イノベイティブ プロパティズ カンパニー 成形体、電気機器部品及び電気機器部品の製造方法

Also Published As

Publication number Publication date
JP7841248B2 (ja) 2026-04-07
KR102951894B1 (ko) 2026-04-10
KR20220139855A (ko) 2022-10-17
WO2021157623A1 (ja) 2021-08-12
TWI864231B (zh) 2024-12-01
CN114945618B (zh) 2026-04-10
CN114945618A (zh) 2022-08-26
TW202231704A (zh) 2022-08-16

Similar Documents

Publication Publication Date Title
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
JPWO2021157623A1 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231211

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250218

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250421

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250617

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250902

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20251104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251212

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260309

R150 Certificate of patent or registration of utility model

Ref document number: 7841248

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150