CN112166154B - Composite and molded article - Google Patents
Composite and molded article Download PDFInfo
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- CN112166154B CN112166154B CN201880093806.6A CN201880093806A CN112166154B CN 112166154 B CN112166154 B CN 112166154B CN 201880093806 A CN201880093806 A CN 201880093806A CN 112166154 B CN112166154 B CN 112166154B
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- 239000002131 composite material Substances 0.000 title claims abstract description 107
- 239000003822 epoxy resin Substances 0.000 claims abstract description 99
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 99
- 229910052751 metal Inorganic materials 0.000 claims abstract description 93
- 239000002184 metal Substances 0.000 claims abstract description 92
- 150000001875 compounds Chemical class 0.000 claims abstract description 86
- 239000011342 resin composition Substances 0.000 claims abstract description 79
- 239000000843 powder Substances 0.000 claims abstract description 74
- 239000000126 substance Substances 0.000 claims description 90
- -1 siloxane compound Chemical class 0.000 claims description 79
- 125000004432 carbon atom Chemical group C* 0.000 claims description 42
- 229920001296 polysiloxane Polymers 0.000 claims description 40
- 229910045601 alloy Inorganic materials 0.000 claims description 31
- 239000000956 alloy Substances 0.000 claims description 31
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 28
- 125000000962 organic group Chemical group 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 125000003700 epoxy group Chemical group 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 125000001033 ether group Chemical group 0.000 claims description 6
- 229920001281 polyalkylene Polymers 0.000 claims description 6
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 238000000465 moulding Methods 0.000 abstract description 24
- 238000001723 curing Methods 0.000 description 60
- 239000005011 phenolic resin Substances 0.000 description 29
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 28
- 239000003795 chemical substances by application Substances 0.000 description 27
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 24
- 239000002245 particle Substances 0.000 description 24
- 239000000047 product Substances 0.000 description 24
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 16
- 229920003986 novolac Polymers 0.000 description 16
- 229920001568 phenolic resin Polymers 0.000 description 16
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 239000001993 wax Substances 0.000 description 13
- 239000007822 coupling agent Substances 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical compound CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 description 11
- 238000004898 kneading Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 8
- 239000004305 biphenyl Substances 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229940126214 compound 3 Drugs 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000194 fatty acid Substances 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 229910000859 α-Fe Inorganic materials 0.000 description 7
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 125000001624 naphthyl group Chemical group 0.000 description 6
- 238000001721 transfer moulding Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 150000002736 metal compounds Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 125000005023 xylyl group Chemical group 0.000 description 5
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 239000006247 magnetic powder Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-M octacosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O UTOPWMOLSKOLTQ-UHFFFAOYSA-M 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 1
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 description 1
- JRQJLSWAMYZFGP-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical compound OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JRQJLSWAMYZFGP-UHFFFAOYSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- ONBQEOIKXPHGMB-VBSBHUPXSA-N 1-[2-[(2s,3r,4s,5r)-3,4-dihydroxy-5-(hydroxymethyl)oxolan-2-yl]oxy-4,6-dihydroxyphenyl]-3-(4-hydroxyphenyl)propan-1-one Chemical compound O[C@@H]1[C@H](O)[C@@H](CO)O[C@H]1OC1=CC(O)=CC(O)=C1C(=O)CCC1=CC=C(O)C=C1 ONBQEOIKXPHGMB-VBSBHUPXSA-N 0.000 description 1
- UNILWMWFPHPYOR-KXEYIPSPSA-M 1-[6-[2-[3-[3-[3-[2-[2-[3-[[2-[2-[[(2r)-1-[[2-[[(2r)-1-[3-[2-[2-[3-[[2-(2-amino-2-oxoethoxy)acetyl]amino]propoxy]ethoxy]ethoxy]propylamino]-3-hydroxy-1-oxopropan-2-yl]amino]-2-oxoethyl]amino]-3-[(2r)-2,3-di(hexadecanoyloxy)propyl]sulfanyl-1-oxopropan-2-yl Chemical compound O=C1C(SCCC(=O)NCCCOCCOCCOCCCNC(=O)COCC(=O)N[C@@H](CSC[C@@H](COC(=O)CCCCCCCCCCCCCCC)OC(=O)CCCCCCCCCCCCCCC)C(=O)NCC(=O)N[C@H](CO)C(=O)NCCCOCCOCCOCCCNC(=O)COCC(N)=O)CC(=O)N1CCNC(=O)CCCCCN\1C2=CC=C(S([O-])(=O)=O)C=C2CC/1=C/C=C/C=C/C1=[N+](CC)C2=CC=C(S([O-])(=O)=O)C=C2C1 UNILWMWFPHPYOR-KXEYIPSPSA-M 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- RDYWHMBYTHVOKZ-UHFFFAOYSA-N 18-hydroxyoctadecanamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCO RDYWHMBYTHVOKZ-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical class C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NODRXLWVBKZXOO-UHFFFAOYSA-N 2-(hydroxymethyl)docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCC(CO)C(N)=O NODRXLWVBKZXOO-UHFFFAOYSA-N 0.000 description 1
- KHTJRKQAETUUQH-UHFFFAOYSA-N 2-(hydroxymethyl)octadecanamide Chemical compound CCCCCCCCCCCCCCCCC(CO)C(N)=O KHTJRKQAETUUQH-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical group CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- CFGWPPPFYVFLLB-UHFFFAOYSA-N 5-carbamoyl-5-octadecyltricosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(C(N)=O)(CCCC(O)=O)CCCCCCCCCCCCCCCCCC CFGWPPPFYVFLLB-UHFFFAOYSA-N 0.000 description 1
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- 239000004925 Acrylic resin Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910019819 Cr—Si Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
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- 239000005639 Lauric acid Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 150000007945 N-acyl ureas Chemical class 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
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- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
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- 229910052772 Samarium Inorganic materials 0.000 description 1
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- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- WREOTYWODABZMH-DTZQCDIJSA-N [[(2r,3s,4r,5r)-3,4-dihydroxy-5-[2-oxo-4-(2-phenylethoxyamino)pyrimidin-1-yl]oxolan-2-yl]methoxy-hydroxyphosphoryl] phosphono hydrogen phosphate Chemical compound O[C@@H]1[C@H](O)[C@@H](COP(O)(=O)OP(O)(=O)OP(O)(O)=O)O[C@H]1N(C=C\1)C(=O)NC/1=N\OCCC1=CC=CC=C1 WREOTYWODABZMH-DTZQCDIJSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- PFXFKBDDQUKKTF-UHFFFAOYSA-N amino(phenyl)silicon Chemical compound N[Si]C1=CC=CC=C1 PFXFKBDDQUKKTF-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- UFZOLVFGAOAEHD-UHFFFAOYSA-N benzaldehyde;phenol Chemical compound OC1=CC=CC=C1.O=CC1=CC=CC=C1 UFZOLVFGAOAEHD-UHFFFAOYSA-N 0.000 description 1
- VXYLRHJJKXASIK-UHFFFAOYSA-N benzhydrylbenzene;phenol Chemical compound OC1=CC=CC=C1.C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 VXYLRHJJKXASIK-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical compound C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- TXSUIVPRHHQNTM-UHFFFAOYSA-N n'-(3-methylanilino)-n-phenyliminobenzenecarboximidamide Chemical compound CC1=CC=CC(NN=C(N=NC=2C=CC=CC=2)C=2C=CC=CC=2)=C1 TXSUIVPRHHQNTM-UHFFFAOYSA-N 0.000 description 1
- PECBPCUKEFYARY-ZPHPHTNESA-N n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC PECBPCUKEFYARY-ZPHPHTNESA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- DJWFNQUDPJTSAD-UHFFFAOYSA-N n-octadecyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCCCCCCCC DJWFNQUDPJTSAD-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
Abstract
The present invention provides a composite with small molding shrinkage. The composite comprises a metal element-containing powder and a resin composition containing an epoxy resin and a compound having a siloxane bond.
Description
Technical Field
The present invention relates to a composite and a molded article.
Background
A composite comprising a metal powder and a resin composition is used as a material for various industrial products such as an inductor, an electromagnetic wave shielding material, and a bonded magnet, depending on physical properties of the metal powder (see patent document 1 below).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2014-13803
Disclosure of Invention
Problems to be solved by the invention
In the case of manufacturing an industrial product from a composite, the composite is supplied to another member (for example, a cured product of another composite), and the composite is cured, thereby manufacturing a molded body. The larger the molding shrinkage of the composite, the more likely the molded body is to warp, and the more difficult it is to process the molded body into a desired shape. Therefore, the molding shrinkage of the composite is required to be small.
The purpose of the present invention is to provide a composite with a small molding shrinkage and a molded article comprising the composite.
Means for solving the problems
The composite according to one aspect of the present invention comprises a metal element-containing powder and a resin composition containing an epoxy resin and a compound (chemical compound) having a siloxane bond.
In the compound according to one aspect of the present invention, the content of the compound having a siloxane bond is 25 parts by mass or more and 45 parts by mass or less relative to 100 parts by mass of the epoxy resin.
The above-mentioned composite according to an aspect of the present invention may contain a 1 st siloxane compound as the compound having a siloxane bond, and the 1 st siloxane compound may have a structural unit represented by the following chemical formula (1).
[ chemical 1]
[ in the above chemical formula (1), R 1 R is R 2 Each independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.]
In the above-described composite according to an aspect of the present invention, the 1 st siloxane compound may have a structural unit represented by the following chemical formula (2).
[ chemical 2]
[ in the above chemical formula (2), R 3 Is an alkylene group having 1 to 10 carbon atoms. ]
The above-mentioned compound according to an aspect of the present invention may contain a compound represented by the following chemical formula (3) as the 1 st silicone compound.
[ chemical 3]
[ in the above chemical formula (3), n is an integer of 1 to 200, m 1 M 2 Each independently is an integer of 1 to 200, R 4 、R 5 、R 6 R is R 7 Each independently is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms, R 8 R is R 9 Each independently is an alkylene group having 1 to 10 carbon atoms, R 10 R is R 11 Each independently represents a 2-valent hydrocarbon group having 1 to 10 carbon atoms.]
The compound according to one aspect of the present invention may contain a 2 nd siloxane compound as the compound having a siloxane bond, and the 2 nd siloxane compound may have a structural unit represented by the following chemical formula (4) and a structural unit represented by the following chemical formula (5).
[ chemical 4]
[ in the aforementioned chemical formula (4), R 12 Is a 1-valent hydrocarbon group having 1 to 12 carbon atoms.]
[ chemical 5]
[ in the aforementioned chemical formula (5), R 13 R is R 14 Each independently represents a 1-valent hydrocarbon group having 1 to 12 carbon atoms.]
In the above-mentioned composite according to an aspect of the present invention, the 2 nd siloxane compound may have a structural unit represented by the following chemical formula (6).
[ chemical 6]
[ in the aforementioned chemical formula (6), R 15 Is a 1-valent hydrocarbon group with 1-12 carbon atoms, R 16 Is a 1-valent organic group having an epoxy group.]
The compound according to one aspect of the present invention may include, as the 2 nd siloxane compound, a compound having at least one structural unit selected from the group consisting of a structural unit represented by the following chemical formula (7), a structural unit represented by the following chemical formula (8), a structural unit represented by the following chemical formula (9), and a structural unit represented by the following chemical formula (10).
[ chemical 7]
[ chemical 8]
[ chemical 9]
[ chemical 10]
The compound according to one aspect of the present invention may contain at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin.
In the above-described composite according to an aspect of the present invention, the content of the metal element-containing powder may be 90 mass% or more and less than 100 mass%.
The molded article according to one aspect of the present invention comprises the above-described composite.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, there is provided a composite having a small molding shrinkage and a molded article comprising the composite.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described. However, the present invention is not limited to the following embodiments.
< overview of complexes >)
The composite according to the present embodiment includes a metal element-containing powder and a resin composition.
The metal element-containing powder is composed of a plurality of (large number of) metal element-containing particles. The metal element-containing powder (metal element-containing particles) may contain at least one selected from the group consisting of a metal simple substance, an alloy, and a metal compound, for example. The resin composition contains at least an epoxy resin and a compound having a siloxane bond. Compounds having a siloxane bond are sometimes referred to as "siloxane compounds". The resin composition may contain other components in addition to the epoxy resin and the silicone compound. For example, the resin composition may contain a curing agent. The resin composition may also contain a curing accelerator. The resin composition may contain additives. The resin composition may contain an epoxy resin, a silicone compound, a curing agent, a curing accelerator, and an additive, or may contain the remaining components (nonvolatile components) excluding an organic solvent and a metal element-containing powder. The additive means the rest of the components in the resin composition except the resin, the silicone compound, the curing agent and the curing accelerator. The additive is, for example, a coupling agent, a flame retardant, or the like. The resin composition may contain wax as an additive. The composite may be a powder (composite powder).
The composite according to the present embodiment contains a silicone compound as one kind of elastomer, and therefore, the elasticity of the composite as a whole can be reduced, and the stress applied to the composite can be reduced as the composite shrinks (thermally cures) as it is formed. As a result, the molding shrinkage of the composite according to the present embodiment can be reduced. However, the operational effects of the present invention are not limited to the above matters.
The composite may include a metal element-containing powder and a resin composition attached to the surface of each metal element-containing particle constituting the metal element-containing powder. The resin composition may cover the entire surface of the particles, or may cover only a part of the surface of the particles. The composite may be provided with an uncured resin composition and a metal element-containing powder. The composite may also be provided with a semi-solid of a resin composition (for example, an ethyl resin composition) and a metal element-containing powder. The composite may also be provided with both an uncured resin composition and a prepreg of the resin composition. The composite may be composed of a metal element-containing powder and a resin composition.
The content of the metal element-containing powder in the composite may be 90 mass% or more and less than 100 mass%, 90 mass% or more and 99.8 mass% or less, 92 mass% or more and 99.8 mass% or less, or 94 mass% or more and 99.8 mass% or less, relative to the mass of the entire composite. The composite may contain other filler materials (e.g., silica filler) in addition to the metal element-containing powder.
The content of the resin composition in the composite may be 0.2 mass% or more and 10 mass% or less, or 4 mass% or more and 6 mass% or less, relative to the mass of the composite as a whole (for example, the total mass of the metal element-containing powder and the resin composition).
The content of the siloxane compound in the composite may be 25 parts by mass or more and 45 parts by mass or less, or 25 parts by mass or more and 35 parts by mass or less with respect to 100 parts by mass of the epoxy resin. When the content of the silicone compound is within the above range, the molding shrinkage of the composite tends to be small.
The average particle diameter of the metal element-containing powder is not particularly limited, and may be, for example, 1 μm or more and 300 μm or less. The average particle diameter can be measured, for example, by a particle size distribution meter. The shape of each metal element-containing particle constituting the metal element-containing powder is not limited, and may be, for example, spherical, flat, prismatic, or needle-like. The composite may be provided with a plurality of metal element-containing powders having different average particle diameters.
The composition or combination of the metal element-containing powder contained in the composite can freely control various characteristics such as electromagnetic characteristics of a molded body formed from the composite, and the molded body can be used for various industrial products or raw materials thereof. Industrial products manufactured using the composite may be, for example, automobiles, medical devices, electronic devices, electric devices, information communication devices, home electric appliances, audio devices, and general industrial devices. For example, when the composite contains a permanent magnet such as an sm—fe—n alloy or an nd—fe—b alloy as a metal element-containing powder, the composite can be used as a raw material of a bonded magnet. When the composite contains a soft magnetic powder such as an fe—si—cr alloy or ferrite as a metal element-containing powder, the composite can be used as a material (e.g., a magnetic core) of an inductor (e.g., an EMI filter) or a transformer. In the case where the composite contains iron and copper as metal element-containing powders, a molded body (e.g., a sheet) formed of the composite can be utilized as an electromagnetic wave shielding material.
Composition of the complex
(resin composition)
The resin composition has a function as a binding material (binder) for metal element-containing particles constituting the metal element-containing powder, and imparts mechanical strength to a molded body formed of the composite. For example, the resin composition is filled between particles containing a metal element when the composite is molded under high pressure using a mold, and the particles containing a metal element are bonded to each other. By curing the resin composition in the molded article, the cured product of the resin composition more firmly bonds the metal element-containing particles to each other, and the mechanical strength of the molded article is improved.
The resin composition contains at least an epoxy resin as a thermosetting resin. By including the epoxy resin having relatively excellent fluidity in the thermosetting resin in the composite, the fluidity, storage stability and moldability of the composite are improved. However, the compound may contain other resins in addition to the epoxy resin as long as the effect of the present invention is not hindered. For example, the resin composition may contain at least one of a phenolic resin and a polyamideimide resin as a thermosetting resin. In the case where the resin composition contains both an epoxy resin and a phenolic resin, the phenolic resin may function as a curing agent for the epoxy resin. The resin composition may comprise a thermoplastic resin. The thermoplastic resin may be at least one selected from the group consisting of acrylic resins, polyethylene, polypropylene, polystyrene, polyvinyl chloride, and polyethylene terephthalate, for example. The resin composition may contain both thermosetting resins and thermoplastic resins. The resin composition may comprise a silicone resin.
The epoxy resin may be, for example, a resin having 2 or more epoxy groups in 1 molecule. The epoxy resin may be, for example, at least one type of aliphatic epoxy resin selected from the group consisting of biphenyl type epoxy resins, stilbene type epoxy resins, diphenylmethane type epoxy resins, sulfur atom type epoxy resins, novolac type epoxy resins, dicyclopentadiene type epoxy resins, salicylaldehyde type epoxy resins, naphthol type and phenol type copolymerized epoxy resins, aralkyl type phenolic resins, bisphenol type epoxy resins, bisphenol skeleton-containing epoxy resins, alcohol type glycidyl ether type epoxy resins, para-xylene and/or meta-xylene modified phenolic resins, terpene modified phenolic resins, cyclopentadiene type epoxy resins, polycyclic aromatic ring modified phenolic resins, glycidyl ether type epoxy resins, naphthalene ring-containing phenolic resins, glycidyl ester type epoxy resins, glycidyl or methylglycidyl type epoxy resins, alicyclic type epoxy resins, halogenated phenol novolac type epoxy resins, o-cresol novolac type epoxy resins, hydroquinone type epoxy resins, trimethylolpropane type epoxy resins, and aliphatic epoxy resins obtained by oxidizing olefin bonds with a peracid such as peracetic acid.
The epoxy resin may be at least one selected from the group consisting of biphenyl type epoxy resin, orthocresol novolac type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, epoxy resin having a bisphenol skeleton, salicylaldehyde novolac type epoxy resin, and naphthol novolac type epoxy resin, from the viewpoint of excellent fluidity.
The epoxy resin may be a crystalline epoxy resin. Although the crystalline epoxy resin has a low molecular weight, the crystalline epoxy resin has a high melting point and is excellent in fluidity. The crystalline epoxy resin (epoxy resin having high crystallinity) may be at least one selected from the group consisting of hydroquinone-type epoxy resin, bisphenol-type epoxy resin, thioether-type epoxy resin, and biphenyl-type epoxy resin, for example. The commercially available crystalline epoxy resin may be, for example, one selected from the group consisting of epicenter 860, epicenter 1050, epicenter 1055, epicenter 2050, epicenter 3050, epicenter 4050, epicenter 7050, epicenter HM-091, epicenter HM-101, epicenter N-730A, epicenter N-740, epicenter N-770, epicenter N-775, epicenter N-865, epicenter HP-4032D, epicenter HP-7200L, epicenter HP-7200H, epicenter HP-7200HH, epicenter HP-4700, epicenter HP-4710, epicenter HP-4770, epicenter HP-5000, epicenter HP-4000, epicenter HP-7200, epicenter HP-4710, and epicenter HP-7200 Epiclon HP-6000, N500P-2 and N500P-10 (the above are trade names made by DIC Co., ltd.), NC-3000-L, NC-3000-H, NC-3100, CER-3000-L, NC-2000-L, XD-1000, NC-7000-L, NC-7300-L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, BREN-10S (the above are trade names made by Mitsubishi chemical Co., ltd.), YX-4000H, YL4121H and YX-8800 (the above are trade names made by Mitsubishi chemical Co., ltd.).
From the viewpoint of easy reduction of the molding shrinkage of the composite, the resin composition may contain at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin. The resin composition may also contain, as the epoxy resin, both biphenylene aralkyl type epoxy resin and isocyanate modified epoxy resin. A commercially available product of biphenylene aralkyl type epoxy resin may be, for example, NC-3000 manufactured by Japanese chemical Co., ltd. A commercially available product of the isocyanate-modified epoxy resin may be AER-4001 manufactured by Asahi Kabushiki Kaisha (Asahi Kaisha chemical Co., ltd.).
The resin composition may contain one of the epoxy resins described above. The resin composition may contain a plurality of epoxy resins as described above.
The curing agents are classified into curing agents that cure epoxy resins in a range from low temperature to room temperature, and heat-curable curing agents that cure epoxy resins with heating. The curing agent for curing the epoxy resin in the range from low temperature to room temperature is, for example, aliphatic polyamine, polyaminoamide, polythiol, or the like. Examples of the heat-curable curing agent include aromatic polyamine, acid anhydride, phenol novolac resin, dicyandiamide (DICY), and the like.
When a curing agent that cures an epoxy resin in a range from low temperature to room temperature is used, the glass transition temperature of the cured product of the epoxy resin tends to be low and the cured product of the epoxy resin tends to be soft. As a result, the molded article formed of the composite is also easily softened. On the other hand, from the viewpoint of improving the heat resistance of the molded body, the curing agent may be preferably a heat-curable curing agent, more preferably a phenolic resin, and still more preferably a phenol novolac resin. In particular, by using a phenol novolac resin as a curing agent, a cured product of an epoxy resin having a high glass transition temperature can be easily obtained. As a result, the heat resistance and mechanical strength of the molded article can be easily improved.
The phenol resin may be at least one selected from the group consisting of aralkyl phenol resins, dicyclopentadiene phenol resins, salicyl aldehyde phenol resins, novolac resins, copolymerized phenol resins of benzaldehyde phenol and aralkyl phenol, para-xylene and/or meta-xylene modified phenol resins, melamine modified phenol resins, terpene modified phenol resins, dicyclopentadiene naphthol resins, cyclopentadiene modified phenol resins, polycyclic aromatic ring modified phenol resins, biphenyl phenol resins, and triphenylmethane phenol resins. The phenolic resin may be a copolymer composed of 2 or more of the above. As the commercial products of the phenol resin, for example, tamanol 758 manufactured by Kagaku chemical Co., ltd., HP-850N manufactured by Hitachi chemical Co., ltd, etc. can be used.
The phenol novolac resin may be, for example, a resin obtained by condensing or co-condensing phenols and/or naphthols with aldehydes in the presence of an acidic catalyst. The phenol constituting the phenol novolac resin may be, for example, at least one of phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, and aminophenol. The naphthol constituting the phenol novolac resin may be, for example, at least one selected from α -naphthol, β -naphthol and dihydroxynaphthalene. The aldehyde constituting the phenol novolac resin may be, for example, at least one selected from formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde.
The curing agent may be, for example, a compound having 2 phenolic hydroxyl groups in 1 molecule. The compound having 2 phenolic hydroxyl groups in 1 molecule may be, for example, at least one selected from resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted biphenol.
The resin composition may contain one of the phenolic resins described above. The resin composition may also include a plurality of phenolic resins as described above. The resin composition may contain one of the above curing agents. The resin composition may contain a plurality of curing agents as described above.
The ratio of the active groups (phenolic OH groups) in the curing agent that reacts with the epoxy groups in the epoxy resin may be preferably 0.5 to 1.5 equivalents, more preferably 0.6 to 1.4 equivalents, and still more preferably 0.8 to 1.2 equivalents, relative to 1 equivalent of the epoxy groups in the epoxy resin. In the case where the ratio of the reactive groups in the curing agent is less than 0.5 equivalent, it is difficult to obtain a sufficient elastic modulus of the resulting cured product. On the other hand, when the ratio of the reactive groups in the curing agent is more than 1.5 equivalent, the mechanical strength of the molded article formed from the composite after curing tends to be lowered. However, even when the ratio of the active groups in the curing agent is outside the above range, the effects of the present invention can be obtained.
The curing accelerator is not limited as long as it is a composition that reacts with the epoxy resin to accelerate curing of the epoxy resin, for example. The curing accelerator may be, for example, an imidazole such as alkyl-substituted imidazole or benzimidazole. The resin composition may be provided with a curing accelerator. The resin composition may also include a plurality of curing accelerators. By adding a curing accelerator to the resin composition, the moldability and releasability of the composite can be easily improved. In addition, by containing the curing accelerator in the resin composition, the mechanical strength of a molded article (for example, an electronic component) produced using the composite is improved, or the storage stability of the composite in a high-temperature and high-humidity environment is improved. As the commercial product of the imidazole-based curing accelerator, for example, at least one selected from the group consisting of 2MZ-H, C11Z, C Z, 1,2DMZ, 2E4MZ, 2PZ-PW, 2P4MZ, 1B2PZ, 2MZ-CN, C11Z-CN, 2E4MZ-CN, 2PZ-CN, C11Z-CNS, 2P4MHZ, TPZ and SFZ (the above is trade name manufactured by Kabushiki Kaisha Co., ltd.) may be used.
The blending amount of the curing accelerator is not particularly limited as long as the curing accelerator can obtain a curing accelerating effect. However, from the viewpoint of improving the curability and flowability of the resin composition upon moisture absorption, the blending amount of the curing accelerator may be preferably 0.1 parts by mass or more and 30 parts by mass or less, more preferably 1 part by mass or more and 15 parts by mass or less, relative to 100 parts by mass of the epoxy resin. The content of the curing accelerator is preferably 0.001 parts by mass or more and 5 parts by mass or less relative to 100 parts by mass of the total of the epoxy resin and the curing agent (e.g., phenolic resin). When the blending amount of the curing accelerator is less than 0.1 parts by mass, it is difficult to obtain a sufficient curing acceleration effect. When the blending amount of the curing accelerator is more than 30 parts by mass, the storage stability of the compound tends to be lowered. However, even when the blending amount and content of the curing accelerator are out of the above ranges, the effects of the present invention can be obtained.
The resin composition contains a compound having a siloxane bond (siloxane compound). The siloxane bond is a bond containing 2 silicon atoms (Si) and 1 oxygen atom (O) and may be represented as-Si-O-Si-. The resin composition may contain one kind of silicone compound or may contain a plurality of kinds of silicone compounds. From the viewpoint of easily reducing the molding shrinkage of the composite, the resin composition preferably contains at least one of the 1 st silicone compound and the 2 nd silicone compound described later as the silicone compound. The resin composition may contain only the 1 st silicone compound as the silicone compound, or may contain only the 2 nd silicone compound as the silicone compound. The resin composition may contain both the 1 st silicone compound and the 2 nd silicone compound. The resin composition may further contain a siloxane compound other than the 1 st siloxane compound and the 2 nd siloxane compound. Hereinafter, the 1 st silicone compound and the 2 nd silicone compound will be described in detail.
The 1 st siloxane compound may have a structural unit represented by the following chemical formula (1). The structural unit represented by the following chemical formula (1) is sometimes referred to as "structural unit 1".
[ chemical 11]
In the chemical formula (1), R 1 R is R 2 Each independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.
The 1 st silicone compound may have a plurality of structural units 1. A plurality of R in the 1 st siloxane compound 1 May be the same or different from each other. A plurality of R in the 1 st siloxane compound 2 Or may be the same as or different from each other. R is R 1 R is R 2 May be the same or different from each other. The 1 st silicone compound may have a repeating unit represented by the above chemical formula (1).
From the viewpoint of easily reducing the molding shrinkage of the composite, the 1 st silicone compound preferably has a structural unit represented by the following chemical formula (2). The structural unit represented by the following chemical formula (2) is sometimes referred to as "structural unit 2".
[ chemical 12]
In the chemical formula (2), R 3 Is an alkylene group having 1 to 10 carbon atoms.
The 1 st silicone compound may have a plurality of structural units 2. A plurality of R in the 1 st siloxane compound 3 May be the same or different from each other. The 1 st silicone compound may have a repeating unit represented by the above chemical formula (2).
From the viewpoint of easiness in reducing the molding shrinkage of the composite, the 1 st silicone compound is preferably a compound represented by the following chemical formula (3). The compound represented by the following chemical formula (3) is sometimes referred to as "compound 3".
[ chemical 13]
In the chemical formula (3), n is an integer of 1 to 200. m is m 1 M 2 Each independently is an integer of 1 to 200. R is R 4 、R 5 、R 6 R is R 7 Each independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms. R is R 8 R is R 9 Each independently represents an alkylene group having 1 to 10 carbon atoms. R is R 10 R is R 11 Each independently represents a 2-valent hydrocarbon group having 1 to 10 carbon atoms.
A plurality of R present in Compound 3 4 May be the same or different from each other. A plurality of R present in Compound 3 5 May be the same or different from each other. R is R 4 、R 5 、R 6 R is R 7 May be the same or different from each other. A plurality of R present in Compound 3 8 May be the same or different from each other. A plurality of R present in Compound 3 9 Or may be the same as or different from each other. R is R 8 R is R 9 May be the same or different from each other. The weight average molecular weight (Mw) of compound 3 may be, for example, 4000 or more and 20000 or less.
Examples of the commercial products of the compound 3 include DBL-C31 and DBL-C32 manufactured by Gelest Co., ltd.
From the viewpoint of easily reducing the molding shrinkage of the composite, the 2 nd siloxane compound preferably has a structural unit represented by the following chemical formula (4) and a structural unit represented by the following chemical formula (5). The structural unit represented by the following chemical formula (4) is sometimes referred to as "structural unit 4". The structural unit represented by the following chemical formula (5) is sometimes referred to as "structural unit 5".
[ chemical 14]
In the chemical formula (4), R 12 Is a 1-valent hydrocarbon group having 1 to 12 carbon atoms.
R 12 May be, for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R is R 12 Preferably methyl or phenyl.
The 2 nd siloxane compound may have a plurality of structural units 4. A plurality of R in the 2 nd siloxane compound 12 May be the same or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (4).
[ 15]
In the chemical formula (5), R 13 R is R 14 Each independently represents a 1-valent hydrocarbon group having 1 to 12 carbon atoms.
R 13 May be, for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; vinyl, allyl, butenyl, pentenyl, hexeneAlkenyl groups such as a base; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R is R 13 Preferably methyl or phenyl.
R 14 May be, for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R is R 14 Preferably methyl or phenyl.
The 2 nd siloxane compound may have a plurality of structural units 5. A plurality of R in the 2 nd siloxane compound 13 May be the same or different from each other. A plurality of R in the 2 nd siloxane compound 14 May be the same or different from each other. R is R 13 R is R 14 May be the same or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (5).
From the viewpoint of the storage stability of the 2 nd siloxane compound, the molecular terminals of the 2 nd siloxane compound are preferably R 12 、R 13 、R 14 Any one of hydroxyl and alkoxy. Alkoxy groups may be, for example, methoxy, ethoxy, propoxy or butoxy.
From the viewpoint of easily reducing the molding shrinkage of the composite, the 2 nd siloxane compound preferably has a structural unit represented by the following chemical formula (6). The structural unit represented by the following chemical formula (6) is sometimes referred to as "structural unit 6".
[ 16]
In the above chemical formula (6), R 15 Is a 1-valent hydrocarbon group having 1 to 12 carbon atoms. R is R 16 Is a 1-valent organic group having an epoxy group.
R 15 May be, for example: methyl, ethyl, propyl, butyl, isopropyl, and isopropylAlkyl groups such as butyl, t-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R is R 13 Preferably methyl or phenyl.
R 16 May be, for example, 2, 3-epoxypropyl, 3, 4-epoxybutyl, 4, 5-epoxypentyl, 2-epoxypropoxyethyl, 3-epoxypropoxypropyl, 4-epoxypropoxybutyl, 2- (3, 4-epoxycyclohexyl) ethyl, 3- (3, 4-epoxycyclohexyl) propyl, or the like. R is R 16 Preferably 3-glycidoxypropyl.
The 2 nd siloxane compound may have a plurality of structural units 6. A plurality of R in the 2 nd siloxane compound 15 May be the same or different from each other. A plurality of R in the 2 nd siloxane compound 16 Or may be the same as or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (6).
From the viewpoint of easiness in reducing the molding shrinkage of the composite, the 2 nd siloxane compound is preferably a compound having at least one structural unit selected from the group consisting of a structural unit represented by the following chemical formula (7), a structural unit represented by the following chemical formula (8), a structural unit represented by the following chemical formula (9), and a structural unit represented by the following chemical formula (10). The structural unit represented by the following chemical formula (7) is sometimes referred to as "structural unit 7". The structural unit represented by the following chemical formula (8) is sometimes referred to as "structural unit 8". The structural unit represented by the following chemical formula (9) is sometimes referred to as "structural unit 9". The structural unit represented by the following chemical formula (10) is sometimes referred to as "structural unit 10". The above-mentioned compound having at least one structural unit selected from the structural unit 7, the structural unit 8, the structural unit 9 and the structural unit 10 is sometimes referred to as "compound 11". The compound 11 may have all of the structural units of the structural unit 7, the structural unit 8, the structural unit 9 and the structural unit 10.
[ chemical 17]
[ chemical 18]
[ chemical 19]
[ chemical 20]
Compound 11 may have a plurality of structural units 7. Compound 11 may have a repeating unit represented by the above chemical formula (7). Compound 11 may have a plurality of structural units 8. Compound 11 may have a repeating unit represented by the above chemical formula (8). Compound 11 may have a plurality of structural units 9. Compound 11 may have a repeating unit represented by the above chemical formula (9). Compound 11 may have a plurality of structural units 10. Compound 11 may have a repeating unit represented by the above chemical formula (10).
A commercially available product of Compound 11 is AY42-119 manufactured by Toli-Dow Corning Co., ltd.
The epoxy equivalent of the 2 nd siloxane compound may be 500 to 4000, or 1000 to 2500. When the epoxy equivalent is within the above range, the fluidity of the compound is easily improved and the moldability is easily improved.
The softening point of the 2 nd siloxane compound is preferably 40℃or more and 120℃or less, more preferably 50℃or more and 100℃or less. When the softening point is within the above range, the mechanical strength of the molded article formed of the composite is easily improved. The softening point of the 2 nd siloxane compound may be adjusted by the molecular weight, structure (for example, content ratio of each constituent unit), kind of the organic group bonded to the silicon atom, and the like of the 2 nd siloxane compound. From the viewpoint of improving the flowability of the composite, it is preferable to adjust the softening point by using the content of the aryl group in the 2 nd siloxane compound. The aryl group may be, for example, phenyl, tolyl, xylyl, naphthyl, biphenyl, or the like. The aryl group is preferably phenyl. More preferably, the softening point is adjusted by the content of phenyl groups in the monovalent organic groups bonded to the silicon atoms in the 2 nd siloxane compound. The content of the phenyl group is preferably adjusted to 60 mol% or more and 100 mol% or less, more preferably 70 mol% or more and 85 mol% or less.
The weight average molecular weight (Mw) of the 2 nd siloxane compound may be 1000 to 30000, preferably 2000 to 20000, more preferably 3000 to 10000. The weight average molecular weight (Mw) may be measured by Gel Permeation Chromatography (GPC) and may be a value obtained by conversion using a standard polystyrene calibration curve. The 2 nd siloxane compound is preferably a random copolymer.
The resin composition may contain one kind of the above-mentioned silicone compound or may contain a plurality of kinds of the above-mentioned silicone compounds.
The coupling agent improves adhesion between the resin composition and metal element-containing particles constituting the metal element-containing powder, and improves flexibility and mechanical strength of a molded article formed from the composite. The coupling agent may be at least one selected from the group consisting of silane compounds (silane coupling agents), titanium compounds, aluminum compounds (aluminum chelates), and aluminum/zirconium compounds, for example. The silane coupling agent may be at least one selected from epoxy silane, mercapto silane, amino silane, alkyl silane, ureide silane, acid anhydride silane and vinyl silane. Particularly preferred are aminophenyl silane coupling agents. The resin composition may contain one kind of the above-mentioned coupling agent or may contain a plurality of kinds of the above-mentioned coupling agents.
The compound may contain a flame retardant for the environmental safety, recyclability, forming processability, and low cost of the compound. The flame retardant may be at least one selected from the group consisting of brominated flame retardants, corm (Japanese: stem) flame retardants, hydrated metal compound flame retardants, silicone flame retardants, nitrogen-containing compounds, hindered amine compounds, organometallic compounds, and aromatic engineering plastics. The resin composition may contain one or more of the above flame retardants.
In the case of forming a molded body from the compound using a mold, the resin composition may contain wax. The wax functions as a mold release agent while improving the fluidity of the compound during the molding (e.g., transfer molding) of the compound. The wax may be at least one of a fatty acid such as a higher fatty acid and a fatty acid ester.
The wax may be, for example, at least one of the following: fatty acids such as montanic acid, stearic acid, 12-hydroxystearic acid (japanese: 12-zerun acid), lauric acid, and the like, or esters thereof; fatty acid salts such as zinc stearate, calcium stearate, barium stearate, aluminum stearate, magnesium stearate, calcium laurate, zinc laurate, calcium ricinoleate, zinc 2-ethylhexanoate; fatty acid amides such as stearic acid amide, oleic acid amide, erucic acid amide, behenic acid amide, palmitic acid amide, lauric acid amide, hydroxystearic acid amide, methylene distearic acid amide, ethylene distearic acid amide, distearyl adipic acid amide, ethylene dioleyl adipic acid amide, N-stearyl stearic acid amide, N-oleyl stearic acid amide, N-stearyl erucic acid amide, hydroxymethyl stearic acid amide, hydroxymethyl behenic acid amide, and the like; fatty acid esters such as butyl stearate; alcohols such as ethylene glycol and stearyl alcohol; polyethers containing polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and modified products thereof; polysiloxanes such as silicone oil and silicone lubricant oil; fluorine compounds such as fluorine-based oil, fluorine-based lubricating oil, fluorine-containing resin powder; waxes such as paraffin wax, polyethylene wax, amide wax, polypropylene wax, ester wax, carnauba wax, and micro wax.
(powder containing Metal element)
The metal element-containing powder (metal element-containing particles) may contain at least one selected from the group consisting of a metal simple substance, an alloy, and a metal compound, for example. The metal element-containing powder may contain at least one selected from the group consisting of elemental metals, alloys, and metal compounds, for example. The alloy may contain at least one selected from solid solutions, eutectic crystals, and intermetallic compounds. The alloy may be, for example, stainless steel (Fe-Cr-based alloy, fe-Ni-Cr-based alloy, etc.). The metal compound may be an oxide such as ferrite. The metal element-containing powder may contain one metal element or a plurality of metal elements. The metal element contained in the metal element-containing powder may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element. The composite may contain one kind of metal element-containing powder, or may contain a plurality of kinds of metal element-containing powders having different compositions.
The metal element-containing powder is not limited to the above-described composition. The metal element contained in the metal element-containing powder may be at least one selected from the group consisting of iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), aluminum (Al), tin (Sn), chromium (Cr), barium (Ba), strontium (Sr), lead (Pb), silver (Ag), praseodymium (Pr), neodymium (Nd), samarium (Sm), and dysprosium (Dy), for example. The metal element-containing powder may further contain an element other than the metal element. The metal element-containing powder may contain, for example, oxygen (o), beryllium (Be), phosphorus (P), boron (B), or silicon (Si). The metal element-containing powder may be a magnetic powder. The metal element-containing powder may be a soft magnetic alloy or a ferromagnetic alloy. The metal element-containing powder may be, for example, a magnetic powder containing at least one selected from the group consisting of Fe-Si-based alloy, fe-Si-Al-based alloy (AlSi-Fe), fe-Ni-based alloy (permalloy), fe-Cu-Ni-based alloy (permalloy), fe-Co-based alloy (Koidz alloy), fe-Cr-Si-based alloy (electromagnetic stainless steel), nd-Fe-B-based alloy (rare earth magnet), sm-Fe-N-based alloy (rare earth magnet), al-Ni-Co-based alloy (Alnicobalt magnet), and ferrite. The ferrite may be, for example, spinel ferrite, hexagonal ferrite or garnet ferrite. The metal element-containing powder may Be a copper alloy such as a Cu-Sn-based alloy, a Cu-Sn-P-based alloy, a Cu-Ni-based alloy, or a Cu-Be-based alloy. The metal element-containing powder may contain one of the above elements and compositions, or may contain a plurality of the above elements and compositions.
The metal element-containing powder may be a simple substance of Fe. The metal element-containing powder may be an alloy containing iron (Fe-based alloy). The Fe-based alloy may be, for example, an Fe-Si-Cr-based alloy or an Nd-Fe-B-based alloy. The metal element-containing powder may be at least one of amorphous iron powder and carbonyl iron powder. When the metal element-containing powder contains at least one of an elemental Fe and an Fe-based alloy, a molded article having a high space factor and excellent magnetic properties can be easily produced from the composite. The metal element-containing powder may be an Fe amorphous alloy. As commercial products of Fe amorphous alloy powder, for example, at least one selected from AW2-08, KUAMET-6B2 (trade name of EPSON ATMIX, above), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49, DAP 410L, DAP L, DAP HYB series (trade name of makea, above), MH45D, MH D, MH D, and MH20D (trade name of kogaku).
Method for producing composite
In the production of the composite, a metal element-containing powder and a resin composition (each component constituting the resin composition) are mixed while being heated. For example, the metal element-containing powder and the resin composition may be kneaded with a kneader, a roll, a stirrer, or the like while being heated. By heating and mixing the metal element-containing powder and the resin composition, the resin composition adheres to a part or the whole of the surface of the metal element-containing particles constituting the metal element-containing powder to coat the metal element-containing particles, and a part or the whole of the epoxy resin in the resin composition becomes a semi-cured product. As a result, a complex was obtained. Further, a wax is added to the powder obtained by heating and mixing the metal element-containing powder and the resin composition, whereby a composite can be obtained. The resin composition and the wax may be mixed in advance.
In kneading, a metal element-containing powder, a silicone compound, a curing agent such as an epoxy resin or a phenolic resin, a curing accelerator, and a coupling agent may be kneaded in a tank. The metal element-containing powder, the silicone compound and the coupling agent may be charged into the tank and mixed, and then the epoxy resin, the curing agent and the curing accelerator may be charged into the tank and the raw materials in the tank may be kneaded. The silicone compound, the epoxy resin, the curing agent and the coupling agent may be kneaded in a tank, and then the curing accelerator may be placed in the tank and the raw materials in the tank may be kneaded. The mixed powder (resin mixed powder) of the epoxy resin, the curing agent and the curing accelerator may be prepared in advance, and then the metal-containing powder, the silicone compound and the coupling agent may be kneaded to prepare a metal mixed powder, and then the metal mixed powder and the above-mentioned resin mixed powder may be kneaded.
The kneading time is also dependent on the type of kneading machine, the volume of the kneading machine, and the amount of the compound produced, and is, for example, preferably 1 minute or more, more preferably 2 minutes or more, and still more preferably 3 minutes or more. The kneading time is preferably 20 minutes or less, more preferably 15 minutes or less, and still more preferably 10 minutes or less. When the kneading time is less than 1 minute, kneading is insufficient, the moldability of the composite is impaired, and the degree of curing of the composite is uneven. When the kneading time is longer than 20 minutes, for example, the curing of the resin composition (for example, epoxy resin and phenolic resin) in the tank advances, and the fluidity and moldability of the compound are easily impaired. In the case of kneading the raw materials in the tank with a kneader while heating, the heating temperature may be, for example, a temperature at which a semi-solid of the epoxy resin (epoxy resin of the second order) is formed and the formation of a cured product of the epoxy resin (epoxy resin of the third order) is suppressed. The heating temperature may be a temperature lower than the activation temperature of the curing accelerator. The heating temperature is, for example, preferably 50℃or higher, more preferably 60℃or higher, and still more preferably 70℃or higher. The heating temperature is preferably 150℃or lower, more preferably 120℃or lower, and still more preferably 110℃or lower. When the heating temperature is within the above range, the resin composition in the tank is softened and the surfaces of the metal element-containing particles constituting the metal element-containing powder are easily covered, a semi-solid of the epoxy resin is easily formed, and complete curing of the epoxy resin during kneading is easily suppressed.
< shaped body >)
The molded article according to the present embodiment may be provided with the above-described composite. The molded article may contain at least one selected from the group consisting of an uncured resin composition, a semi-cured product of a resin composition (resin composition 2 of the second order), and a cured product of a resin composition (resin composition 2 of the third order). The molded article may be a cured product of the above-described composite.
Method for producing molded article
The method for producing a molded article according to the present embodiment may include a step of pressurizing the composite in a mold. The method for producing the molded article may include only the step of pressurizing the composite in the mold, or may include other steps in addition to the step. The method for producing a molded article may further include a first step, a second step, and a third step. Details of each step will be described below.
In the first step, a composite is produced by the method described above.
In the second step, the composite is pressed in a mold to obtain a molded article (second-order molded article). Here, the resin composition is filled between the individual metal element-containing particles constituting the metal element-containing powder. The resin composition also functions as a binding material (binder) to bind the metal element-containing particles to each other.
As the second step, transfer molding of the composite may be performed. In the transfer molding, the composite may be pressurized under conditions of 5MPa to 50 MPa. The higher the molding pressure, the easier the molded article having excellent mechanical strength tends to be obtained. In consideration of mass productivity of the molded article and life of the mold, the molding pressure is preferably 8MPa to 20 MPa. The density of the molded article formed by transfer molding may be preferably 75% or more and 86% or less, and more preferably 80% or more and 86% or less, with respect to the true density of the composite. When the density of the molded article is 75% or more and 86% or less, a molded article excellent in mechanical strength can be easily obtained. The second step and the third step may be performed together in the transfer molding.
In the third step, the molded body is cured by heat treatment to obtain a molded body of the third stage. The composite according to the present embodiment contains a silicone compound as one of the elastomers, and therefore the elasticity of the composite as a whole can be reduced, and the stress acting on the composite is reduced as the composite shrinks (thermally cures) as it is formed. As a result, the molding shrinkage of the composite can be reduced in the process of forming the molded body by heat curing of the composite. The temperature of the heat treatment may be preferably 100 ℃ or more and 300 ℃ or less, more preferably 110 ℃ or more and 250 ℃ or less. In order to suppress oxidation of the metal element-containing powder in the molded body, the heat treatment is preferably performed under an inert atmosphere. In the case where the heat treatment temperature is more than 300 ℃, the metal element-containing powder is oxidized by a trace amount of oxygen inevitably contained in the heat-treated atmosphere, or the resin cured product is deteriorated. In order to sufficiently cure the resin composition while suppressing oxidation of the metal element-containing powder and deterioration of the resin cured product, the holding time at the heat treatment temperature is preferably several minutes or more and 10 hours or less, and more preferably 3 minutes or more and 8 hours or less.
Examples
The present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to these examples.
Example 1
[ preparation of Complex ]
50g of biphenylene aralkyl type epoxy resin, 50g of isocyanate modified epoxy resin, 70.4g of biphenylene aralkyl type phenolic resin (curing agent), 1.0g of 2-undecylimidazole (curing accelerator), 1.5g of 2-ethyl-4-methylimidazole (curing accelerator) and 8.0g of montanate (wax) were put into a plastic container (Japanese polyethylene container). These raw materials were mixed in a plastic container for 10 minutes, thereby preparing a resin mixture. The resin mixture corresponds to all the components in the resin composition except the silicone compound and the coupling agent.
As the biphenylene aralkyl type epoxy resin, NC-3000 manufactured by Nippon Kagaku Co., ltd was used.
AER-4001 manufactured by Asahi Kabushiki Kaisha (Asahi Kaisha chemical Co., ltd.) was used as the isocyanate-modified epoxy resin.
As the biphenylene aralkyl type phenol resin, MEHC-7851SS manufactured by Ming Hei Kagaku Co., ltd was used.
As 2-undecylimidazole, C11Z manufactured by Sikultd was used.
As 2-ethyl-4-methylimidazole, 2E4MZ manufactured by Sikuku chemical Co., ltd was used.
LICOWAX-E manufactured by Clariant Chemicals Co., ltd was used as montanate.
Amorphous iron powder 1 and amorphous iron powder 2 were uniformly mixed for 5 minutes by a pressure twin-shaft kneader (capacity 5L, manufactured by Spindle Co., ltd.) to prepare 4667g of metal-element-containing powder. The content of amorphous iron powder 1 in the metal element-containing powder was 75 mass%. The content of amorphous iron powder 2 in the metal element-containing powder was 25 mass%. 4.0g of 3-glycidoxypropyl trimethoxysilane (coupling agent) and 35g of caprolactone-modified dimethicone (compound having siloxane bond) were added to the metal element-containing powder in the biaxial kneader. Next, the contents of the biaxial kneader were heated to 90 ℃, and the contents of the biaxial kneader were mixed for 10 minutes while maintaining the temperature. Next, the above resin mixture was added to the content of the biaxial kneader, and the content was melted and kneaded for 15 minutes while maintaining the temperature of the content at 120 ℃. The kneaded material obtained by melting and kneading as described above was cooled to room temperature, and then the kneaded material was pulverized with a hammer until the kneaded material had a predetermined particle size. The term "melting" as used herein means that at least a part of the resin composition in the content of the biaxial kneader is melted. The metal element-containing powder in the composite does not melt during the preparation of the composite.
As the amorphous iron powder 1, 9A4-II (average particle size 24 μm) manufactured by EPSON ATMIX Co., ltd was used.
As the amorphous iron powder 2, AW2-08 (average particle size 5.3 μm) manufactured by EPSON ATMIX Co., ltd was used.
KBM-403 from Xinyue chemical Co., ltd was used as 3-glycidoxypropyl trimethoxysilane.
As caprolactone-modified dimethyl silicone, DBL-C32 manufactured by Gelest Co., ltd was used. The caprolactone-modified dimethyl silicone is a compound represented by the above chemical formula (3).
The compound of example 1 was prepared using the above method. The content of the metal element-containing powder in the composite was 95.5 mass%.
[ evaluation of flowability ]
50g of the compound of example 1 was charged into a transfer tester, and the spiral flow amount (unit: mm) of the compound was measured under the conditions of a mold temperature (molding temperature) of 140 ℃, an injection pressure of 13.5MPa, and a molding time of 360 seconds. The spiral flow amount is a length of a softened or liquefied composite flowing in a spiral curve (archimedes spiral) groove formed in the mold. That is, the spiral flow amount refers to the flow distance of the softened or liquefied compound. The easier the compound softened or liquefied by heating flows, the greater the amount of spiral flow. That is, the amount of spiral flow of the compound having excellent fluidity is large. As the transfer tester, a transfer molding machine manufactured by T-Marushich Co., ltd was used. As the mold, a mold for spiral flow measurement based on ASTM D3123 was used. The spiral flow amount of example 1 is shown in table 1 below.
[ evaluation of Forming shrinkage ]
The compound of example 1 was filled in the cavity of the mold. The dimensions of the cavity of the mould were 127mm length x 6.4mm height (depth) x 12.7mm width. The dimensions of the cavity of the mould were determined at room temperature (25 ℃). The composite was transferred and molded to prepare a molded article. The molding conditions were 140℃for 360 seconds and 13.5MPa. The molded body was heated at 180℃for 2 hours and cured, whereby a test piece was obtained. The test piece immediately after heating was cooled to room temperature (25 ℃). By the above method, 2 test pieces were produced. One of the 2 test pieces is denoted as test piece 1 and the other is denoted as test piece 2. The dimensions of each of test pieces 1 and 2 were measured at room temperature (25 ℃) using a vernier scale. The molding shrinkage (unit:%) was calculated based on the following equation (A). In the following formula (A), D 1 The dimension (unit: mm) in the longitudinal direction of the cavity of the mold used for producing the test piece 1. d, d 1 The length direction of the test piece 1 was measured (unit: mm). D (D) 2 In the manufacture of the test piece 2The length dimension (unit: mm) of the cavity of the mold used. D (D) 2 And D 1 Equal. d, d 2 The length of the test piece 2 was measured (unit: mm). The molding shrinkage of example 1 is shown in table 1 below.
[ number 1]
Examples 2 to 4
In examples 2 to 4, the compositions shown in table 1 below were used as raw materials for the composites. The mass (unit: g) of each composition used in examples 2 to 4 is the value shown in Table 1 below. Except for the above, the composites of examples 2 to 4 were each produced in the same manner as in example 1. The measurement and evaluation of the complexes of examples 2 to 4 were performed in the same manner as in example 1. The measurement and evaluation results of examples 2 to 4 are shown in table 1 below.
Comparative example 1
In comparative example 1, the compositions shown in table 1 below were used as raw materials for the composites. The mass (unit: g) of each composition used in comparative example 1 is the value shown in Table 1 below. Except for these matters, a composite of comparative example 1 was produced in the same manner as in example 1. The measurement and evaluation of the complex of comparative example 1 were performed in the same manner as in example 1. The measurement and evaluation results of comparative example 1 are shown in table 1 below.
The HP-850N shown in the following Table is phenol novolac resin (curing agent) manufactured by Hitachi chemical Co., ltd.
KBM-503 described in the following Table is 3-methacryloxypropyl triethoxysilane (coupling agent) manufactured by Xinyue chemical industries Co.
AY42-119 shown in the following Table is a polysiloxane (a compound having a siloxane bond) manufactured by Toli-Dow Corning Co., ltd. AY42-119 is a compound having all of the above-described structural units 7, 8, 9 and 10.
TABLE 1
Industrial applicability
The composite of the present invention has a small molding shrinkage, and thus has a high industrial value.
Claims (7)
1. A composite comprising a metal element-containing powder and a resin composition,
the metal element-containing powder is at least any one of an elemental iron and an alloy containing iron,
the resin composition contains an epoxy resin and a compound having a siloxane bond,
the compound comprising a 1 st siloxane compound and a 2 nd siloxane compound as the compound having a siloxane bond,
the 1 st siloxane compound has a structural unit represented by the following chemical formula (1) and a structural unit represented by the following chemical formula (2),
the 2 nd siloxane compound has a structural unit represented by the following chemical formula (4), a structural unit represented by the following chemical formula (5), and a structural unit represented by the following chemical formula (6),
in the chemical formula (1), R 1 R is R 2 Independently of each other, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms,
in the chemical formula (2), R 3 Is an alkylene group having 1 to 10 carbon atoms,
in the chemical formula (4), R 12 Is a 1-valent hydrocarbon group having 1 to 12 carbon atoms,
in the chemical formula (5), R 13 R is R 14 Each independently represents a 1-valent hydrocarbon group having 1 to 12 carbon atoms,
in the chemical formula (6), R 15 Is a 1-valent hydrocarbon group with 1-12 carbon atoms, R 16 Is a 1-valent organic group having an epoxy group.
2. The compound according to claim 1, wherein a content of the compound having a siloxane bond is 25 parts by mass or more and 45 parts by mass or less with respect to 100 parts by mass of the epoxy resin.
3. The compound according to claim 1, wherein a compound represented by the following chemical formula (3) is contained as the 1 st silicone compound,
in the chemical formula (3), n is an integer of 1 to 200, m 1 M 2 Each independently is an integer of 1 to 200, R 4 、R 5 、R 6 R is R 7 Are respectively independentWherein R is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group or a polyalkylene ether group having 3 to 500 carbon atoms 8 R is R 9 Each independently is an alkylene group having 1 to 10 carbon atoms, R 10 R is R 11 Each independently represents a 2-valent hydrocarbon group having 1 to 10 carbon atoms.
4. The compound according to claim 1, wherein the 2 nd siloxane compound comprises a compound having at least one structural unit selected from the group consisting of a structural unit represented by the following chemical formula (7), a structural unit represented by the following chemical formula (8), a structural unit represented by the following chemical formula (9) and a structural unit represented by the following chemical formula (10),
。
5. the composite of claim 1, wherein an isocyanate modified epoxy resin is included as the epoxy resin.
6. The composite according to claim 1, wherein the content of the metal element-containing powder is 90 mass% or more and less than 100 mass%.
7. A molded article comprising the composite according to any one of claims 1 to 6.
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| PCT/JP2018/021053 WO2019229960A1 (en) | 2018-05-31 | 2018-05-31 | Composition and molded object |
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| WO2021112135A1 (en) * | 2019-12-03 | 2021-06-10 | 昭和電工マテリアルズ株式会社 | Compound and molded object |
| WO2022050170A1 (en) * | 2020-09-03 | 2022-03-10 | 昭和電工マテリアルズ株式会社 | Compound material, molded body, and cured product of compound material |
| CN116348516A (en) * | 2020-10-05 | 2023-06-27 | 住友电木株式会社 | Resin molding material, molded article, and method for producing the molded article |
| WO2022075186A1 (en) | 2020-10-05 | 2022-04-14 | 住友ベークライト株式会社 | Resin molding material, molded body, and method for producing said molded body |
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| JP3646486B2 (en) * | 1997-08-11 | 2005-05-11 | セイコーエプソン株式会社 | Rare earth bonded magnet |
| JP4329426B2 (en) * | 2003-06-24 | 2009-09-09 | 日立化成工業株式会社 | Epoxy resin molding material for sealing and electronic component device |
| JP6159512B2 (en) | 2012-07-04 | 2017-07-05 | 太陽誘電株式会社 | Inductor |
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2018
- 2018-05-31 JP JP2020522529A patent/JP7103413B2/en active Active
- 2018-05-31 KR KR1020237033776A patent/KR20230145239A/en active Search and Examination
- 2018-05-31 KR KR1020207028849A patent/KR102587422B1/en active IP Right Grant
- 2018-05-31 CN CN201880093806.6A patent/CN112166154B/en active Active
- 2018-05-31 WO PCT/JP2018/021053 patent/WO2019229960A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2008143016A1 (en) * | 2007-05-10 | 2008-11-27 | Hitachi Chemical Co., Ltd. | Epoxy resin composition for sealing, and electronic component device using the same |
| JP2010138384A (en) * | 2008-11-12 | 2010-06-24 | Hitachi Chem Co Ltd | Encapsulating liquid epoxy resin composition, electronic component device including element encapsulated with the encapsulating liquid epoxy resin composition, and wafer level chip size package |
| JP2010212442A (en) * | 2009-03-10 | 2010-09-24 | Nec Tokin Corp | Amorphous soft magnetic powder, toroidal core, and inductor |
| CN103517948A (en) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic component device |
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| JP2017112218A (en) * | 2015-12-16 | 2017-06-22 | 株式会社村田製作所 | Electronic part |
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| JP7103413B2 (en) | 2022-07-20 |
| KR20210018194A (en) | 2021-02-17 |
| KR20230145239A (en) | 2023-10-17 |
| JPWO2019229960A1 (en) | 2021-06-24 |
| WO2019229960A1 (en) | 2019-12-05 |
| KR102587422B1 (en) | 2023-10-10 |
| JP2022125219A (en) | 2022-08-26 |
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