JP7841248B2 - トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置 - Google Patents

トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置

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Publication number
JP7841248B2
JP7841248B2 JP2021575838A JP2021575838A JP7841248B2 JP 7841248 B2 JP7841248 B2 JP 7841248B2 JP 2021575838 A JP2021575838 A JP 2021575838A JP 2021575838 A JP2021575838 A JP 2021575838A JP 7841248 B2 JP7841248 B2 JP 7841248B2
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JP
Japan
Prior art keywords
epoxy resin
resin composition
mass
inorganic filler
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021575838A
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English (en)
Japanese (ja)
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JPWO2021157623A1 (https=
Inventor
東哲 姜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021157623A1 publication Critical patent/JPWO2021157623A1/ja
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Publication of JP7841248B2 publication Critical patent/JP7841248B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021575838A 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置 Active JP7841248B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020019082 2020-02-06
JP2020019082 2020-02-06
JP2020019083 2020-02-06
JP2020019083 2020-02-06
PCT/JP2021/003980 WO2021157623A1 (ja) 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2021157623A1 JPWO2021157623A1 (https=) 2021-08-12
JP7841248B2 true JP7841248B2 (ja) 2026-04-07

Family

ID=77200504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575838A Active JP7841248B2 (ja) 2020-02-06 2021-02-03 トランスファ成形用エポキシ樹脂組成物及びその製造方法、コンプレッション成形用エポキシ樹脂組成物、並びに電子部品装置

Country Status (5)

Country Link
JP (1) JP7841248B2 (https=)
KR (1) KR102951894B1 (https=)
CN (1) CN114945618B (https=)
TW (1) TWI864231B (https=)
WO (1) WO2021157623A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143784A (ja) 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2006095914A1 (ja) 2005-03-10 2006-09-14 Sumitomo Bakelite Co., Ltd. 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2008208222A (ja) 2007-02-26 2008-09-11 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2011012125A (ja) 2009-06-30 2011-01-20 Mitsui Chemicals Inc 封止用エポキシ樹脂成形材料、および半導体装置用中空パッケージ、並びに半導体部品装置
JP2018016669A (ja) 2016-07-25 2018-02-01 スリーエム イノベイティブ プロパティズ カンパニー 成形体、電気機器部品及び電気機器部品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224328A (ja) 1993-01-26 1994-08-12 Nippon Steel Corp 半導体封止用樹脂組成物
JP2007153969A (ja) 2005-12-02 2007-06-21 Showa Denko Kk 高熱伝導性樹脂組成物および配線用基板
JP5189606B2 (ja) 2010-01-26 2013-04-24 パナソニック株式会社 半導体封止用エポキシ樹脂組成物、及び半導体装置
JP6770793B2 (ja) * 2015-08-19 2020-10-21 日鉄ケミカル＆マテリアル株式会社 難燃性エポキシ樹脂組成物及びその硬化物
TWI724162B (zh) * 2016-04-28 2021-04-11 日商昭和電工材料股份有限公司 環氧樹脂組成物及電子零件裝置
MY198033A (en) * 2017-03-31 2023-07-27 Resonac Corp Epoxy resin composition, curable resin composition and electronic component device
SG10202110711TA (en) * 2017-10-04 2021-11-29 Showa Denko Materials Co Ltd Curable resin composition, electronic component device, and production method for electronic component device
CN113195582A (zh) * 2018-12-21 2021-07-30 昭和电工材料株式会社 密封用树脂组合物及电子零件装置
JPWO2020129249A1 (ja) * 2018-12-21 2021-11-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物及び電子部品装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143784A (ja) 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2006095914A1 (ja) 2005-03-10 2006-09-14 Sumitomo Bakelite Co., Ltd. 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2008208222A (ja) 2007-02-26 2008-09-11 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2011012125A (ja) 2009-06-30 2011-01-20 Mitsui Chemicals Inc 封止用エポキシ樹脂成形材料、および半導体装置用中空パッケージ、並びに半導体部品装置
JP2018016669A (ja) 2016-07-25 2018-02-01 スリーエム イノベイティブ プロパティズ カンパニー 成形体、電気機器部品及び電気機器部品の製造方法

Also Published As

Publication number Publication date
KR102951894B1 (ko) 2026-04-10
JPWO2021157623A1 (https=) 2021-08-12
KR20220139855A (ko) 2022-10-17
WO2021157623A1 (ja) 2021-08-12
TWI864231B (zh) 2024-12-01
CN114945618B (zh) 2026-04-10
CN114945618A (zh) 2022-08-26
TW202231704A (zh) 2022-08-16

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