CN1146973C - 受控切分处理 - Google Patents

受控切分处理 Download PDF

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Publication number
CN1146973C
CN1146973C CNB988049767A CN98804976A CN1146973C CN 1146973 C CN1146973 C CN 1146973C CN B988049767 A CNB988049767 A CN B988049767A CN 98804976 A CN98804976 A CN 98804976A CN 1146973 C CN1146973 C CN 1146973C
Authority
CN
China
Prior art keywords
energy
substrate
processing
described processing
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB988049767A
Other languages
English (en)
Chinese (zh)
Other versions
CN1255237A (zh
Inventor
J
弗兰乔斯·J·亨利
W
内森·W·陈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silicon Genesis Corp
Original Assignee
Silicon Genesis Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/026,115 external-priority patent/US6155909A/en
Application filed by Silicon Genesis Corp filed Critical Silicon Genesis Corp
Publication of CN1255237A publication Critical patent/CN1255237A/zh
Application granted granted Critical
Publication of CN1146973C publication Critical patent/CN1146973C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/28—Splitting layers from work; Mutually separating layers by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CNB988049767A 1997-05-12 1998-05-11 受控切分处理 Expired - Lifetime CN1146973C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US4627697P 1997-05-12 1997-05-12
US60/046,276 1997-05-12
US09/026,115 US6155909A (en) 1997-05-12 1998-02-19 Controlled cleavage system using pressurized fluid
US09/026,027 1998-02-19
US09/026,027 US5994207A (en) 1997-05-12 1998-02-19 Controlled cleavage process using pressurized fluid
US09/026,115 1998-02-19

Publications (2)

Publication Number Publication Date
CN1255237A CN1255237A (zh) 2000-05-31
CN1146973C true CN1146973C (zh) 2004-04-21

Family

ID=27362676

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB988049767A Expired - Lifetime CN1146973C (zh) 1997-05-12 1998-05-11 受控切分处理

Country Status (6)

Country Link
EP (1) EP0995227A4 (fr)
JP (1) JP2001525991A (fr)
CN (1) CN1146973C (fr)
AU (1) AU7685198A (fr)
CA (1) CA2290104A1 (fr)
WO (1) WO1998052216A1 (fr)

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US6653209B1 (en) 1999-09-30 2003-11-25 Canon Kabushiki Kaisha Method of producing silicon thin film, method of constructing SOI substrate and semiconductor device
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FR2817395B1 (fr) 2000-11-27 2003-10-31 Soitec Silicon On Insulator Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
FR2818010B1 (fr) 2000-12-08 2003-09-05 Commissariat Energie Atomique Procede de realisation d'une couche mince impliquant l'introduction d'especes gazeuses
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FR2847714B1 (fr) * 2002-11-27 2005-02-18 Soitec Silicon On Insulator Procede et dispositif de recuit de tranche de semiconducteur
TWI233154B (en) 2002-12-06 2005-05-21 Soitec Silicon On Insulator Method for recycling a substrate
EP1427002B1 (fr) * 2002-12-06 2017-04-12 Soitec Méthode de recyclage d'un substrat par découpage localisé
JP4151421B2 (ja) * 2003-01-23 2008-09-17 セイコーエプソン株式会社 デバイスの製造方法
JP2005039114A (ja) * 2003-07-17 2005-02-10 Disco Abrasive Syst Ltd 半導体ウェーハ移し替え装置
WO2005091283A1 (fr) * 2004-03-22 2005-09-29 Oc Oerlikon Balzers Ag Procede et appareil de separation de substrats en forme de disques
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DE102005000826A1 (de) 2005-01-05 2006-07-20 Siltronic Ag Halbleiterscheibe mit Silicium-Germanium-Schicht und Verfahren zu deren Herstellung
CN101248519B (zh) 2005-02-28 2011-08-24 硅源公司 衬底硬化方法及所得器件
JP5064692B2 (ja) * 2006-02-09 2012-10-31 信越化学工業株式会社 Ｓｏｉ基板の製造方法
JP5064693B2 (ja) * 2006-02-13 2012-10-31 信越化学工業株式会社 Ｓｏｉ基板の製造方法
US8293619B2 (en) * 2008-08-28 2012-10-23 Silicon Genesis Corporation Layer transfer of films utilizing controlled propagation
JP2008112847A (ja) 2006-10-30 2008-05-15 Shin Etsu Chem Co Ltd 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池
JP5284576B2 (ja) * 2006-11-10 2013-09-11 信越化学工業株式会社 半導体基板の製造方法
JP5166745B2 (ja) * 2007-03-07 2013-03-21 信越化学工業株式会社 単結晶シリコン太陽電池の製造方法
US20100193900A1 (en) * 2007-07-13 2010-08-05 National University Corporation Tohoku University Soi substrate and semiconductor device using an soi substrate
JP2010021398A (ja) * 2008-07-11 2010-01-28 Disco Abrasive Syst Ltd ウェーハの処理方法
US7994064B2 (en) * 2009-06-15 2011-08-09 Twin Creeks Technologies, Inc. Selective etch for damage at exfoliated surface
JP5725430B2 (ja) * 2011-10-18 2015-05-27 富士電機株式会社 固相接合ウエハの支持基板の剥離方法および半導体装置の製造方法
FR2995447B1 (fr) 2012-09-07 2014-09-05 Soitec Silicon On Insulator Procede de separation d'au moins deux substrats selon une interface choisie
JP2014138189A (ja) * 2013-01-16 2014-07-28 Silicon Genesis Corp 制御されたプロセス及び結果として生じるデバイス
CN103077885B (zh) * 2013-01-31 2016-06-01 上海新傲科技股份有限公司 受控减薄方法以及半导体衬底
JP6213046B2 (ja) * 2013-08-21 2017-10-18 信越半導体株式会社 貼り合わせウェーハの製造方法
FR3032555B1 (fr) * 2015-02-10 2018-01-19 Soitec Procede de report d'une couche utile
CN104979262B (zh) * 2015-05-14 2020-09-22 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
CN106529159A (zh) * 2016-10-28 2017-03-22 山东理工大学 压电控制单原子链纳米弦横向振动固有角频率计算方法

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Also Published As

Publication number Publication date
AU7685198A (en) 1998-12-08
WO1998052216A1 (fr) 1998-11-19
CN1255237A (zh) 2000-05-31
EP0995227A1 (fr) 2000-04-26
JP2001525991A (ja) 2001-12-11
EP0995227A4 (fr) 2000-07-05
CA2290104A1 (fr) 1998-11-19

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Granted publication date: 20040421