TWI864231B - 轉注成形用環氧樹脂組成物及其製造方法、壓縮成形用環氧樹脂組成物和電子零件裝置 - Google Patents

轉注成形用環氧樹脂組成物及其製造方法、壓縮成形用環氧樹脂組成物和電子零件裝置 Download PDF

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Publication number
TWI864231B
TWI864231B TW110104265A TW110104265A TWI864231B TW I864231 B TWI864231 B TW I864231B TW 110104265 A TW110104265 A TW 110104265A TW 110104265 A TW110104265 A TW 110104265A TW I864231 B TWI864231 B TW I864231B
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TW
Taiwan
Prior art keywords
epoxy resin
resin composition
mass
inorganic filler
particle size
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Application number
TW110104265A
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English (en)
Chinese (zh)
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TW202231704A (zh
Inventor
姜東哲
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日商力森諾科股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110104265A 2020-02-06 2021-02-04 轉注成形用環氧樹脂組成物及其製造方法、壓縮成形用環氧樹脂組成物和電子零件裝置 TWI864231B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-019082 2020-02-06
JP2020019082 2020-02-06
JP2020019083 2020-02-06
JP2020-019083 2020-02-06

Publications (2)

Publication Number Publication Date
TW202231704A TW202231704A (zh) 2022-08-16
TWI864231B true TWI864231B (zh) 2024-12-01

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TW110104265A TWI864231B (zh) 2020-02-06 2021-02-04 轉注成形用環氧樹脂組成物及其製造方法、壓縮成形用環氧樹脂組成物和電子零件裝置

Country Status (5)

Country Link
JP (1) JP7841248B2 (https=)
KR (1) KR102951894B1 (https=)
CN (1) CN114945618B (https=)
TW (1) TWI864231B (https=)
WO (1) WO2021157623A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143784A (ja) * 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
TW200702384A (en) * 2005-03-10 2007-01-16 Sumitomo Bakelite Co Epoxy resin composition for semiconductor sealing and semiconductor device
TW201708380A (zh) * 2015-08-19 2017-03-01 新日鐵住金化學股份有限公司 阻燃性環氧樹脂組成物、預浸料、絕緣片、黏著片、層疊板、密封材料、澆鑄材料及硬化物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224328A (ja) 1993-01-26 1994-08-12 Nippon Steel Corp 半導体封止用樹脂組成物
JP2007153969A (ja) 2005-12-02 2007-06-21 Showa Denko Kk 高熱伝導性樹脂組成物および配線用基板
JP5029063B2 (ja) 2007-02-26 2012-09-19 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5185218B2 (ja) * 2009-06-30 2013-04-17 エムテックスマツムラ株式会社 半導体装置用中空パッケージおよび半導体部品装置
JP5189606B2 (ja) 2010-01-26 2013-04-24 パナソニック株式会社 半導体封止用エポキシ樹脂組成物、及び半導体装置
TWI724162B (zh) * 2016-04-28 2021-04-11 日商昭和電工材料股份有限公司 環氧樹脂組成物及電子零件裝置
JP6804227B2 (ja) * 2016-07-25 2020-12-23 スリーエム イノベイティブ プロパティズ カンパニー 成形体、電気機器部品及び電気機器部品の製造方法
MY198033A (en) * 2017-03-31 2023-07-27 Resonac Corp Epoxy resin composition, curable resin composition and electronic component device
SG10202110711TA (en) * 2017-10-04 2021-11-29 Showa Denko Materials Co Ltd Curable resin composition, electronic component device, and production method for electronic component device
CN113195582A (zh) * 2018-12-21 2021-07-30 昭和电工材料株式会社 密封用树脂组合物及电子零件装置
JPWO2020129249A1 (ja) * 2018-12-21 2021-11-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物及び電子部品装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143784A (ja) * 2004-11-16 2006-06-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
TW200702384A (en) * 2005-03-10 2007-01-16 Sumitomo Bakelite Co Epoxy resin composition for semiconductor sealing and semiconductor device
TW201708380A (zh) * 2015-08-19 2017-03-01 新日鐵住金化學股份有限公司 阻燃性環氧樹脂組成物、預浸料、絕緣片、黏著片、層疊板、密封材料、澆鑄材料及硬化物

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Publication number Publication date
JP7841248B2 (ja) 2026-04-07
KR102951894B1 (ko) 2026-04-10
JPWO2021157623A1 (https=) 2021-08-12
KR20220139855A (ko) 2022-10-17
WO2021157623A1 (ja) 2021-08-12
CN114945618B (zh) 2026-04-10
CN114945618A (zh) 2022-08-26
TW202231704A (zh) 2022-08-16

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