CN114628302A - 一种用于晶圆的自动化超精挑芯装置及挑芯方法 - Google Patents
一种用于晶圆的自动化超精挑芯装置及挑芯方法 Download PDFInfo
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- CN114628302A CN114628302A CN202210516593.1A CN202210516593A CN114628302A CN 114628302 A CN114628302 A CN 114628302A CN 202210516593 A CN202210516593 A CN 202210516593A CN 114628302 A CN114628302 A CN 114628302A
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- wafer
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- 238000001035 drying Methods 0.000 claims abstract description 84
- 230000007246 mechanism Effects 0.000 claims abstract description 78
- 235000012431 wafers Nutrition 0.000 claims description 108
- 238000012546 transfer Methods 0.000 claims description 51
- 230000000903 blocking effect Effects 0.000 claims description 31
- 238000000926 separation method Methods 0.000 claims description 26
- 239000010687 lubricating oil Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 5
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
- B65B57/14—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged and operating to control, or stop, the feed of articles or material to be packaged
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210516593.1A CN114628302B (zh) | 2022-05-13 | 2022-05-13 | 一种用于晶圆的自动化超精挑芯装置及挑芯方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210516593.1A CN114628302B (zh) | 2022-05-13 | 2022-05-13 | 一种用于晶圆的自动化超精挑芯装置及挑芯方法 |
Publications (2)
Publication Number | Publication Date |
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CN114628302A true CN114628302A (zh) | 2022-06-14 |
CN114628302B CN114628302B (zh) | 2022-07-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202210516593.1A Active CN114628302B (zh) | 2022-05-13 | 2022-05-13 | 一种用于晶圆的自动化超精挑芯装置及挑芯方法 |
Country Status (1)
Country | Link |
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CN (1) | CN114628302B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008218664A (ja) * | 2007-03-02 | 2008-09-18 | Seiko Npc Corp | 半導体ウエハのダイシング方法 |
CN106981437A (zh) * | 2017-03-09 | 2017-07-25 | 铜陵三佳山田科技股份有限公司 | 用于qfn‑bga半导体芯片的分选检测工艺及其设备 |
CN208580718U (zh) * | 2018-07-10 | 2019-03-05 | 广州市斯睿特智能科技有限公司 | 简易晶圆视觉自动分类拾取装置 |
CN110391163A (zh) * | 2019-04-09 | 2019-10-29 | 南宁聚信众信息技术咨询有限公司 | 一种用于晶圆加工处理的操作方便快捷的芯片分拣设备 |
-
2022
- 2022-05-13 CN CN202210516593.1A patent/CN114628302B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008218664A (ja) * | 2007-03-02 | 2008-09-18 | Seiko Npc Corp | 半導体ウエハのダイシング方法 |
CN106981437A (zh) * | 2017-03-09 | 2017-07-25 | 铜陵三佳山田科技股份有限公司 | 用于qfn‑bga半导体芯片的分选检测工艺及其设备 |
CN208580718U (zh) * | 2018-07-10 | 2019-03-05 | 广州市斯睿特智能科技有限公司 | 简易晶圆视觉自动分类拾取装置 |
CN110391163A (zh) * | 2019-04-09 | 2019-10-29 | 南宁聚信众信息技术咨询有限公司 | 一种用于晶圆加工处理的操作方便快捷的芯片分拣设备 |
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CN114628302B (zh) | 2022-07-19 |
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Effective date of registration: 20220926 Address after: 213000 No. 1, Park Road, Caoqiao industrial cluster, Xueyan Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou jinchuilong Forging Co.,Ltd. Patentee after: Baikejing semiconductor technology (Suzhou) Co.,Ltd. Address before: 213000 No. 1, Park Road, Caoqiao industrial cluster, Xueyan Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: Changzhou jinchuilong Forging Co.,Ltd. |
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Effective date of registration: 20240129 Address after: Room 106 and 109, 1st Floor, Block B, Building 3, No. 99 Suhong West Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province, 215000 Patentee after: Baikejing semiconductor technology (Suzhou) Co.,Ltd. Country or region after: China Address before: 213000 No. 1, Park Road, Caoqiao industrial cluster, Xueyan Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: Changzhou jinchuilong Forging Co.,Ltd. Country or region before: China Patentee before: Baikejing semiconductor technology (Suzhou) Co.,Ltd. |