CN1146986C - 半导体晶片封装体及其封装方法 - Google Patents
半导体晶片封装体及其封装方法 Download PDFInfo
- Publication number
- CN1146986C CN1146986C CNB001003232A CN00100323A CN1146986C CN 1146986 C CN1146986 C CN 1146986C CN B001003232 A CNB001003232 A CN B001003232A CN 00100323 A CN00100323 A CN 00100323A CN 1146986 C CN1146986 C CN 1146986C
- Authority
- CN
- China
- Prior art keywords
- substrate
- wafer
- electric conductor
- wafer area
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Packaging Frangible Articles (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (26)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB001003232A CN1146986C (zh) | 2000-01-25 | 2000-01-25 | 半导体晶片封装体及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB001003232A CN1146986C (zh) | 2000-01-25 | 2000-01-25 | 半导体晶片封装体及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1307362A CN1307362A (zh) | 2001-08-08 |
CN1146986C true CN1146986C (zh) | 2004-04-21 |
Family
ID=4575386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001003232A Expired - Fee Related CN1146986C (zh) | 2000-01-25 | 2000-01-25 | 半导体晶片封装体及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1146986C (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100435300C (zh) * | 2005-09-28 | 2008-11-19 | 相丰科技股份有限公司 | 晶片封装方式 |
-
2000
- 2000-01-25 CN CNB001003232A patent/CN1146986C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1307362A (zh) | 2001-08-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: KAMEN INTERNATIONAL INVESTMENT LTD. Free format text: FORMER OWNER: CHEN YIMING Effective date: 20021017 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20021017 Address after: British Virgin Islands Applicant after: Carmen International Investment Co., Ltd. Address before: Taiwan, China Applicant before: Chen Yiming |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: IVY STOCK CO., LTD. Free format text: FORMER OWNER: KAMEN INTERNATIONAL INVESTMENT LTD. Effective date: 20040618 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20040618 Address after: British Virgin Islands Patentee after: Changchunteng Holding Co., Ltd. Address before: British Virgin Islands more Patentee before: Carmen International Investment Co., Ltd. |
|
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |