CN113785000A - 树脂粒子混合物 - Google Patents

树脂粒子混合物 Download PDF

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Publication number
CN113785000A
CN113785000A CN201980096119.4A CN201980096119A CN113785000A CN 113785000 A CN113785000 A CN 113785000A CN 201980096119 A CN201980096119 A CN 201980096119A CN 113785000 A CN113785000 A CN 113785000A
Authority
CN
China
Prior art keywords
resin
group
type
resins
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980096119.4A
Other languages
English (en)
Chinese (zh)
Inventor
竹内一雅
关屋洋希
伊藤辉雄
石原千生
中村真也
丸山钢志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN113785000A publication Critical patent/CN113785000A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201980096119.4A 2019-05-08 2019-05-08 树脂粒子混合物 Pending CN113785000A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/018444 WO2020225884A1 (ja) 2019-05-08 2019-05-08 樹脂粒子混合物

Publications (1)

Publication Number Publication Date
CN113785000A true CN113785000A (zh) 2021-12-10

Family

ID=73050795

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980096119.4A Pending CN113785000A (zh) 2019-05-08 2019-05-08 树脂粒子混合物

Country Status (3)

Country Link
JP (1) JP7294412B2 (https=)
CN (1) CN113785000A (https=)
WO (1) WO2020225884A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04288317A (ja) * 1990-05-28 1992-10-13 Somar Corp エポキシ樹脂粉体組成物及びその製造方法
CN107001282A (zh) * 2015-01-19 2017-08-01 日本曹达株式会社 包合化合物的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62289572A (ja) * 1986-06-07 1987-12-16 Agency Of Ind Science & Technol 自己硬化型エポキシ化合物
JPH0762060B2 (ja) * 1987-03-13 1995-07-05 宇部興産株式会社 ポリフエノ−ル類の製造法
JP3043838B2 (ja) * 1991-06-05 2000-05-22 日本ユニカー株式会社 シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
JPH10204331A (ja) * 1997-01-28 1998-08-04 Sumitomo Chem Co Ltd 粉体塗料およびその塗装物
JPH11322897A (ja) * 1998-05-20 1999-11-26 Nippon Kayaku Co Ltd 光カチオン重合性エポキシ樹脂系固形組成物及び物品
JP3685669B2 (ja) * 1999-11-01 2005-08-24 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物
JP4514018B2 (ja) 2002-04-12 2010-07-28 新日鐵化学株式会社 エポキシ粉体塗料組成物
JP2004292645A (ja) 2003-03-27 2004-10-21 Sumitomo Bakelite Co Ltd エポキシ樹脂粉体塗料
JP4905769B2 (ja) 2006-03-31 2012-03-28 Ｄｉｃ株式会社 粉体塗料用エポキシ樹脂組成物
JP5073253B2 (ja) 2006-09-08 2012-11-14 Ｎｔｎ株式会社 樹脂摺動材
JP5402611B2 (ja) 2009-12-22 2014-01-29 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP2011017018A (ja) 2010-09-10 2011-01-27 Mitsubishi Chemicals Corp エポキシ樹脂組成物及び半導体装置
KR101518502B1 (ko) 2012-12-26 2015-05-11 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04288317A (ja) * 1990-05-28 1992-10-13 Somar Corp エポキシ樹脂粉体組成物及びその製造方法
CN107001282A (zh) * 2015-01-19 2017-08-01 日本曹达株式会社 包合化合物的制造方法

Also Published As

Publication number Publication date
JP7294412B2 (ja) 2023-06-20
WO2020225884A1 (ja) 2020-11-12
JPWO2020225884A1 (https=) 2020-11-12

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Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.

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