CN113785000A - Resin particle mixture - Google Patents
Resin particle mixture Download PDFInfo
- Publication number
- CN113785000A CN113785000A CN201980096119.4A CN201980096119A CN113785000A CN 113785000 A CN113785000 A CN 113785000A CN 201980096119 A CN201980096119 A CN 201980096119A CN 113785000 A CN113785000 A CN 113785000A
- Authority
- CN
- China
- Prior art keywords
- resin
- group
- type
- resins
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002245 particle Substances 0.000 title claims abstract description 163
- 229920005989 resin Polymers 0.000 title claims abstract description 69
- 239000011347 resin Substances 0.000 title claims abstract description 69
- 239000000203 mixture Substances 0.000 title claims abstract description 59
- 239000003822 epoxy resin Substances 0.000 claims abstract description 140
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 140
- 239000005011 phenolic resin Substances 0.000 claims abstract description 108
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 23
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 45
- 229920003986 novolac Polymers 0.000 claims description 24
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 claims description 23
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 20
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 16
- 125000001624 naphthyl group Chemical group 0.000 claims description 14
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 12
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 claims description 12
- 239000004305 biphenyl Substances 0.000 claims description 10
- 235000010290 biphenyl Nutrition 0.000 claims description 10
- 150000002989 phenols Chemical class 0.000 claims description 9
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 claims description 6
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 125000004434 sulfur atom Chemical group 0.000 claims description 6
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 claims description 5
- 150000001642 boronic acid derivatives Chemical class 0.000 claims description 5
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 claims description 5
- 150000004714 phosphonium salts Chemical class 0.000 claims description 5
- 235000021286 stilbenes Nutrition 0.000 claims description 5
- 150000004780 naphthols Chemical class 0.000 claims description 3
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 2
- 239000012778 molding material Substances 0.000 abstract description 7
- -1 m-xylene modified phenol Chemical class 0.000 description 52
- 239000000843 powder Substances 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 23
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 21
- 239000002184 metal Substances 0.000 description 20
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 17
- 239000000945 filler Substances 0.000 description 15
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 9
- 239000004809 Teflon Substances 0.000 description 8
- 229920006362 Teflon® Polymers 0.000 description 8
- 125000003545 alkoxy group Chemical group 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 125000003277 amino group Chemical group 0.000 description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 8
- 125000005843 halogen group Chemical group 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 229910000859 α-Fe Inorganic materials 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 125000004104 aryloxy group Chemical group 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000006247 magnetic powder Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000000805 composite resin Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000004570 mortar (masonry) Substances 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000005291 magnetic effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229910001172 neodymium magnet Inorganic materials 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000011343 solid material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- 125000003172 aldehyde group Chemical group 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 2
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 239000012488 sample solution Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QKUSYGZVIAWWPY-UHFFFAOYSA-N 1,3-dioxane;7-oxabicyclo[4.1.0]heptane Chemical compound C1COCOC1.C1CCCC2OC21 QKUSYGZVIAWWPY-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- QXHLMWWPSWWKOK-UHFFFAOYSA-N 2,3-dimethylnaphthalen-1-ol Chemical compound C1=CC=C2C(O)=C(C)C(C)=CC2=C1 QXHLMWWPSWWKOK-UHFFFAOYSA-N 0.000 description 1
- XOSCKTQMAZSFBZ-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]methyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2CC=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 XOSCKTQMAZSFBZ-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- VQNQTIUCMJTZGX-UHFFFAOYSA-N 2-hydroxyethyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCO)C1=CC=CC=C1 VQNQTIUCMJTZGX-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Chemical group CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- 229910000519 Ferrosilicon Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910001199 N alloy Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000005336 allyloxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- BEVHTMLFDWFAQF-UHFFFAOYSA-N butyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 BEVHTMLFDWFAQF-UHFFFAOYSA-N 0.000 description 1
- 125000004744 butyloxycarbonyl group Chemical group 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 125000004063 butyryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000006639 cyclohexyl carbonyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001887 cyclopentyloxy group Chemical group C1(CCCC1)O* 0.000 description 1
- 125000000131 cyclopropyloxy group Chemical group C1(CC1)O* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- OUGDZFRDEZNAOS-UHFFFAOYSA-N diethyl-methyl-phenylphosphanium Chemical compound CC[P+](C)(CC)C1=CC=CC=C1 OUGDZFRDEZNAOS-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 125000006840 diphenylmethane group Chemical group 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000004672 ethylcarbonyl group Chemical group [H]C([H])([H])C([H])([H])C(*)=O 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 238000010299 mechanically pulverizing process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- DOXFBSZBACYHFY-UHFFFAOYSA-N phenol;stilbene Chemical class OC1=CC=CC=C1.C=1C=CC=CC=1C=CC1=CC=CC=C1 DOXFBSZBACYHFY-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000006678 phenoxycarbonyl group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- WHAFDJWJDDPMDO-UHFFFAOYSA-N trimethyl(phenyl)phosphanium Chemical compound C[P+](C)(C)C1=CC=CC=C1 WHAFDJWJDDPMDO-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a resin particle mixture containing epoxy resin particles and phenolic resin particles containing a curing accelerator. This resin particle mixture can be used as a molding material or the like, and has an excellent pot life.
Description
Technical Field
The invention relates to a resin particle mixture.
Background
Thermosetting resin compositions containing an epoxy resin and a phenol resin as a curing material are widely used for electronic material applications such as wiring boards and sealing materials. Such compositions also typically include a cure accelerator. Thereby, the curing state of the resin is controlled, and the curing conditions corresponding to the application are set. Since the thermosetting resin composition has a pot life, it is usually refrigerated or frozen during storage.
The thermosetting resin composition can be melt-kneaded with a filler to produce a resin composite. In this case, when the filler is silica powder, the composite can be used as a sealing material for electronic components. When the filler is a magnetic metal powder, the composite can be used as a material for producing a bonded magnet, an inductor, or the like.
For example, patent document 1 discloses the following method: a bonded magnet containing a magnet powder is produced by using a thermosetting resin composition containing an epoxy resin and a phenol novolac type resin as a molding material.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2017-130650
Disclosure of Invention
Technical problem to be solved by the invention
However, conventional thermosetting resin compositions tend to have a short pot life, and the degree of freedom in the production process is sometimes limited.
Accordingly, an object of the present invention is to provide a resin particle mixture which can be used as a molding material or the like and has an excellent pot life.
Means for solving the technical problem
The present invention provides a resin particle mixture containing epoxy resin particles and phenolic resin particles containing a curing accelerator.
In the present invention, the epoxy resin constituting the epoxy resin particles may include at least one selected from the group consisting of biphenyl type epoxy resins, stilbene type epoxy resins, diphenylmethane type epoxy resins, sulfur atom containing type epoxy resins, novolac type epoxy resins, dicyclopentadiene type epoxy resins, salicylaldehyde type epoxy resins, epoxy resins having a naphthalene structure, and copolymerized epoxy resins of naphthols and phenols.
In the present invention, the phenol resin constituting the above-mentioned phenol resin particles may contain at least one selected from the group consisting of a dicyclopentadiene type phenol resin, a salicylaldehyde type phenol resin, a copolymerized phenol resin of a benzaldehyde type phenol and an aralkyl type phenol, and a novolak type phenol resin.
In the present invention, the curing accelerator may contain a tetra-substituted phosphonium tetra-substituted borate.
In the present invention, the particle diameter of the epoxy resin particles may be 0.5mm or less.
In the present invention, the particle diameter of the phenol resin particles may be 0.5mm or less.
In the present invention, the particle size of the contained particles may be 0.5mm or less.
Effects of the invention
According to the present invention, a resin particle mixture which can be used as a molding material or the like and has an excellent pot life can be provided.
Detailed Description
< resin particle mixture >
The resin particle mixture of the present embodiment contains epoxy resin particles and phenolic resin particles containing a curing accelerator. Hereinafter, the constituent elements of the resin particle mixture of the present embodiment, the necessary items of the production method, the applicable products, and the like will be described in order.
[ epoxy resin particles ]
The epoxy resin constituting the epoxy resin particles is not particularly limited as long as it is solid at normal temperature. The epoxy resin is, for example, a resin having two or more epoxy groups in one molecule. Examples of such epoxy resins include biphenyl type epoxy resins, stilbene type epoxy resins, diphenylmethane type epoxy resins, sulfur atom containing type epoxy resins, novolak type epoxy resins, dicyclopentadiene type epoxy resins, salicylaldehyde type epoxy resins, epoxy resins having a naphthalene structure, and copolymerized epoxy resins of naphthols and phenols. Examples of the epoxy resin include an epoxide of an aralkyl type phenol resin, a bisphenol type epoxy resin, an alcohol type glycidyl ether type epoxy resin, a glycidyl ether type epoxy resin of a p-xylene and/or m-xylene modified phenol resin, a glycidyl ether type epoxy resin of a terpene modified phenol resin, a cyclopentadiene type epoxy resin, a glycidyl ether type epoxy resin of a polycyclic aromatic ring modified phenol resin, a glycidyl ether type epoxy resin of a naphthalene ring-containing phenol resin, a glycidyl ester type epoxy resin, a glycidyl or methylglycidyl type epoxy resin, an alicyclic type epoxy resin, a halogenated phenol novolak type epoxy resin, a p-phenol type epoxy resin, a trimethylolpropane type epoxy resin, and a linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid. These may be used alone or in combination of two or more.
The biphenyl type epoxy resin is not particularly limited as long as it is an epoxy resin having a biphenyl skeleton, and examples thereof include epoxy resins of alkyl-substituted or unsubstituted biphenols.
The stilbene epoxy resin is not particularly limited as long as it is an epoxy resin having a stilbene skeleton, and examples thereof include diglycidyl ether type epoxy resins such as stilbene phenols.
The diphenylmethane epoxy resin is not particularly limited as long as it has a diphenylmethane skeleton.
The sulfur atom-containing epoxy resin is not particularly limited as long as it is an epoxy resin having a sulfur atom.
The novolak epoxy resin is a resin obtained by epoxidizing a novolak resin, and is obtained by condensing or co-condensing a phenol and/or a naphthol with a compound having an aldehyde group in the presence of an acidic catalyst. Examples of the phenols include phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, and bisphenol F. Examples of the naphthol include α -naphthol, β -naphthol, and dihydroxynaphthalene. Examples of the compound having an aldehyde group include formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde. Examples of the novolak type epoxy resin include a phenol novolak type epoxy resin and an o-cresol novolak type epoxy resin. These may be used alone or in combination of two or more.
The dicyclopentadiene type epoxy resin is not particularly limited as long as it is an epoxy resin obtained by epoxidizing a compound having a dicyclopentadiene skeleton as a raw material.
The salicylaldehyde-based epoxy resin is not particularly limited as long as it is an epoxy resin obtained by using a compound having a salicylaldehyde skeleton as a raw material.
Examples of the epoxy resin having a naphthalene structure include an epoxy resin in which a glycidyl group is bonded to a naphthalene skeleton. The epoxy resin having a naphthalene structure may also be 2-functional, 3-functional or 4-functional. The number of naphthalene skeletons in the epoxy resin having a naphthalene structure can be one or more, but is preferably two or more. The upper limit of the number of naphthalene skeletons can be set to 8. These may be used alone or in combination of two or more. By including the epoxy resin having a naphthalene structure in the resin composition, a decrease in mechanical strength of a molded article at high temperature can be suppressed.
Examples of the epoxy resin having a naphthalene structure include a naphthalene diepoxy compound, a naphthylene ether type epoxy resin, a naphthalene novolac type epoxy resin, a methylene-bonded dimer of a naphthalene diepoxy compound, a methylene-bonded body of a naphthalene monoepoxy compound and a naphthalene diepoxy compound, and the like, from the viewpoint of further improving the mechanical strength at room temperature and high temperature. Specific examples of the epoxy resin having a naphthalene structure include HP-4032, HP-4032D, HP-4700, HP-4750, EXA-7311-G4, EXA-7734-G4, and EXA-9540 (trade name, manufactured by DIC Corporation). These may be used alone or in combination of two or more.
The copolymerization type epoxy resin of naphthol and phenol is not particularly limited as long as it is an epoxy resin obtained from a compound having a naphthol skeleton and a compound having a phenol skeleton.
Examples of the epoxy compound of the aralkyl type phenol resin include epoxy compounds such as phenol aralkyl resins and naphthol aralkyl resins. These may be used alone or in combination of two or more.
Examples of the bisphenol epoxy resin include epoxy resins obtained from bisphenol a, bisphenol F, bisphenol S, and the like. These may be used alone or in combination of two or more.
Examples of the alcohol glycidyl ether type epoxy resin include glycidyl ether type epoxy resins such as butanediol, polyethylene glycol and polypropylene glycol. These may be used alone or in combination of two or more.
Examples of the glycidyl ester type epoxy resin include carboxylic acid type glycidyl ester type epoxy resins such as phthalic acid, isophthalic acid and tetrahydrophthalic acid. These may be used alone or in combination of two or more.
The glycidyl-type or methylglycidyl-type epoxy resin is, for example, a glycidyl-type or methylglycidyl-type epoxy resin in which active hydrogen bonded to a nitrogen atom such as aniline or isocyanuric acid is replaced with a glycidyl group.
Examples of the alicyclic epoxy resin include vinylcyclohexene diepoxide obtained by epoxidizing an olefin bond in a molecule, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexanecarboxylate, and 2- (3, 4-epoxy) cyclohexyl-5, 5-spiro (3, 4-epoxy) cyclohexane-m-dioxane. These may be used alone or in combination of two or more.
Among the above epoxy resins, from the viewpoint of water resistance, solvent resistance and oil resistance, epoxides of biphenyl type epoxy resins, stilbene type epoxy resins, diphenylmethane type epoxy resins, sulfur atom containing type epoxy resins and aralkyl type phenol resins are more preferable. Examples of the more preferable epoxy compound of the aralkyl type phenol resin include epoxy compounds of aralkyl type phenol resins such as phenol aralkyl resins, naphthol aralkyl resins, and biphenyl type phenol aralkyl resins. The epoxy compound of the aralkyl type phenol resin is not particularly limited as long as it is an epoxy resin obtained by using, as a raw material, a phenol resin synthesized from phenol such as phenol and cresol, and/or naphthol such as naphthol and dimethylnaphthol, and dimethoxyp-xylene, bis (methoxymethyl) biphenyl, and derivatives thereof. These may be used alone or in combination of two or more.
Among the above epoxy resins, from the viewpoint of high-temperature mechanical strength, a novolak type epoxy resin, a dicyclopentadiene type epoxy resin, a salicylaldehyde type epoxy resin, an epoxy resin having a naphthalene structure, and a copolymer type epoxy resin of a naphthol and a phenol are also more preferable. More preferred examples of the novolac-type epoxy resin include epoxy resins obtained by epoxidizing novolac-type phenolic resins such as phenol novolac, cresol novolac, and naphthol novolac by a method such as glycidyl etherification. These may be used alone or in combination of two or more.
[ phenolic resin particles ]
The phenolic resin constituting the phenolic resin particles is not particularly limited as long as it is solid at normal temperature. Examples of the phenolic resin include phenolic resins having two or more phenolic hydroxyl groups in one molecule, which are generally used as curing agents. Examples of the phenol resin include dicyclopentadiene type phenol resins, salicylaldehyde type phenol resins, copolymer type phenol resins of benzaldehyde type phenols and aralkyl type phenols, and novolak type phenol resins. Examples of the phenol resin include a compound having two phenolic hydroxyl groups in one molecule, an aralkyl type phenol resin, a p-xylene and/or m-xylene modified phenol resin, a melamine modified phenol resin, a terpene modified phenol resin, a dicyclopentadiene type naphthol resin, a cyclopentadiene modified phenol resin, a polycyclic aromatic ring modified phenol resin, a biphenyl type phenol resin, a triphenylmethane type phenol resin, and a phenol resin obtained by copolymerizing two or more of them. Examples of the aralkyl type phenol resin include aralkyl type phenol resins such as phenol aralkyl resins, naphthol aralkyl resins, and biphenyl type phenol aralkyl resins. These may be used alone or in combination of two or more. Examples of the compound having two phenolic hydroxyl groups in one molecule include resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted biphenol.
The phenol resin is preferably an aralkyl type phenol resin or a copolymerized phenol resin of benzaldehyde type phenol and aralkyl type phenol from the viewpoint of water resistance, solvent resistance and oil resistance. In addition, the phenol resin is preferably a dicyclopentadiene type phenol resin, a salicylaldehyde type phenol resin, or a novolak type phenol resin from the viewpoint of high-temperature mechanical strength. Examples of the novolak phenol resin include novolak phenol resins such as phenol novolak, cresol novolak, and naphthol novolak. These dicyclopentadiene type phenol resins, salicylaldehyde type phenol resins, copolymer type phenol resins of benzaldehyde type phenol and aralkyl type phenol, and novolak type phenol resins may be used singly or in combination of two or more.
The curing accelerator contained in the phenolic resin particles may contain tetra-substituted phosphonium tetra-substituted borate. The tetra-substituted phosphonium tetra-substituted borate is a compound represented by the following formula (I-0).
In the formula (I-0), R51～R58Each independently represents an organic group having 1 to 18 carbon atoms, and all of them may be the same or different.
R represented by the above general formula (I-0)51～R58The "organic group having 1 to 18 carbon atoms" means including at least one organic group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 18 carbon atoms which may be substituted or unsubstituted, an aliphatic hydrocarbyloxy group, a carbonyl group, an oxycarbonyl group, and a carbonyloxy group, and an aromatic hydrocarbon group having 6 to 18 carbon atoms which may be substituted or unsubstituted, and an aromatic hydrocarbyloxy group.
Examples of the substituted or unsubstituted aliphatic hydrocarbon group include aliphatic hydrocarbon groups such as methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, decyl, dodecyl, allyl, and vinyl groups, and groups obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, a hydroxyl group, an amino group, a halogen atom, and the like.
The substituted or unsubstituted aliphatic hydrocarbon group also includes a substituted or unsubstituted alicyclic hydrocarbon group. Examples of the substituted or unsubstituted alicyclic hydrocarbon group include cyclopentyl, cyclohexyl, cycloheptyl, cyclopentenyl, cyclohexenyl, and the like, and groups obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a hydroxyl group, an amino group, a halogen atom, and the like.
Examples of the substituted or unsubstituted aromatic hydrocarbon group include an aryl group such as a phenyl group and a tolyl group, an alkyl-substituted aryl group such as a dimethylphenyl group, an ethylphenyl group, a butylphenyl group and a tert-butylphenyl group, and an alkoxy-substituted aryl group such as a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group and a tert-butoxyphenyl group, and these may be further substituted with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an amino group, a halogen atom, or the like.
Examples of the aliphatic hydrocarbyloxy group include an oxy group having a structure in which an oxygen atom is bonded to the aliphatic hydrocarbon group, such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, a sec-butoxy group, a tert-butoxy group, a cyclopropoxy group, a cyclohexyloxy group, a cyclopentyloxy group, an allyloxy group, and a vinyloxy group, and a group obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an amino group, a halogen atom, or the like.
Examples of the aromatic hydrocarbyloxy group include an oxy group having a structure in which an oxygen atom is bonded to the above-mentioned aromatic hydrocarbon group, such as a phenoxy group, a methylphenoxy group, an ethylphenoxy group, a methoxyphenoxy group, a butoxyphenoxy group, and a phenoxyphenoxy group, and a group obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an amino group, a halogen atom, or the like.
Examples of the carbonyl group include an aliphatic hydrocarbon carbonyl group such as a formyl group, an acetyl group, an ethylcarbonyl group, a butyryl group, a cyclohexylcarbonyl group, and an allylcarbonyl group, an aromatic hydrocarbon carbonyl group such as a phenylcarbonyl group and a methylphenylcarbonyl group, and a group obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an amino group, a halogen atom, or the like.
Examples of the oxycarbonyl group include an aliphatic hydrocarbyloxycarbonyl group such as a methoxycarbonyl group, an ethoxycarbonyl group, a butoxycarbonyl group, an allyloxycarbonyl group, and a cyclohexyloxycarbonyl group, an aromatic hydrocarbyloxycarbonyl group such as a phenoxycarbonyl group and a methylphenoxycarbonyl group, and a group obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an amino group, a halogen atom, and the like.
Examples of the carbonyloxy group include aliphatic hydrocarbon carbonyloxy groups such as methylcarbonyloxy group, ethylcarbonyloxy group, butylcarbonyloxy group, allylcarbonyloxy group and cyclohexylcarbonyloxy group, aromatic hydrocarbon carbonyloxy groups such as phenylcarbonyloxy group and methylphenylcarbonyloxy group, and groups obtained by substituting these groups with an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an amino group, a halogen atom, and the like.
In the above general formula (I-0), R51～R54May be a substituted or unsubstituted aliphatic hydrocarbon group, R55～R58And may be a substituted or unsubstituted aromatic hydrocarbon group.
Specific examples of the tetra-substituted phosphonium and tetra-substituted borate include tetrabutylphosphonium and tetraphenylborate, n-butyltriphenylphosphonium and tetraphenylborate, tetraphenylphosphonium and tetraphenylborate, trimethylphenylphosphonium and tetraphenylborate, diethylmethylphenylphosphonium and tetraphenylborate, diallylmethylphosphonium and tetraphenylborate, (2-hydroxyethyl) triphenylphosphonium and tetraphenylborate, ethyltriphosphasphonium and tetraphenylborate, p-xylylenebis (triphenylphosphonium and tetraphenylborate), tetraphenylphosphonium and tetraethylborate, tetraphenylphosphonium and triethylphenylborate, and tetraphenylphosphonium and tetrabutylborate. Among them, tetrabutylphosphonium tetraphenylborate is preferable from the viewpoint of easily improving the strength of the molded article and easily suppressing the decrease in strength at high temperatures. These compounds may be used alone, or two or more of them may be used in combination.
Examples of the compound represented by the general formula (I-0) include PX-4PB (HOKKO CHEMICA L INDUSTRY CO., LTD. manufactured by LTD., trade name).
The curing accelerator may contain a known curing accelerator other than the above. When the curing accelerator contains a curing accelerator other than the above-mentioned one, the content of the curing accelerator is preferably 30% by mass or more, and more preferably 50% by mass or more, based on the mass of the curing accelerator. When the content of the curing accelerator is 30% by mass or more, the resin particle mixture can be sufficiently cured.
The structure of the curing accelerator can be analyzed by a nuclear magnetic resonance apparatus (NMR) or the like.
The decomposition temperature of the curing accelerator is preferably higher than the melting point of the phenolic resin. The melting point of the curing accelerator is preferably lower than the melting point of the phenolic resin.
< method for producing resin particle mixture >
The resin particle mixture is produced by mixing a particulate epoxy resin and a particulate phenol resin containing a curing accelerator. For mixing of the two, for example, a stirrer, a mixing rotor, a shaker, a mill, or the like having a stirring blade can be used without particular limitation. However, a mixing method that does not generate excessive heat due to friction between particles is preferable.
The epoxy resin particles are obtained by mechanically pulverizing a solid epoxy resin. The epoxy resin particles can be obtained by pulverizing one or more kinds of epoxy resins. In the case of using two or more epoxy resins, it is preferable that they are once melt-mixed to obtain a solid substance, and that it is pulverized into particles. Or two or more epoxy resins may be separately pulverized and mixed.
The shape of the epoxy resin particles is not particularly limited, but from the viewpoint of easily obtaining a uniform resin particle mixture, the epoxy resin particles preferably contain 90 mass% or more of particles having a particle diameter of 0.5mm or less, and more preferably consist of particles having a particle diameter of 0.5mm or less (substantially 100 mass%). That is, the particle diameter (maximum diameter) of the epoxy resin particles is preferably 0.5mm or less. The particle diameter (minimum diameter) of the epoxy resin particles is preferably 0.05mm or more. The epoxy resin particles can have an average particle diameter of 0.1 to 0.5mm from the viewpoint of the homogeneity of the mixture with the particulate phenol resin containing the curing accelerator. The particle diameter (maximum diameter, minimum diameter) and the average particle diameter of the epoxy resin particles can be measured by a laser diffraction particle size distribution analyzer.
The particulate phenol resin containing a curing accelerator can be obtained, for example, as follows. The mixture of the phenolic resin and the curing accelerator is heated, and the phenolic resin is melted while being stirred, and then cooled to obtain a solid substance. The obtained solid material was pulverized with a hammer and then ground with a mortar and pestle, whereby a particulate phenol resin containing a curing accelerator was obtained. The mixture of the phenolic resin and the curing accelerator may be obtained by not only mechanical stirring and mixing but also dispersion mixing by ultrasonic waves.
The shape of the phenol resin particles is not particularly limited, but from the viewpoint of easily obtaining a uniform resin particle mixture, the phenol resin particles preferably contain 90 mass% or more of particles having a particle diameter of 0.5mm or less, and more preferably consist of particles having a particle diameter of 0.5mm or less (substantially 100 mass%). That is, the maximum particle diameter (maximum diameter) of the phenol resin particles is preferably 0.5mm or less. The particle diameter (minimum diameter) of the phenolic resin particles is preferably 0.05mm or more. The average particle diameter of the phenol resin particles can be 0.1 to 0.5mm from the viewpoint of the homogeneity of the mixture with the epoxy resin particles. The particle diameter (maximum diameter, minimum diameter) and the average particle diameter of the phenol resin particles can be measured by a laser diffraction particle size distribution analyzer.
The resin particle mixture may contain other components, for example, within a range that does not impair the characteristics as a molding material. Examples of such components include coupling agents, elastomer modifiers, fillers, and flame retardants. The resin particle mixture may further include particles containing the above-exemplified phenol resin alone (may be referred to as particles composed of a phenol resin, or phenol resin particles containing no curing accelerator). The particles containing the phenol resin alone can be obtained by pulverizing a solid phenol resin. The particle diameter of the particles can be the same as that of the phenol resin particles, and for example, the maximum diameter thereof is preferably 0.5mm or less. When mixing the epoxy resin particles and the phenol resin particles, the above-mentioned other components and the particles containing the phenol resin alone can be mixed together.
From the viewpoint of easily obtaining a uniform resin particle mixture, the resin particle mixture preferably contains 90 mass% or more of particles having a particle diameter of 0.5mm or less, and more preferably consists of particles having a particle diameter of 0.5mm or less (substantially 100 mass%). That is, the particle diameter (maximum diameter) of the contained particles is preferably 0.5mm or less. The particle diameter (minimum diameter) of the contained particles is preferably 0.05mm or more. The average particle diameter of the particles contained in the composition can be 0.1 to 0.5 mm. The particle diameter (maximum diameter, minimum diameter) and the average particle diameter of the contained particles can be measured by a laser diffraction particle size distribution analyzer.
The amount of the curing accelerator to be added is not particularly limited as long as the curing accelerator effect can be achieved. However, from the viewpoint of improving curability and fluidity when the resin particle mixture absorbs moisture, the curing accelerator is included in the phenol resin particles in an amount of preferably 0.1 to 30 parts by mass, more preferably 1 to 20 parts by mass, and still more preferably 1 to 15 parts by mass per 100 parts by mass of the epoxy resin. When the amount of the curing accelerator is 0.1 to 30 parts by mass, the resin particle mixture as the molding material is cured at an appropriate curing rate.
In the resin particle mixture, the epoxy resin particles and the phenol resin particles are preferably mixed so that the mixing ratio of the epoxy resin to the phenol resin is 0.5 to 2.0, more preferably 0.7 to 1.5, and further preferably 0.8 to 1.3, in terms of the ratio of the hydroxyl group equivalent of all the phenol resins to the epoxy equivalent of all the epoxy resins (the number of hydroxyl groups in the phenol resin/the number of epoxy groups in the epoxy resin). When the ratio is 0.5 to 2.0, the epoxy resin is sufficiently cured, and the heat resistance of the cured product is improved.
< method of using resin particle mixture >
The resin particle mixture can be used as a molding material (bonding material). For example, a molded article containing a filler can be obtained by using a resin particle mixture together with a filler to be molded. Specifically, the molded article can be obtained by placing a resin particle mixture and a mixture containing a filler in a mold, and then performing compression molding, warm-time molding, or the like. By further heating the molded body, the molded body can be cured.
Further, after mixing the resin particle mixture dissolved in the solvent with the filler, the resin derived from the resin particle mixture can be coated on the surface of the filler by removing the solvent (distilling off) and drying it. Further, the resin particle mixture and the filler-containing mixture may be melt-kneaded using a kneader, a twin-roll kneader, or the like. By molding these as described above, a molded article can be obtained.
Examples of the filler include silica powder, magnetic metal powder, and ferrite powder.
When silica powder (silica particles) is used as the filler, the molded product can be used as an insulating material, a sealing material, or the like.
When the filler is hard magnetic powder, the molded body can be used as a bonded magnet. Examples of the hard magnetic powder include alloy powders such as FeNdB and SmFeN, and Fe oxide powders such as ferrite powders.
When the filler is soft magnetic powder, the molded article can be used as a magnetic sealing material.
As the filler, a powder containing a metal element can also be used. The powder containing a metal element may contain, for example, at least one selected from the group consisting of a metal monomer, an alloy, and a metal compound. The powder containing a metal element may be composed of at least one selected from the group consisting of a metal monomer, an alloy, and a metal compound, for example. The alloy may include at least one selected from the group consisting of a solid solution, a eutectic, and an intermetallic compound. The alloy may be, for example, stainless steel (e.g., Fe-Cr alloy, Fe-Ni-Cr alloy, etc.). The metal compound may be an oxide such as ferrite. The powder containing a metal element may contain one metal element or a plurality of metal elements. The metal element may be, for example, a base metal element, a noble metal element, a transition metal element or a rare earth element. The metal element may be at least one selected from the group consisting of iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), aluminum (Al), tin (Sn), chromium (Cr), barium (Ba), strontium (Sr), lead (Pb), silver (Ag), praseodymium (Pr), neodymium (Nd), samarium (Sm), and dysprosium (Dy), for example. The powder containing a metal element may contain an element other than the metal element. The powder containing a metal element may contain, for example, oxygen (O), beryllium (Be), phosphorus (P), boron (B), or silicon (Si). The powder containing the metal element may be a magnetic powder. The powder containing the metallic element may be a soft magnetic alloy or a ferromagnetic alloy. The powder containing the metal element may be at least one selected from the group consisting of an Fe — Si alloy, an Fe — Si — Al alloy (ferrosilicon aluminum alloy), an Fe — Ni alloy (permalloy), an Fe — Cu — Ni alloy (permalloy), an Fe — Co alloy (parmend alloy), an Fe — Cr — Si alloy (electromagnetic stainless steel), an Nd — Fe — B alloy (rare earth magnet), an Sm — Fe — N alloy (rare earth magnet), an Al — Ni — Co alloy (aluminum nickel magnet), and ferrite, for example. The ferrite may be, for example, spinel ferrite, hexagonal ferrite or garnet ferrite. The powder containing the metal element may Be a copper alloy such as a Cu-Sn alloy, a Cu-Sn-P alloy, a Cu-Ni alloy, or a Cu-Be alloy. The powder containing a metal element may contain one or more of the above elements.
The powder containing the metal element may be an Fe monomer. The powder containing the metal element may be an alloy containing iron (Fe-based alloy). The Fe-based alloy may be, for example, an Fe-Si-Cr-based alloy or an Nd-Fe-B-based alloy. The powder containing the metallic element may be an Fe amorphous alloy. Examples of commercially available Fe amorphous alloy powders include AW2-08, kuumet-6B 2 (trade name manufactured by Epson Atmix corporation), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49, DAP 410L, DAP 430L, DAP HYB series (trade name manufactured by Daido Steel co., ltd.), MH45D, MH28D, MH25D, and MH20D (trade name manufactured by KOBE Steel, ltd.).
Examples
The present invention will be described more specifically with reference to the following examples, but the scope of the present invention is not limited to the examples shown below.
(example 1)
100g of HP-850N (Hitachi Chemical Co., Ltd., product name) and 4.5g of PX-4PB (HOKKO CHEMICAL INDUSTRY CO., LTD., product name) were added as a curing accelerator (catalyst) to a 500mL separable flask equipped with a stirring blade. PX-4PB is a compound represented by the above general formula (I-0). The flask was heated to 110 ℃ in an oil bath to melt the phenolic resin. After melting, stirring was carried out for 1 hour to obtain a melt containing a phenol resin and a curing accelerator. This was recovered on a teflon sheet (teflon is a registered trademark), and a solid substance was obtained by cooling to room temperature.
The obtained solid material was pulverized with a hammer, further pulverized with a mortar/pestle to give particles having a maximum diameter of 0.5mm or less, and sieved with a sieve having a mesh size of 500. mu.m. Thereby, phenolic resin particles containing a curing accelerator were obtained.
EPPN-502H (product name, manufactured by Nippon Kayaku Co., Ltd.) was pulverized with a hammer as a salicylaldehyde-type epoxy resin, and then pulverized with a mortar/pestle so that the maximum diameter of the particles was 0.5mm or less, and then sieved with a sieve having a mesh size of 500. mu.m. Thereby, epoxy resin particles were obtained.
100g of the epoxy resin particles obtained as described above and 80g of the phenol resin particles containing a curing accelerator were taken out into a 500mL jar and mixed for 1 hour by a mixing rotor. Thereby, a resin particle mixture was obtained.
(example 2)
A resin particle mixture was obtained in the same manner as in example 1 except that NC-3000H (Nippon Kayaku co., ltd. product name) which is an epoxide of an aralkyl type phenol resin (biphenyl type phenol aralkyl resin) was used as the epoxy resin instead of EPPN-502H.
(example 3)
A500 mL separable flask equipped with a stirring blade was charged with 100g of HP-850N and 10g of PX-4 PB. The flask was heated to 150 ℃ in an oil bath to melt the phenolic resin. Then, phenolic resin particles containing a curing accelerator were obtained in the same manner as in example 1.
And, epoxy resin particles were obtained in the same manner as in example 1.
Further, HP-850N was pulverized with a hammer, and further pulverized with a mortar/pestle so that the maximum diameter of the particles was 0.5mm or less, and then sieved with a sieve having a mesh size of 500. mu.m. Thus, phenol resin particles (phenol resin particles containing no curing accelerator) were obtained.
100g of epoxy resin particles, 40g of phenol resin particles containing a curing accelerator, and 40g of phenol resin particles were weighed into a 500mL jar and mixed for 1 hour by a mixing rotor. Thereby, a resin particle mixture was obtained.
Comparative example 1
A500 mL separable flask equipped with a stirring blade was charged with 100g of HP-850N, 80g of EP PN-502H, and 4.5g of PX-4 PB. The flask was heated to 110 ℃ in an oil bath to melt the phenolic and epoxy resins. After melting, stirring for 30 minutes to obtain a melt containing the epoxy resin, the phenolic resin and the curing accelerator. This was recovered on a teflon sheet (teflon is a registered trademark), and a solid substance was obtained by cooling to room temperature.
The obtained solid material was pulverized with a hammer, further pulverized with a mortar/pestle to give particles having a maximum diameter of 0.5mm or less, and sieved with a sieve having a mesh size of 500. mu.m. Thus, resin particles containing an epoxy resin, a phenol resin, and a curing accelerator were obtained.
(reference example 1)
In example 1, the epoxy resin particles and the phenol resin particles containing the curing accelerator were ground to a maximum diameter of 2mm or less, and then sieved out with a sieve having a mesh size of 2 mm. Except for this, a particle mixture was obtained in the same manner as in example 1.
[ evaluation of storage stability ]
The resin particle mixture or the resin particles of each example were placed in a thermostatic bath at 40 ℃ for one week. After collecting about 1g of the resin particle mixture or the resin particles after standing in a 20mL glass bottle, the mixture was weighed, 10mL of acetone was added thereto, and the mixture was stirred for 30 minutes to prepare a sample solution. Each sample solution was filtered using a filter paper having a mass measured by a precision balance, the filter paper was dried in a drier at 100 ℃ for 30 minutes, and then the mass was measured by a precision balance to determine the residue remaining on the filter paper, and the residue amount (g)/collection amount (g) was evaluated as the gel fraction. The results are shown in table 1. In this evaluation, when the gel fraction is 20% or less, it is judged that the resin particle mixture has excellent storage stability (usable time).
[ evaluation of particle uniformity ]
0.2g of the resin particle mixture or the resin particles of each example was extracted from 3 arbitrary portions, and the IR spectra thereof were compared. Then, the sample was cut to 800cm-1To 1600cm-1The case where the matching rate of the IR spectrum in the region was 95% or more was evaluated as "good", and the case other than this was evaluated as "poor". The results are shown in table 1.
[ Table 1]
(application example 1)
In a 300mL round bottom flask, 4g of the resin particle mixture of example 1 was placed and dissolved in 100mL of acetone. 196g of NdFeB powder was added thereto, and after stirring at room temperature for 1 hour, acetone was distilled off by an evaporator. Then, the total amount was recovered on a teflon sheet (teflon is a registered trademark), and dried for 48 hours at normal temperature with a vacuum drier, to obtain a magnetic powder resin composite.
After the resin composite was molded under 200MPa, it was heat-treated at 190 ℃ for 1 hour to obtain a cylindrical NdFeB bonded magnet of 11. phi. times.10 mm.
(application example 2)
In a 300mL round bottom flask, 6g of the resin particle mixture of example 1 was placed and dissolved in 120mL of acetone. 194g of SmFeN powder was added thereto, and after stirring at room temperature for 1 hour, acetone was distilled off by an evaporator. Then, the total amount was recovered on a teflon sheet (teflon is a registered trademark), and dried for 48 hours at normal temperature with a vacuum drier, to obtain a magnetic powder resin composite.
After the resin composite was molded under 100MPa, it was heat-treated at 190 ℃ for 1 hour to obtain a cylindrical SmFeN bonded magnet of 11. phi. times.10 mm.
(application example 3)
6g of the resin particle mixture of example 1 was placed in a 300mL jar. 194g of SmFeN powder was added thereto, and the mixture was stirred at room temperature for 2 hours by a mixing rotor to obtain a magnetic powder resin mixed powder.
The resin mixed powder was molded at 100 ℃ under 200MPa, and then heat-treated at 190 ℃ for 1 hour to obtain a cylindrical SmFeN bonded magnet of 11. phi. times.10 mm.
Claims (7)
1. A resin particle mixture contains epoxy resin particles and phenolic resin particles containing a curing accelerator.
2. The resin particle mixture according to claim 1, wherein,
the epoxy resin constituting the epoxy resin particles contains at least one selected from the group consisting of biphenyl type epoxy resins, stilbene type epoxy resins, diphenylmethane type epoxy resins, sulfur atom containing type epoxy resins, novolak type epoxy resins, dicyclopentadiene type epoxy resins, salicylaldehyde type epoxy resins, epoxy resins having a naphthalene structure, and copolymerized type epoxy resins of naphthols and phenols.
3. The resin particle mixture according to claim 1 or 2, wherein,
the phenolic resin constituting the phenolic resin particles contains at least one selected from the group consisting of dicyclopentadiene type phenolic resins, salicylaldehyde type phenolic resins, copolymerized type phenolic resins of benzaldehyde type phenols and aralkyl type phenols, and novolac type phenolic resins.
4. The resin particle mixture according to any one of claims 1 to 3, wherein,
the cure accelerator comprises a tetra-substituted phosphonium tetra-substituted borate.
5. The resin particle mixture according to any one of claims 1 to 4,
the particle diameter of the epoxy resin particles is less than 0.5 mm.
6. The resin particle mixture according to any one of claims 1 to 5,
the particle diameter of the phenolic resin particles is less than 0.5 mm.
7. The resin particle mixture according to any one of claims 1 to 6,
the particle diameter of the contained particles is 0.5mm or less.
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/JP2019/018444 WO2020225884A1 (en) | 2019-05-08 | 2019-05-08 | Resin particle mixture |
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| JP (1) | JP7294412B2 (en) |
| CN (1) | CN113785000A (en) |
| WO (1) | WO2020225884A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04288317A (en) * | 1990-05-28 | 1992-10-13 | Somar Corp | Powdered epoxy resin composition and production thereof |
| CN107001282A (en) * | 2015-01-19 | 2017-08-01 | 日本曹达株式会社 | The manufacture method of inclusion compound |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62289572A (en) * | 1986-06-07 | 1987-12-16 | Agency Of Ind Science & Technol | Self-curing epoxy compound |
| JPH0762060B2 (en) * | 1987-03-13 | 1995-07-05 | 宇部興産株式会社 | Method for producing polyphenols |
| JP3043838B2 (en) * | 1991-06-05 | 2000-05-22 | 日本ユニカー株式会社 | Silicone block copolymer and epoxy resin composition for molding |
| JPH10204331A (en) * | 1997-01-28 | 1998-08-04 | Sumitomo Chem Co Ltd | Powder coating material and article coated therewith |
| JPH11322897A (en) * | 1998-05-20 | 1999-11-26 | Nippon Kayaku Co Ltd | Photocationically polymerizable epoxy resin-based solid composition and article |
| JP3685669B2 (en) * | 1999-11-01 | 2005-08-24 | ジャパンエポキシレジン株式会社 | Epoxy resin composition |
| JP4514018B2 (en) * | 2002-04-12 | 2010-07-28 | 新日鐵化学株式会社 | Epoxy powder coating composition |
| JP2004292645A (en) * | 2003-03-27 | 2004-10-21 | Sumitomo Bakelite Co Ltd | Epoxy resin powder coating |
| JP4905769B2 (en) * | 2006-03-31 | 2012-03-28 | Ｄｉｃ株式会社 | Epoxy resin composition for powder coating |
| JP5073253B2 (en) * | 2006-09-08 | 2012-11-14 | Ｎｔｎ株式会社 | Resin sliding material |
| JP5402611B2 (en) * | 2009-12-22 | 2014-01-29 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| JP2011017018A (en) * | 2010-09-10 | 2011-01-27 | Mitsubishi Chemicals Corp | Epoxy resin composition and semiconductor device |
| KR101518502B1 (en) * | 2012-12-26 | 2015-05-11 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same |
-
2019
- 2019-05-08 WO PCT/JP2019/018444 patent/WO2020225884A1/en active Application Filing
- 2019-05-08 JP JP2021518258A patent/JP7294412B2/en active Active
- 2019-05-08 CN CN201980096119.4A patent/CN113785000A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04288317A (en) * | 1990-05-28 | 1992-10-13 | Somar Corp | Powdered epoxy resin composition and production thereof |
| CN107001282A (en) * | 2015-01-19 | 2017-08-01 | 日本曹达株式会社 | The manufacture method of inclusion compound |
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| JPWO2020225884A1 (en) | 2020-11-12 |
| WO2020225884A1 (en) | 2020-11-12 |
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