JP2008208222A - 半導体封止用エポキシ樹脂組成物及び半導体装置 - Google Patents
半導体封止用エポキシ樹脂組成物及び半導体装置 Download PDFInfo
- Publication number
- JP2008208222A JP2008208222A JP2007046315A JP2007046315A JP2008208222A JP 2008208222 A JP2008208222 A JP 2008208222A JP 2007046315 A JP2007046315 A JP 2007046315A JP 2007046315 A JP2007046315 A JP 2007046315A JP 2008208222 A JP2008208222 A JP 2008208222A
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- epoxy resin
- resin composition
- silicon carbide
- semiconductor
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Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
【解決手段】(A)エポキシ樹脂、(B)フェノール樹脂系硬化剤、(C)下記(E)成分を除く無機充填材、(D)硬化促進剤、(E)炭化ケイ素を含むエポキシ樹脂組成物であって、前記炭化ケイ素(E)の平均粒径が1nm以上、1000nm以下であることを特徴とする半導体封止用エポキシ樹脂組成物。
【選択図】なし
Description
[1] (A)エポキシ樹脂、(B)フェノール樹脂系硬化剤、(C)下記(E)成分を除く無機充填材、(D)硬化促進剤、(E)炭化ケイ素を含むエポキシ樹脂組成物であって、前記炭化ケイ素(E)の平均粒径が1nm以上、1000nm以下であることを特徴とする半導体封止用エポキシ樹脂組成物、
[2] 前記炭化ケイ素(E)の含有量が0.5重量%以上、5重量%以下である第[1]項に記載の半導体封止用エポキシ樹脂組成物、
[3] 第[1]項又は第[2]項に記載の半導体封止用エポキシ樹脂組成物を用いて半導体素子を封止してなることを特徴とする半導体装置、
である。
以下、本発明について詳細に説明する。
体積抵抗率(Ω・cm)=
抵抗値(Ω)×着色剤の断面積(cm2)÷着色剤の厚み(cm)
また、本発明の半導体封止用エポキシ樹脂組成物は、例えば、ミキサー等を用いて原料を充分に均一に混合したもの、更にその後、押し出し機、熱ロール又はニーダー等の混練機を用いて溶融混練し、冷却後粉砕したものなど、必要に応じて適宜分散度や流動性等を調整したものを用いることができる。
本発明の半導体装置の形態としては、特に限定されないが、例えば、デュアル・インライン・パッケージ(DIP)、プラスチック・リード付きチップ・キャリヤ(PLCC)、クワッド・フラット・パッケージ(QFP)、スモール・アウトライン・パッケージ(SOP)、スモール・アウトライン・Jリード・パッケージ(SOJ)、薄型スモール・アウトライン・パッケージ(TSOP)、薄型クワッド・フラット・パッケージ(TQFP)、テープ・キャリア・パッケージ(TCP)、ボール・グリッド・アレイ(BGA)、チップ・サイズ・パッケージ(CSP)等が挙げられる。
上記トランスファーモールドなどの成形方法で封止された半導体装置は、そのまま、或いは80℃〜200℃程度の温度で、10分〜10時間程度の時間をかけて完全硬化させた後、電子機器等に搭載される。
実施例及び比較例で用いた炭化ケイ素の内容について以下に示す。
なお、尚、炭化ケイ素(E)の平均粒径は、走査型電子顕微鏡(JEOL社製JSM−6060LV)を用いて測定した。
また、炭化ケイ素の体積抵抗率の測定は、下部に真鍮製電極を取り付けたテトラフルオロエチレン製容器(内径38mm)に炭化ケイ素を入れ、真鍮製電極で蓋をした後、荷重を掛けていき、50kgf時の抵抗値をADVANTEST製デジタルマルチメーターTR6877で測定した。同時にその荷重時の炭化ケイ素の厚みも測定し、以下の式から体積抵抗率を算出した。
体積抵抗率(Ω・cm)=
抵抗値(Ω)×着色剤の断面積(cm2)÷着色剤の厚み(cm)
炭化ケイ素1:平均粒径50nmのカーボンブラックとケイ素粉末を誘導場燃焼合成して得た炭化ケイ素。球状、平均粒径50nm、体積抵抗率107Ω・cm。
炭化ケイ素2:平均粒径500nmのカーボンブラックとケイ素粉末を誘導場燃焼合成して得た炭化ケイ素。球状、平均粒径500nm、体積抵抗率106Ω・cm。
炭化ケイ素3:平均粒径10nmのカーボンブラックとケイ素粉末を誘導場燃焼合成して得た炭化ケイ素。球状、平均粒径10nm、体積抵抗率107Ω・cm。
炭化ケイ素4:石油コークスとケイ石を電気炉で焼いて得たインゴットを粉砕して粉末状とした炭化ケイ素。破砕、平均粒径5μm、体積抵抗率106Ω・cm。
炭化ケイ素5:石油コークスとケイ石を電気炉で焼いて得たインゴットを粉砕して粉末状とした炭化ケイ素。破砕、平均粒径25μm、体積抵抗率106Ω・cm。
溶融球状シリカ2:(平均粒径0.5μm、比表面積5.9m2/g) 88重量部
硬化促進剤:トリフェニルホスフィン(ケイ・アイ化成(株)製、商品名PP−360) 3重量部
炭化ケイ素1 25重量部
カップリング剤1:N−フェニルγ−アミノプロピルトリメトキシシラン(信越化学(株)製、商品名KBM−573) 2重量部
カップリング剤2:γ−メルカプトプロピルトリメトキシシラン(信越化学(株)製、商品名KBM−803) 2重量部
離型剤:モンタン酸エステル系ワックス(クラリアントジャパン(株)製、商品名リコルブWE−4) 2重量部
をミキサーにて混合し、熱ロールを用いて、95℃で8分間混練して冷却後粉砕し、エポキシ樹脂組成物を得た。得られたエポキシ樹脂組成物を、以下の方法で評価した。また、高温リーク試験においては、上記成分から炭化ケイ素1のみを除いた成分を、上記と同様にミキサーにて混合し、熱ロールを用いて、95℃で8分間混練して冷却後粉砕したものを、評価に用いた。結果を表1に示す。
スパイラルフロー:低圧トランスファー成形機(コータキ精機株式会社製、KTS−15)を用いて、EMMI−1−66に準じたスパイラルフロー測定用金型に、金型温度175℃、注入圧力6.9MPa、保圧時間120秒の条件で、エポキシ樹脂組成物を注入し、流動長を測定した。
表1の配合に従い、実施例1と同様にしてエポキシ樹脂組成物を得て、実施例1と同様にして評価した。結果を表1に示す。尚、高温リーク試験においては、表1の配合成分から着色剤である炭化ケイ素1〜5及びカーボンブラックを除いた成分のものも、実施例1と同様にして評価に用いた。
実施例1以外で用いた原材料を以下に示す。
エポキシ樹脂2:ビフェニル型エポキシ樹脂(ジャパンエポキシレジン(株)製、商品名YX−4000、エポキシ当量190、融点105℃)
一方、平均粒径が1nm以上、1000nm以下である炭化ケイ素(E)の代わりに、平均粒径が大きすぎる炭化ケイ素を用いた比較例1、2では、良好な流動性、硬化性が得られ、高温リーク試験でのリーク不良は発生しなかったものの、着色性、YAGレーザーマーキング性が劣る結果となった。
また、平均粒径が1nm以上、1000nm以下である炭化ケイ素(E)の代わりに、カーボンブラックを用いた比較例3では、良好な流動性、硬化性、着色性、YAGレーザーマーキング性は得られたものの、高温リーク試験でのリーク不良が発生した。
以上のとおり、平均粒径が1nm以上、1000nm以下である炭化ケイ素(E)を用いることにより、配線のショート、リーク不良等の電気不良を生ずることがなく、かつ優れたレーザーマーキング性を有する半導体封止用エポキシ樹脂組成物が得られることが判った。
2 ダイボンド材硬化体
3 ダイパッド
4 金線
5 リードフレーム
6 封止用樹脂組成物の硬化体
7 レジスト
8 基板
9 半田ボール
Claims (3)
- (A)エポキシ樹脂、
(B)フェノール樹脂系硬化剤、
(C)下記(E)成分を除く無機充填材、
(D)硬化促進剤、
(E)炭化ケイ素
を含むエポキシ樹脂組成物であって、
前記炭化ケイ素(E)の平均粒径が1nm以上、1000nm以下であることを特徴とする半導体封止用エポキシ樹脂組成物。 - 前記炭化ケイ素(E)の含有量が0.5重量%以上、5重量%以下である請求項1に記載の半導体封止用エポキシ樹脂組成物。
- 請求項1又は2に記載の半導体封止用エポキシ樹脂組成物を用いて半導体素子を封止してなることを特徴とする半導体装置。
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JP2016069221A (ja) * | 2014-09-30 | 2016-05-09 | 日本ピラー工業株式会社 | 立体樹枝状充填材、樹脂組成物、成形体、及び立体樹枝状充填材の製造方法 |
WO2020022070A1 (ja) * | 2018-07-27 | 2020-01-30 | パナソニックIpマネジメント株式会社 | 半導体封止用樹脂組成物、半導体装置、及び半導体装置の製造方法 |
WO2021157623A1 (ja) * | 2020-02-06 | 2021-08-12 | 昭和電工マテリアルズ株式会社 | トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置 |
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JPH10182949A (ja) * | 1996-12-27 | 1998-07-07 | Nitto Denko Corp | エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2000195994A (ja) * | 1998-10-20 | 2000-07-14 | Nitto Denko Corp | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
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JPH10182949A (ja) * | 1996-12-27 | 1998-07-07 | Nitto Denko Corp | エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2000195994A (ja) * | 1998-10-20 | 2000-07-14 | Nitto Denko Corp | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016069221A (ja) * | 2014-09-30 | 2016-05-09 | 日本ピラー工業株式会社 | 立体樹枝状充填材、樹脂組成物、成形体、及び立体樹枝状充填材の製造方法 |
WO2020022070A1 (ja) * | 2018-07-27 | 2020-01-30 | パナソニックIpマネジメント株式会社 | 半導体封止用樹脂組成物、半導体装置、及び半導体装置の製造方法 |
JP2020015873A (ja) * | 2018-07-27 | 2020-01-30 | パナソニックIpマネジメント株式会社 | 半導体封止用樹脂組成物、半導体装置、及び半導体装置の製造方法 |
CN112384572A (zh) * | 2018-07-27 | 2021-02-19 | 松下知识产权经营株式会社 | 半导体封装用树脂组合物、半导体装置和用于制造半导体装置的方法 |
JP7170240B2 (ja) | 2018-07-27 | 2022-11-14 | パナソニックIpマネジメント株式会社 | 半導体封止用樹脂組成物、半導体装置、及び半導体装置の製造方法 |
WO2021157623A1 (ja) * | 2020-02-06 | 2021-08-12 | 昭和電工マテリアルズ株式会社 | トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置 |
CN114230950A (zh) * | 2021-12-27 | 2022-03-25 | 上海芯密科技有限公司 | 一种半导体设备密封件及其制备方法 |
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