CN113994259B - 感光性树脂组合物、转印膜、固化膜、层叠体及触摸面板的制造方法 - Google Patents

感光性树脂组合物、转印膜、固化膜、层叠体及触摸面板的制造方法 Download PDF

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Publication number
CN113994259B
CN113994259B CN202080045202.1A CN202080045202A CN113994259B CN 113994259 B CN113994259 B CN 113994259B CN 202080045202 A CN202080045202 A CN 202080045202A CN 113994259 B CN113994259 B CN 113994259B
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resin composition
photosensitive resin
compound
mass
touch panel
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Chinese (zh)
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CN113994259A (zh
Inventor
有年阳平
儿玉邦彦
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02—Monomers containing only one unsaturated aliphatic radical
    • C08F12/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F12/06—Hydrocarbons
    • C08F12/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Paints Or Removers (AREA)
CN202080045202.1A 2019-07-24 2020-07-01 感光性树脂组合物、转印膜、固化膜、层叠体及触摸面板的制造方法 Active CN113994259B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019-136028 2019-07-24
JP2019136028 2019-07-24
JP2019-187553 2019-10-11
JP2019187553 2019-10-11
PCT/JP2020/025883 WO2021014914A1 (ja) 2019-07-24 2020-07-01 感光性樹脂組成物、転写フィルム、硬化膜、積層体、及び、タッチパネルの製造方法

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CN113994259A CN113994259A (zh) 2022-01-28
CN113994259B true CN113994259B (zh) 2024-05-28

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US (1) US20220107562A1 (https=)
JP (2) JPWO2021014914A1 (https=)
CN (1) CN113994259B (https=)
WO (1) WO2021014914A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209307A1 (ja) * 2021-03-30 2022-10-06 富士フイルム株式会社 積層体及び積層体の製造方法

Citations (3)

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CN106019447A (zh) * 2015-03-31 2016-10-12 住友化学株式会社 光学层叠体及液晶显示装置
JP2018072789A (ja) * 2015-12-25 2018-05-10 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、樹脂パターン製造方法、硬化膜パターン製造方法及び表示装置
CN109643062A (zh) * 2016-08-30 2019-04-16 富士胶片株式会社 感光性树脂组合物、转印膜、触摸面板用保护膜、触摸面板及其制造方法以及图像显示装置

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JPS51148784A (en) * 1975-06-16 1976-12-21 Asahi Chem Ind Co Ltd Photosensitive resin composition
JPH04122936A (ja) * 1990-09-13 1992-04-23 Fuji Photo Film Co Ltd 光重合性組成物
JP4189136B2 (ja) * 2000-07-14 2008-12-03 新日本製鐵株式会社 表面被覆金属材
JP2002131915A (ja) * 2000-10-26 2002-05-09 Fuji Photo Film Co Ltd 感放射線性樹脂組成物
JP3941556B2 (ja) * 2002-03-26 2007-07-04 日立化成工業株式会社 感光性ポリアミドイミド樹脂組成物、パターン製造法及び電子部品
JP5853806B2 (ja) * 2012-03-23 2016-02-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及び硬化膜の形成方法
JP5832943B2 (ja) * 2012-03-23 2015-12-16 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
JP6247014B2 (ja) * 2013-04-04 2017-12-13 東京応化工業株式会社 感光性樹脂組成物
JP2016160393A (ja) * 2015-03-04 2016-09-05 Jsr株式会社 硬化性樹脂組成物、表示素子用硬化膜、その形成方法及び表示素子
US10286421B2 (en) * 2015-11-17 2019-05-14 Fujifilm Corporation Photosensitive composition, method for producing cured product, cured film, display device, and touch panel
JP6506198B2 (ja) * 2015-11-17 2019-04-24 富士フイルム株式会社 感光性組成物、硬化物の製造方法、硬化膜、表示装置、及び、タッチパネル
WO2018008376A1 (ja) * 2016-07-06 2018-01-11 富士フイルム株式会社 感光性組成物、転写フィルム、硬化膜、並びに、タッチパネル及びその製造方法
JP6769313B2 (ja) * 2017-01-23 2020-10-14 東レ株式会社 導電パターン形成用フィルム
JP7313180B2 (ja) * 2018-04-23 2023-07-24 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法

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Publication number Priority date Publication date Assignee Title
CN106019447A (zh) * 2015-03-31 2016-10-12 住友化学株式会社 光学层叠体及液晶显示装置
JP2018072789A (ja) * 2015-12-25 2018-05-10 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、樹脂パターン製造方法、硬化膜パターン製造方法及び表示装置
CN109643062A (zh) * 2016-08-30 2019-04-16 富士胶片株式会社 感光性树脂组合物、转印膜、触摸面板用保护膜、触摸面板及其制造方法以及图像显示装置

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WO2021014914A1 (ja) 2021-01-28
CN113994259A (zh) 2022-01-28
JPWO2021014914A1 (https=) 2021-01-28
US20220107562A1 (en) 2022-04-07
JP2025000704A (ja) 2025-01-07

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