CN114375088A - 金属电路图案和金属电路图案的制造方法 - Google Patents
金属电路图案和金属电路图案的制造方法 Download PDFInfo
- Publication number
- CN114375088A CN114375088A CN202110177694.6A CN202110177694A CN114375088A CN 114375088 A CN114375088 A CN 114375088A CN 202110177694 A CN202110177694 A CN 202110177694A CN 114375088 A CN114375088 A CN 114375088A
- Authority
- CN
- China
- Prior art keywords
- metal
- circuit pattern
- pieces
- friction
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 309
- 239000002184 metal Substances 0.000 title claims abstract description 309
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 230000017525 heat dissipation Effects 0.000 claims description 30
- 238000004080 punching Methods 0.000 claims description 13
- 238000007788 roughening Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 239000011231 conductive filler Substances 0.000 claims description 7
- 231100000241 scar Toxicity 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 abstract description 21
- 239000010949 copper Substances 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 238000003825 pressing Methods 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 11
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 208000032544 Cicatrix Diseases 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000037387 scars Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-174769 | 2020-10-16 | ||
| JP2020174769A JP7548770B2 (ja) | 2020-10-16 | 2020-10-16 | 金属回路パターンおよび金属回路パターンの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114375088A true CN114375088A (zh) | 2022-04-19 |
Family
ID=81139028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110177694.6A Pending CN114375088A (zh) | 2020-10-16 | 2021-02-07 | 金属电路图案和金属电路图案的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7548770B2 (ja) |
| CN (1) | CN114375088A (ja) |
| TW (1) | TWI768682B (ja) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3602933A1 (de) * | 1986-01-31 | 1987-08-06 | Doelling Rudolf | Vorrichtung zur aufbringung von leiterbahnen auf platinen |
| JPH02151321A (ja) * | 1988-12-05 | 1990-06-11 | Nachi Fujikoshi Corp | 金属材料の剪断加工方法 |
| JP2000022303A (ja) * | 1998-07-06 | 2000-01-21 | Matsushita Electric Ind Co Ltd | 金属インサート樹脂成形回路基板およびその製造方法 |
| JP2008218596A (ja) * | 2007-03-02 | 2008-09-18 | Denki Kagaku Kogyo Kk | 金属ベース回路基板及びその製造方法 |
| JP2014093452A (ja) * | 2012-11-05 | 2014-05-19 | Hitachi Cable Ltd | 打ち抜き金型、リードフレーム及びリードフレームの製造方法 |
| WO2018211640A1 (ja) * | 2017-05-17 | 2018-11-22 | Ｊｘ金属株式会社 | 回路基板用金属板、回路基板用金属板成形品、回路基板およびパワーモジュールならびに、パワーモジュールの製造方法 |
| WO2020111045A1 (ja) * | 2018-11-26 | 2020-06-04 | 日本発條株式会社 | 金属ベース回路基板の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005093935A (ja) | 2003-09-19 | 2005-04-07 | Sumitomo Electric Ind Ltd | スティフナーとその製造方法およびそれを用いた半導体装置 |
| TWI472275B (zh) * | 2013-02-18 | 2015-02-01 | King Shing Ind Co Ltd | 一種使用金屬線路片之電子線路板及其電子封裝模組 |
| JP5954371B2 (ja) | 2014-08-05 | 2016-07-20 | 三菱マテリアル株式会社 | パワーモジュール用基板及びその製造方法 |
| DE102014117943B4 (de) * | 2014-12-05 | 2022-12-08 | Infineon Technologies Austria Ag | Vorrichtung mit einer Leiterplatte und einem Metallwerkstück |
| JP6760158B2 (ja) | 2017-03-21 | 2020-09-23 | 三菱マテリアル株式会社 | 金属−セラミックス接合基板及びその製造方法 |
-
2020
- 2020-10-16 JP JP2020174769A patent/JP7548770B2/ja active Active
-
2021
- 2021-01-26 TW TW110102755A patent/TWI768682B/zh active
- 2021-02-07 CN CN202110177694.6A patent/CN114375088A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3602933A1 (de) * | 1986-01-31 | 1987-08-06 | Doelling Rudolf | Vorrichtung zur aufbringung von leiterbahnen auf platinen |
| JPH02151321A (ja) * | 1988-12-05 | 1990-06-11 | Nachi Fujikoshi Corp | 金属材料の剪断加工方法 |
| JP2000022303A (ja) * | 1998-07-06 | 2000-01-21 | Matsushita Electric Ind Co Ltd | 金属インサート樹脂成形回路基板およびその製造方法 |
| JP2008218596A (ja) * | 2007-03-02 | 2008-09-18 | Denki Kagaku Kogyo Kk | 金属ベース回路基板及びその製造方法 |
| JP2014093452A (ja) * | 2012-11-05 | 2014-05-19 | Hitachi Cable Ltd | 打ち抜き金型、リードフレーム及びリードフレームの製造方法 |
| WO2018211640A1 (ja) * | 2017-05-17 | 2018-11-22 | Ｊｘ金属株式会社 | 回路基板用金属板、回路基板用金属板成形品、回路基板およびパワーモジュールならびに、パワーモジュールの製造方法 |
| WO2020111045A1 (ja) * | 2018-11-26 | 2020-06-04 | 日本発條株式会社 | 金属ベース回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI768682B (zh) | 2022-06-21 |
| TW202218493A (zh) | 2022-05-01 |
| JP2022065938A (ja) | 2022-04-28 |
| JP7548770B2 (ja) | 2024-09-10 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |