WO2022050170A1 - Compound material, molded body, and cured product of compound material - Google Patents
Compound material, molded body, and cured product of compound material Download PDFInfo
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- WO2022050170A1 WO2022050170A1 PCT/JP2021/031378 JP2021031378W WO2022050170A1 WO 2022050170 A1 WO2022050170 A1 WO 2022050170A1 JP 2021031378 W JP2021031378 W JP 2021031378W WO 2022050170 A1 WO2022050170 A1 WO 2022050170A1
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- Prior art keywords
- compound
- group
- mass
- epoxy resin
- resin
- Prior art date
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 110
- 239000000463 material Substances 0.000 title abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims abstract description 96
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 96
- 229910052751 metal Inorganic materials 0.000 claims abstract description 91
- 239000002184 metal Substances 0.000 claims abstract description 89
- 239000000843 powder Substances 0.000 claims abstract description 75
- 239000011342 resin composition Substances 0.000 claims abstract description 62
- -1 silane compound Chemical class 0.000 claims abstract description 56
- 229910000077 silane Inorganic materials 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 31
- 239000007822 coupling agent Substances 0.000 claims abstract description 23
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 7
- 125000003277 amino group Chemical group 0.000 claims abstract description 6
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 claims abstract description 6
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000006247 magnetic powder Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 125000005504 styryl group Chemical group 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 68
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 27
- 239000005011 phenolic resin Substances 0.000 description 27
- 229910045601 alloy Inorganic materials 0.000 description 26
- 239000000956 alloy Substances 0.000 description 26
- 238000010438 heat treatment Methods 0.000 description 20
- 229920003986 novolac Polymers 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 239000001993 wax Substances 0.000 description 13
- 238000005452 bending Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 238000004898 kneading Methods 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 8
- 150000002989 phenols Chemical class 0.000 description 8
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 150000002736 metal compounds Chemical class 0.000 description 6
- 238000001721 transfer moulding Methods 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 230000005291 magnetic effect Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000004780 naphthols Chemical class 0.000 description 3
- 229910000889 permalloy Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 2
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
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- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
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- 239000010936 titanium Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- RDYWHMBYTHVOKZ-UHFFFAOYSA-N 18-hydroxyoctadecanamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCO RDYWHMBYTHVOKZ-UHFFFAOYSA-N 0.000 description 1
- NODRXLWVBKZXOO-UHFFFAOYSA-N 2-(hydroxymethyl)docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCC(CO)C(N)=O NODRXLWVBKZXOO-UHFFFAOYSA-N 0.000 description 1
- KHTJRKQAETUUQH-UHFFFAOYSA-N 2-(hydroxymethyl)octadecanamide Chemical compound CCCCCCCCCCCCCCCCC(CO)C(N)=O KHTJRKQAETUUQH-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VHYOLKQXQQUHSM-UHFFFAOYSA-N 3-(methoxy-methyl-phenylmethoxysilyl)propan-1-amine Chemical compound C1(=CC=CC=C1)CO[Si](OC)(C)CCCN VHYOLKQXQQUHSM-UHFFFAOYSA-N 0.000 description 1
- ULRCHFVDUCOKTE-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-amine Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCN ULRCHFVDUCOKTE-UHFFFAOYSA-N 0.000 description 1
- VKRWVLAGVUOYLB-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propylurea Chemical compound CCO[Si](C)(OCC)CCCNC(N)=O VKRWVLAGVUOYLB-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- MXDWUGFTSGOHRF-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propylurea Chemical compound CO[Si](C)(OC)CCCNC(N)=O MXDWUGFTSGOHRF-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
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- INVAIHOVGZNBFS-UHFFFAOYSA-N 6-triethoxysilylhexyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCCCCOC(=O)C=C INVAIHOVGZNBFS-UHFFFAOYSA-N 0.000 description 1
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- DDVHXZANLAFDSZ-UHFFFAOYSA-N 8-triethoxysilyloctyl prop-2-enoate Chemical compound CCO[Si](CCCCCCCCOC(=O)C=C)(OCC)OCC DDVHXZANLAFDSZ-UHFFFAOYSA-N 0.000 description 1
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 1
- JOVCTEPPTIOAPX-UHFFFAOYSA-N 8-trimethoxysilyloctyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C=C JOVCTEPPTIOAPX-UHFFFAOYSA-N 0.000 description 1
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
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- 230000002378 acidificating effect Effects 0.000 description 1
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- IFJWCHSJEZRVMN-MDTVQASCSA-L calcium;(2s)-2,6-diaminohexanoate Chemical compound [Ca+2].NCCCC[C@H](N)C([O-])=O.NCCCC[C@H](N)C([O-])=O IFJWCHSJEZRVMN-MDTVQASCSA-L 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- GFQOFGWPGYRLAO-UHFFFAOYSA-N dodecanamide;ethene Chemical compound C=C.CCCCCCCCCCCC(N)=O.CCCCCCCCCCCC(N)=O GFQOFGWPGYRLAO-UHFFFAOYSA-N 0.000 description 1
- YGUFXEJWPRRAEK-UHFFFAOYSA-N dodecyl(triethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OCC)(OCC)OCC YGUFXEJWPRRAEK-UHFFFAOYSA-N 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- SWSBIGKFUOXRNJ-CVBJKYQLSA-N ethene;(z)-octadec-9-enamide Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCC(N)=O SWSBIGKFUOXRNJ-CVBJKYQLSA-N 0.000 description 1
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical compound C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- VMPHSYLJUKZBJJ-UHFFFAOYSA-N lauric acid triglyceride Natural products CCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC)COC(=O)CCCCCCCCCCC VMPHSYLJUKZBJJ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- PECBPCUKEFYARY-ZPHPHTNESA-N n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC PECBPCUKEFYARY-ZPHPHTNESA-N 0.000 description 1
- NQKOSCFDFJKWOX-UHFFFAOYSA-N n-[3-[diethoxy(methyl)silyl]propyl]aniline Chemical compound CCO[Si](C)(OCC)CCCNC1=CC=CC=C1 NQKOSCFDFJKWOX-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- DJWFNQUDPJTSAD-UHFFFAOYSA-N n-octadecyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCCCCCCCC DJWFNQUDPJTSAD-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- HLOLETUOZGAKMT-UHFFFAOYSA-N trimethoxysilyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)OC(=O)C(C)=C HLOLETUOZGAKMT-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- ODNJVAVDJKOYFK-GRVYQHKQSA-L zinc;(9z,12z)-octadeca-9,12-dienoate Chemical compound [Zn+2].CCCCC\C=C/C\C=C/CCCCCCCC([O-])=O.CCCCC\C=C/C\C=C/CCCCCCCC([O-])=O ODNJVAVDJKOYFK-GRVYQHKQSA-L 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/548—Silicon-containing compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Definitions
- the present invention relates to a compound, a molded product, and a cured product of the compound.
- the compound containing the metal powder and the resin composition is used as a raw material for various industrial products according to the physical characteristics of the metal powder.
- the compound is used as a raw material for an inductor, a sealing material, an electromagnetic wave shield (EMI shield), a bond magnet, or the like (see Patent Document 1 below).
- the compound When an industrial product is manufactured from a compound, the compound is supplied and filled into the mold through a flow path, and parts such as coils are embedded in the compound in the mold.
- the fluidity of the compound is required in these steps.
- the fluidity of the compound improves as the content of the metal powder in the compound decreases, but in order to improve the magnetic properties of the compound used for inductors and the like, the content of the metal powder in the compound (filling rate) ) Is desirable.
- the melt viscosity of the compound increases and the fluidity of the compound decreases.
- the compound is required to have excellent fluidity during molding and to improve the mechanical properties (for example, high temperature bending properties) of the molded product at high temperature.
- the present invention has been made in view of the above circumstances, and is a compound capable of forming a molded product having excellent fluidity during molding and excellent mechanical properties at high temperatures, a molded product using the same, and a compound. It is intended to provide a cured product of.
- the compound according to one aspect of the present invention comprises a metal powder and a resin composition containing an epoxy resin, a curing agent, and a silane coupling agent, wherein the silane coupling agent is an epoxy group, an amino group, or a ureido group.
- a first silane compound having a functional group selected from an isocyanate group and a second silane compound having a chain hydrocarbon group having 6 or more carbon atoms, and the content of the metal powder is 90% by mass. It is less than 100% by mass.
- the molded product according to one aspect of the present invention contains the above compound.
- the cured product according to one aspect of the present invention is a cured product of the above compound.
- a compound capable of forming a molded product having excellent fluidity during molding and excellent mechanical properties at high temperatures, a molded product using the same, and a cured product of the compound.
- the compound according to the present embodiment includes a metal powder and a resin composition.
- the metal powder may contain, for example, at least one selected from the group consisting of elemental metals, alloys, amorphous powders, and metal compounds.
- the resin composition contains at least an epoxy resin, a curing agent and a coupling agent.
- the coupling agent includes a first silane compound having a functional group selected from an epoxy group, an amino group, a ureido group, and an isocyanate group, and a second silane compound having a chain hydrocarbon group having 6 or more carbon atoms. including.
- the metal powder, the epoxy resin, the curing agent, and the coupling agent are mixed.
- the resin composition may further contain a curing accelerator, a mold release agent, an additive and the like as other components.
- the resin composition is a component that can include an epoxy resin, a curing agent, a coupling agent, a curing accelerator, a mold release agent, and an additive, and is a component other than an organic solvent and a metal powder, and is a remaining component (nonvolatile component). ) May be.
- the additive is a component of the rest of the resin composition excluding the resin, the mold release agent, the curing agent, the curing accelerator, and the coupling agent. Additives are, for example, flame retardants, lubricants and the like.
- the compound may be a powder (compound powder).
- the compound may include a metal powder and a resin composition attached to the surface of each metal particle constituting the metal powder.
- the resin composition may cover the entire surface of the particles, or may cover only a part of the surface of the particles.
- the compound may comprise an uncured resin composition and a metal powder.
- the compound may include a semi-cured product of the resin composition (for example, a B-stage resin composition) and a metal powder.
- the compound may comprise both an uncured resin composition and a semi-cured resin composition.
- the compound may consist of a metal powder and a resin composition.
- the content of the metal powder in the compound is 90% by mass or more and less than 100% by mass with respect to the total mass of the compound.
- the content of the metal powder is preferably 92% by mass or more, more preferably 94% by mass or more, further preferably 95% by mass or more, and particularly preferably 96% by mass or more.
- the upper limit of the content of the metal powder may be 99% by mass or less, 98% by mass or less, or 97.5% by mass or less.
- the resin composition has a function as a binder of metal particles constituting the metal powder, and imparts mechanical strength to the molded product formed from the compound.
- the resin composition contained in the compound is filled between the metal particles when the compound is molded at high pressure using a mold, and the particles are bound to each other.
- the cured product of the resin composition binds the metal particles more firmly to each other, and the mechanical strength of the molded product is improved.
- the resin composition according to this embodiment contains an epoxy resin as a thermosetting resin, so that the fluidity of the compound can be improved.
- the epoxy resin may be, for example, a resin having two or more epoxy groups in one molecule.
- the type of epoxy resin is not particularly limited and can be selected according to the desired properties of the composition and the like.
- epoxy resin examples include biphenyl type epoxy resin, stillben type epoxy resin, diphenylmethane type epoxy resin, sulfur atom-containing epoxy resin, novolak type epoxy resin, dicyclopentadiene type epoxy resin, salicylaldehyde type epoxy resin, naphthols and phenol.
- Copolymerization type epoxy resin aralkyl type phenol resin epoxidized product, bisphenol type epoxy resin, epoxy resin containing bisphenol skeleton, alcoholic glycidyl ether type epoxy resin, paraxylylene and / or metaxylylene modified phenol resin glycidyl ether Type epoxy resin, glycidyl ether type epoxy resin of terpene-modified phenol resin, cyclopentadiene type epoxy resin, glycidyl ether type epoxy resin of polycyclic aromatic ring-modified phenol resin, glycidyl ether type epoxy resin of naphthalene ring-containing phenol resin, glycidyl ester type Epoxy resin, glycidyl type or methyl glycidyl type epoxy resin, alicyclic epoxy resin, halogenated phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, hydroquinone type epoxy resin, trimethylolpane type epoxy resin, and ole
- the epoxy resins include biphenyl type epoxy resin, orthocresol novolac type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, epoxy resin having a bisphenol skeleton, salicylaldehyde novolak type epoxy resin, and naphthol novolac. It may contain at least one selected from the group consisting of type epoxy resins.
- the epoxy resin may contain at least one selected from the group consisting of biphenylene aralkyl type epoxy resin and orthocresol novolak type epoxy resin.
- the epoxy resin may be a crystalline epoxy resin. Although the molecular weight of the crystalline epoxy resin is relatively low, the crystalline epoxy resin has a relatively high melting point and is excellent in fluidity.
- the crystalline epoxy resin (highly crystalline epoxy resin) may contain, for example, at least one selected from the group consisting of a hydroquinone type epoxy resin, a bisphenol type epoxy resin, a thioether type epoxy resin, and a biphenyl type epoxy resin. ..
- crystalline epoxy resins include, for example, Epicron 860, Epicron 1050, Epicron 1055, Epicron 2050, Epicron 3050, Epicron 4050, Epicron 7050, Epicron HM-091, Epicron HM-101, Epicron N-730A, Epicron.
- N-740 Epicron N-770, Epicron N-775, Epicron N-865, Epicron HP-4032D, Epicron HP-7200L, Epicron HP-7200, Epicron HP-7200H, Epicron HP-7200HH, Epicron HP-7200HH, Epicron HP-4700, Epicron HP-4710, Epicron HP-4770, Epicron HP-5000, Epicron HP-6000, N500P-2, and N500P-10 (above, trade name manufactured by DIC Co., Ltd.); NC-3000, NC- 3000-L, NC-3000-H, NC-3100, CER-3000-L, NC-2000-L, XD-1000, NC-7000-L, NC-7300-L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, and BREN-10S (above, trade name manufactured by Nippon Kayaku Co., Ltd.);
- the resin composition may contain one of the above epoxy resins.
- the resin composition may contain a plurality of types of epoxy resins among the above.
- the resin composition may contain an epoxy resin containing a biphenyl skeleton, an orthocresol novolac type epoxy resin, or a polyfunctional epoxy resin containing two or more epoxy groups.
- the curing agent is classified into a curing agent that cures the epoxy resin in the range of low temperature to room temperature and a heat curing type curing agent that cures the epoxy resin with heating.
- the curing agent that cures the epoxy resin in the range of low temperature to room temperature is, for example, aliphatic polyamines, polyaminoamides, and polymercaptans.
- the heat-curing type curing agent is, for example, aromatic polyamine, acid anhydride, phenol novolac resin, dicyandiamide (DICY) and the like.
- the type of the curing agent is not particularly limited and can be selected according to the desired properties of the composition and the like.
- the curing agent may be preferably a heat-curing type curing agent, more preferably a phenol resin, and further preferably a phenol novolac resin.
- a phenol novolac resin as a curing agent, it is easy to obtain a cured product of an epoxy resin having a high glass transition point. As a result, the heat resistance and mechanical strength of the molded product are likely to be improved.
- the phenol resin is, for example, an aralkyl type phenol resin, a dicyclopentadiene type phenol resin, a salicylaldehyde type phenol resin, a novolak type phenol resin, a copolymerized phenol resin of a benzaldehyde type phenol and an aralkyl type phenol, a paraxylylene and / or a metaxylylene modification.
- phenol resin From the group consisting of phenol resin, melamine-modified phenol resin, terpen-modified phenol resin, dicyclopentadiene-type naphthol resin, cyclopentadiene-modified phenol resin, polycyclic aromatic ring-modified phenol resin, biphenyl-type phenol resin, and triphenylmethane-type phenol resin. It may contain at least one selected.
- the phenol resin may be a copolymer composed of two or more of the above.
- Tamanol 758 manufactured by Arakawa Chemical Industry Co., Ltd., HP-850N manufactured by Hitachi Chemical Co., Ltd., or the like may be used.
- the phenol novolak resin may be, for example, a resin obtained by condensing or co-condensing phenols and / or naphthols and aldehydes under an acidic catalyst.
- the phenols constituting the phenol novolak resin may include, for example, at least one selected from the group consisting of phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol.
- the naphthols constituting the phenol novolak resin may contain, for example, at least one selected from the group consisting of ⁇ -naphthol, ⁇ -naphthol, and dihydroxynaphthalene.
- the aldehydes constituting the phenol novolac resin may contain, for example, at least one selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde.
- the curing agent may be, for example, a compound having two phenolic hydroxyl groups in one molecule.
- the compound having two phenolic hydroxyl groups in one molecule may contain, for example, at least one selected from the group consisting of resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol.
- the resin composition may contain one of the above phenolic resins.
- the resin composition may include a plurality of types of phenol resins among the above.
- the resin composition may contain one of the above-mentioned curing agents.
- the resin composition may contain a plurality of types of curing agents among the above.
- the ratio of the active group (phenolic OH group) in the curing agent that reacts with the epoxy group in the epoxy resin is preferably 0.5 to 1.5 equivalents, more preferably 0.5 to 1.5 equivalents with respect to 1 equivalent of the epoxy group in the epoxy resin. May be 0.6 to 1.4 equivalents, more preferably 0.7 to 1.2 equivalents.
- the ratio of active groups in the curing agent is less than 0.5 equivalent, it is difficult to obtain a sufficient elastic modulus of the obtained cured product.
- the ratio of the active group in the curing agent exceeds 1.5 equivalents, the mechanical strength of the molded product formed from the compound after curing tends to decrease.
- the ratio of the active group in the curing agent is out of the above range, the effect according to the present invention can be obtained.
- the coupling agent can improve the adhesion between the resin composition and the metal element-containing particles constituting the metal powder, and can improve the flexibility and mechanical strength of the molded product formed from the compound.
- the resin composition according to the present embodiment can improve the fluidity and curing characteristics of the compound.
- the coupling agent includes a first silane compound having a functional group selected from an epoxy group, an amino group, a ureido group, and an isocyanate group, and a second silane compound having a chain hydrocarbon group having 6 or more carbon atoms. including.
- a chain hydrocarbon group having 6 or more carbon atoms may be referred to as a long-chain hydrocarbon group.
- the functional group of the first silane compound can react with the epoxy resin or the curing agent.
- the first silane compound is a silane compound having no long-chain hydrocarbon group.
- Examples of the first silane compound having an epoxy group include 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, and 3-glycidoxypropylmethyl. Examples thereof include dimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropyltriethoxysilane.
- Examples of the first silane compound having an amino group include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, and N-2-.
- Examples of the first silane compound having a ureido group include 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropylmethyldimethoxysilane, and 3-ureidopropylmethyldiethoxysilane.
- Examples of the first silane compound having an isocyanate group include 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-isocyanatepropylmethyldimethoxysilane, and 3-isocyanatepropylmethyldiethoxysilane. ..
- the content of the first silane compound is 0.5 parts by mass or more and 10 parts by mass or less and 1.0 part by mass or more and 8.0 parts by mass with respect to 100 parts by mass of the epoxy resin from the viewpoint of further improving the high temperature bending characteristics. It may be 2 parts or less, or 2.0 parts by mass or more and 7.0 parts by mass or less.
- the chain hydrocarbon group of the second silane compound has 6 or more carbon atoms, may be 7 or more or 8 or more, and may be 20 or less, 16 or less, or 14 or less.
- the second silane compound may have a styryl group, a (meth) acryloyl group, or a vinyl group.
- Examples of the second silane compound include hexyltrimethoxysilane, hexyltriethoxysilane, heptiltrimethoxysilane, heptiltriethoxysilane, octyltrimethoxysilane, octyltriethoxysilane, dodecyltrimethoxysilane, and dodecyltriethoxysilane.
- the content of the second silane compound is 0.1 parts by mass or more and 5.0 parts by mass or less and 0.5 parts by mass or more and 4.0 with respect to 100 parts by mass of the epoxy resin from the viewpoint of further improving the fluidity. It may be 1 part by mass or less, or 1.0 part by mass or more and 3.0 parts by mass or less.
- the coupling agent may further contain a third silane compound having a mercapto group.
- the third silane compound is a silane compound having no long-chain hydrocarbon group. Examples of the third silane compound include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 3-mercaptopropylmethylditoxysilane.
- the content of the coupling agent is 1.0 part by mass or more and 20 parts by mass or less and 2.0 parts by mass or more and 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin from the viewpoint of achieving both fluidity and mechanical properties. , Or 3.0 parts by mass or more and 10 parts by mass or less.
- the curing accelerator is not limited as long as it is a composition that reacts with the epoxy resin to accelerate the curing of the epoxy resin, for example.
- the curing accelerator may be, for example, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, or a urea-based curing accelerator.
- the curing accelerator By containing the curing accelerator in the resin composition, the moldability and mold releasability of the compound can be improved.
- the resin composition contains a curing accelerator, the mechanical strength of the molded product (for example, an electronic component) manufactured by using the compound is improved, and the compound is stored in a high temperature and high humidity environment. Stability is improved.
- Examples of the phosphorus-based curing accelerator include phosphine compounds and phosphonium salt compounds.
- imidazole-based curing accelerators include, for example, 2MZ-H, C11Z, C17Z, 1,2DMZ, 2E4MZ, 2PZ-PW, 2P4MZ, 1B2MZ, 1B2PZ, 2MZ-CN, C11Z-CN, 2E4MZ-CN, 2PZ.
- -At least one selected from the group consisting of CN, C11Z-CNS, 2P4MHZ, TPZ, and SFZ above, trade name manufactured by Shikoku Chemicals Corporation may be used.
- the urea-based curing accelerator is not particularly limited as long as it is a curing accelerator having a urea group, but from the viewpoint of improving storage stability, an alkyl urea-based curing accelerator having an alkyl urea group is preferable.
- the alkylurea-based curing accelerator having an alkylurea group include aromatic alkylurea and aliphatic alkylurea.
- Examples of commercially available alkylurea-based curing accelerators include U-CAT3512T (trade name, manufactured by San-Apro Co., Ltd., aromatic dimethyl urea) and U-CAT3513N (trade name, manufactured by San-Apro Co., Ltd., aliphatic dimethyl urea). Can be mentioned.
- aromatic alkylurea is preferable because the cleavage temperature is moderately low and the compound can be easily cured efficiently.
- the amount of the curing accelerator to be blended is not particularly limited as long as it can obtain the curing promoting effect.
- the amount of the curing accelerator is preferably 0.1 part by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the epoxy resin. It may be preferably 0.5 parts by mass or more and 15 parts by mass or less, and more preferably 1.0 part by mass or more and 10 parts by mass or less.
- the blending amount of the curing accelerator is 0.1 part by mass or more, a sufficient curing promoting effect can be easily obtained.
- the blending amount of the curing accelerator is 30 parts by mass or less, the storage stability of the compound is unlikely to decrease.
- the content of the curing accelerator is preferably 0.001 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total mass of the epoxy resin and the phenol resin.
- the blending amount and content of the curing accelerator are out of the above range, the effect according to the present invention can be obtained.
- the resin composition may contain a compound having a siloxane bond (siloxane compound) as an additive because the molding shrinkage of the compound is easily reduced and the heat resistance and withstand voltage of the molded product are easily improved.
- the siloxane bond is a bond containing two silicon atoms (Si) and one oxygen atom (O), and may be represented by —Si—O—Si—.
- the compound having a siloxane bond may be a polysiloxane compound.
- the content of the siloxane compound may be 1 part by mass or more and 50 parts by mass or less, 5 parts by mass or more and 45 parts by mass or less, or 10 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass of the epoxy resin.
- the compound may contain a flame retardant.
- the flame retardant is selected from the group consisting of, for example, a bromine-based flame retardant, a phosphorus-based flame retardant, a hydrated metal compound-based flame retardant, a silicone-based flame retardant, a nitrogen-containing compound, a hindered amine compound, an organic metal compound, and an aromatic empra. It may be at least one kind.
- the resin composition may contain one of the above flame retardants, and may contain a plurality of of the above flame retardants.
- the resin composition may contain wax.
- the wax enhances the fluidity of the compound in the molding of the compound (for example, transfer molding) and functions as a mold release agent.
- the wax may be at least one of a fatty acid such as a higher fatty acid and a fatty acid ester.
- the wax is, for example, fatty acids such as montanic acid, stearic acid, 12-oxystearic acid, lauric acid or esters thereof; zinc stearate, calcium stearate, barium steaenoate, aluminum stearate, magnesium stearate, calcium laurate, laurin.
- fatty acids such as montanic acid, stearic acid, 12-oxystearic acid, lauric acid or esters thereof; zinc stearate, calcium stearate, barium steaenoate, aluminum stearate, magnesium stearate, calcium laurate, laurin.
- Fatal acid salts such as zinc acid, zinc linoleate, calcium lysinoate, zinc 2-ethylhexoate; stearic acid amide, oleic acid amide, erucic acid amide, behenic acid amide, palmitate amide, lauric acid amide, hydroxystearic acid amide, Methylene bisstearic acid amide, ethylene bisstearic acid amide, ethylene bislauric acid amide, distealyl adipic acid amide, ethylene bisoleic acid amide, diorail adipic acid amide, N-stearyl stearic acid amide, N-oleyl stearic acid amide, Fatty acid amides such as N-stearyl erucate amide, methylol stearic acid amide, methylol behenic acid amide; fatty acid esters such as butyl stearate; alcohols such as ethylene glycol and stearyl alcohol; polyethylene glyco
- the wax content is 1 part by mass or more and 20 parts by mass or less, or 2 parts by mass or more and 15 parts by mass or less, or 3 parts by mass with respect to 100 parts by mass of the epoxy resin from the viewpoint of achieving both fluidity and releasability. It may be 10 parts by mass or less.
- the metal powder may contain, for example, at least one selected from the group consisting of elemental metals, alloys and metal compounds.
- the metal element-containing powder may consist of, for example, at least one selected from the group consisting of elemental metals, alloys and metal compounds.
- the alloy may contain at least one selected from the group consisting of solid solutions, eutectic and intermetallic compounds.
- the alloy may be, for example, stainless steel (Fe—Cr based alloy, Fe—Ni—Cr based alloy, etc.).
- the metal compound may be, for example, an oxide such as ferrite.
- the metal powder may contain one kind of metal element or a plurality of kinds of metal elements.
- the metal element contained in the metal powder may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element.
- the compound may contain one kind of metal element-containing powder, and may contain a plurality of kinds of metal element-containing powders having different compositions.
- the metal elements contained in the metal powder are, for example, iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), and aluminum (Al). , Tin (Sn), Chromium (Cr), Niob (Nb), Barium (Ba), Strontium (Sr), Lead (Pb), Silver (Ag), Placeodim (Pr), Neodim (Nd), Samarium (Sm) , And dysprosium (Dy), which may be at least one selected from the group. From the viewpoint of improving the magnetic properties, the metal powder preferably contains at least one metal element selected from the group consisting of iron, cobalt, and nickel. The metal powder may further contain an element other than the metal element.
- the metal powder may contain, for example, carbon (C), oxygen ( ⁇ ), beryllium (Be), phosphorus (P), sulfur (S), boron (B), or silicon (Si).
- the metal powder may be a magnetic powder.
- the metal powder may be a soft magnetic alloy or a ferromagnetic alloy.
- the metal powder is, for example, Fe-Si alloy, Fe—Si—Al alloy (Sendust), Fe—Ni alloy (Permalloy), Fe—Cu—Ni alloy (Permalloy), Fe—Co alloy (Permalloy). Menzur), Fe-Cr-Si alloy (electromagnetic stainless steel), Nd-Fe-B alloy (rare earth magnet), Sm-Fe-N alloy (rare earth magnet), Al-Ni-Co alloy (Arnico) It may be a magnetic powder consisting of at least one selected from the group consisting of (magnet) and ferrite.
- the ferrite may be, for example, spinel ferrite, hexagonal ferrite, or garnet ferrite.
- the metal powder may be a copper alloy such as a Cu—Sn based alloy, a Cu—Sn—P based alloy, a Cu—Ni based alloy, or a Cu—Be based alloy.
- the metal powder may contain one of the above elements and compositions, and may contain a plurality of of the above elements and compositions.
- the metal powder may be Fe alone.
- the metal powder may be an alloy containing iron (Fe-based alloy).
- the Fe-based alloy may be, for example, a Fe—Si—Cr based alloy or an Nd—Fe—B based alloy.
- the metal element-containing powder may be at least one of amorphous iron powder and carbonyl iron powder. When the metal powder contains at least one of Fe simple substance and Fe-based alloy, it is easy to produce a molded product having a high space factor and excellent magnetic properties from the compound.
- the metal powder may be an Fe amorphous alloy.
- Fe amorphous alloy powders include, for example, AW2-08, KUAMET-6B2 (above, trade name manufactured by Epson Atmix Co., Ltd.), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49. , DAP 410L, DAP 430L, DAP HYB series (above, product name manufactured by Daido Special Steel Co., Ltd.), MH45D, MH28D, MH25D, and MH20D (above, product name manufactured by Kobe Steel Co., Ltd.). At least one may be used.
- the metal powder and the resin composition are mixed while being heated.
- the metal powder and the resin composition may be kneaded with a kneader, a roll, a stirrer, or the like while heating.
- the resin composition adheres to a part or the whole of the surface of the metal element-containing particles constituting the metal powder to cover the metal element-containing particles, and the epoxy in the resin composition.
- Part or all of the resin becomes a semi-cured product.
- a compound may be obtained by further adding wax to the powder obtained by heating and mixing the metal powder and the resin composition.
- the resin composition and the wax may be mixed in advance.
- metal powder, epoxy resin, curing agent, curing accelerator, and coupling agent may be kneaded in the tank.
- the epoxy resin, the curing agent, and the curing accelerator may be charged into the tank to knead the raw materials in the tank.
- the curing accelerator may be put in the tank, and the raw materials in the tank may be further kneaded.
- a mixed powder of an epoxy resin, a curing agent, and a curing accelerator (resin mixed powder) is prepared in advance, and then the metal powder and the coupling agent are kneaded to prepare a metal mixed powder, and then the metal.
- the mixed powder and the above-mentioned resin mixed powder may be kneaded.
- the kneading time depends on the type of the kneading machine, the volume of the kneading machine, and the production amount of the compound, but for example, it is preferably 1 minute or more, more preferably 2 minutes or more, and 3 minutes or more. Is more preferable.
- the kneading time is preferably 20 minutes or less, more preferably 15 minutes or less, and even more preferably 10 minutes or less. If the kneading time is less than 1 minute, the kneading is insufficient, the moldability of the compound is impaired, and the degree of curing of the compound varies. When the kneading time exceeds 20 minutes, for example, the resin composition (for example, epoxy resin and phenol resin) is cured in the tank, and the fluidity and moldability of the compound are easily impaired.
- the resin composition for example, epoxy resin and phenol resin
- the heating temperature is, for example, a semi-cured epoxy resin (B-stage epoxy resin) and a cured epoxy resin (C-stage epoxy resin). It suffices as long as it is a temperature at which the formation of the epoxy is suppressed.
- the heating temperature may be lower than the activation temperature of the curing accelerator.
- the heating temperature is, for example, preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and even more preferably 70 ° C. or higher.
- the heating temperature is preferably 150 ° C. or lower, more preferably 120 ° C. or lower, and even more preferably 110 ° C. or lower.
- the resin composition in the tank softens and easily covers the surface of the metal element-containing particles constituting the metal powder, and a semi-cured epoxy resin is easily produced, and is being kneaded. Complete curing of the epoxy resin is likely to be suppressed.
- the molded product according to the present embodiment may be provided with the above-mentioned compound.
- the molded product according to the present embodiment may be provided with a cured product of the above compound.
- the molded product is at least one selected from the group consisting of an uncured resin composition, a semi-cured resin composition (B-stage resin composition), and a cured resin composition (C-stage resin composition). May include.
- the molded product according to this embodiment may be used as a sealing material for electronic components or electronic circuit boards. According to this embodiment, it is possible to suppress cracks in the molded body due to the difference in the coefficient of thermal expansion between the metal member included in the electronic component or the electronic circuit board and the molded body (sealing material).
- the cured product of the compound is a cured product of the metal powder and the resin composition, and the content of the metal powder is 90% by mass or more and less than 100% by mass.
- the bending strength of the cured product at 250 ° C. is preferably 7.0 MPa or more, more preferably 8.0 MPa or more, and even more preferably 8.5 MPa or more, from the viewpoint of increasing the strength of the cured product.
- the upper limit of the bending strength is about 10 MPa.
- the flexural modulus of the cured product at 250 ° C. may be 1.3 GPa or less, 1.2 GPa or less, or 1.1 GPa or less from the viewpoint of imparting flexibility to the cured product.
- the lower limit of the flexural modulus is about 0.1 GPa.
- the value obtained by dividing the bending strength (MPa) at 250 ° C. by the flexural modulus (GPa) at 250 ° C. can be used as an index of the reliability of the cured product.
- the index is preferably 9.0 ⁇ 10 -3 or more, more preferably 9.2 ⁇ 10 -3 or more, and further preferably 10.4 ⁇ 10 -3 or more.
- the upper limit of the index is not particularly limited, and may be, for example, 5 ⁇ 10-2 or less.
- the method for producing a molded product according to the present embodiment may include a step of pressurizing the compound in a mold.
- the method for producing a molded product may include a step of pressurizing a compound covering a part or the whole of the surface of a metal member in a mold.
- the method for producing a molded product may include only a step of pressurizing the compound in a mold, and may include other steps in addition to the step.
- the method for producing the molded product may include a first step, a second step, and a third step. Hereinafter, the details of each step will be described.
- the compound is prepared by the above method.
- a molded product (B stage molded product) is obtained by pressurizing the compound in a mold.
- a molded product (B stage molded product) may be obtained by pressurizing a compound covering a part or the entire surface of the metal member in a mold.
- the resin composition is filled between the individual metal element-containing particles constituting the metal element-containing powder. The resin composition then functions as a binder and binds the metal element-containing particles to each other.
- transfer molding of the compound may be carried out.
- the compound may be pressurized at 5 MPa or more and 50 MPa or less.
- the higher the molding pressure the easier it is to obtain a molded product having excellent mechanical strength.
- the molding pressure is preferably 8 MPa or more and 20 MPa or less.
- the density of the molded product formed by transfer molding may be preferably 75% or more and 86% or less, and more preferably 80% or more and 86% or less with respect to the true density of the compound. When the density of the molded product is 75% or more and 86% or less, it is easy to obtain a molded product having excellent mechanical strength.
- the second step and the third step may be carried out collectively.
- the molded product is cured by heat treatment to obtain a C-stage molded product.
- the temperature of the heat treatment may be any temperature as long as the resin composition in the molded product is sufficiently cured.
- the temperature of the heat treatment may be preferably 100 ° C. or higher and 300 ° C. or lower, and more preferably 110 ° C. or higher and 250 ° C. or lower.
- the heat treatment temperature exceeds 300 ° C., the metal powder is oxidized or the cured resin product is deteriorated by a small amount of oxygen inevitably contained in the heat treatment atmosphere.
- the heat treatment temperature holding time is preferably several minutes or more and 10 hours or less, more preferably 3 minutes or more 8 It may be less than an hour.
- Triphenylmethane type phenol resin (trade name: HE910-09 manufactured by Air Water Inc., hydroxyl group equivalent: 101 g / eq)
- Biphenylene aralkyl type phenol resin (trade name: MEHC-7841-4S manufactured by Meiwa Kasei Co., Ltd., hydroxyl group equivalent: 166 g / eq)
- Imidazole-based curing accelerator (trade name: 2P4MHZ-PW manufactured by Shikoku Chemicals Corporation) (Release agent) Zinc laurate (trade name: Powder Base L manufactured by NOF CORPORATION) Partially saponified montanic acid ester wax (trade name: Licowax-OP manufactured by Clariant Chemicals Co., Ltd.) (Additive) Caprolactone-modified dimethyl silicone (trade name: DBL-C32 manufactured by Gelest Co., Ltd.)
- Amorphous iron powder (trade name: 9A4-II manufactured by Epson Atmix Co., Ltd., average particle size 24 ⁇ m)
- Amorphous iron powder (trade name: AW2-08, average particle size 5.3 ⁇ m manufactured by Epson Atmix Co., Ltd.)
- the two types of amorphous iron powder shown in Table 1 were uniformly mixed for 5 minutes with a pressurized twin-screw kneader (manufactured by Nihon Spindle Manufacturing Co., Ltd., capacity 5 L) to prepare a metal powder.
- the coupling agents and additives shown in Table 1 were added to the metal powder in the twin-screw kneader. Subsequently, the contents of the twin-screw kneader were heated to 90 ° C., and the contents of the twin-screw kneader were mixed for 10 minutes while maintaining the temperature.
- the above resin mixture was added to the contents of the twin-screw kneader, and the contents were melted and kneaded for 15 minutes while maintaining the temperature of the contents at 120 ° C.
- the kneaded product was crushed with a hammer until the kneaded product had a predetermined particle size.
- the above-mentioned "melting” means melting at least a part of the resin composition in the contents of the twin-screw kneader.
- the metal powder in the compound does not melt during the compound preparation process.
- the compounds of Examples 1 to 5 were prepared by the above method.
- Comparative Examples 1 to 3 The compounds of Comparative Examples 1 to 3 were prepared by operating in the same manner as in Examples except that the types and blending amounts of each component were changed as shown in Table 2.
- the liquidity was evaluated using a flow tester CFT-100 manufactured by Shimadzu Corporation.
- a tablet was prepared by molding 7 g of the compound.
- the fluidity was evaluated under the conditions of 130 ° C., residual heat of 20 seconds, and load of 100 kg.
- the pushing distance (unit: mm) of the plunger until the flow of the compound stopped was used as the flow tester stroke, and the time until the flow of the compound stopped was measured as the flow time, which was used as an index of the liquidity.
- the gel time of the compound was measured by the following method.
- the gel time was measured using a curast meter (manufactured by JSR Trading Co., Ltd.) under the conditions of a sample volume of 1.5 mL and 140 ° C.
- the time at which the torque of the obtained chart started to rise was defined as the gel time. The shorter the gel time, the higher the curability.
- the compound was transfer-molded under the conditions of a molding die temperature of 140 ° C., a molding pressure of 13.5 MPa, and a curing time of 360 seconds, and then post-cured at 180 ° C. for 2 hours to obtain a test piece.
- the dimensions of the test piece were 80 mm in length ⁇ 10 mm in width ⁇ 3.0 mm in thickness.
- the bending strength ⁇ (unit: MPa) was calculated based on the following mathematical formula (A).
- the flexural modulus E (unit: GPa) was calculated based on the following mathematical formula (B).
- P is the load (unit: N) when the test piece is broken.
- Lv is the distance (unit: mm) between the two fulcrums.
- W is the width (unit: mm) of the test piece.
- T is the thickness (unit: mm) of the test piece.
- F / Y is the gradient (unit: N / mm) of the straight line portion of the load-deflection curve.
- ⁇ (3 ⁇ P ⁇ Lv) / (2 ⁇ W ⁇ t 2 ) (A)
- E [Lv 3 / (4 ⁇ W ⁇ t 3 )] ⁇ (F / Y) (B)
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Abstract
Description
本実施形態に係るコンパウンドは、金属粉と、樹脂組成物と、を備える。金属粉は、例えば、金属単体、合金、アモルファス粉、及び金属化合物からなる群より選ばれる少なくとも一種を含有してよい。樹脂組成物は、少なくともエポキシ樹脂、硬化剤及びカップリング剤を含有する。カップリング剤は、エポキシ基、アミノ基、ウレイド基、及びイソシアネート基から選ばれる官能基を有する第1のシラン化合物と、炭素数が6以上の鎖状炭化水素基を有する第2のシラン化合物とを含む。コンパウンドにおいて、金属粉、エポキシ樹脂、硬化剤、及びカップリング剤は混合されている。樹脂組成物は、他の成分として硬化促進剤、離型剤、添加剤等を更に含有してよい。樹脂組成物は、エポキシ樹脂、硬化剤、カップリング剤、硬化促進剤、離型剤、及び添加剤を包含し得る成分であって、有機溶媒と金属粉とを除く残りの成分(不揮発性成分)であってよい。添加剤とは、樹脂組成物のうち、樹脂、離型剤、硬化剤、硬化促進剤、及びカップリング剤を除く残部の成分である。添加剤は、例えば、難燃剤、潤滑剤等である。コンパウンドは、粉末(コンパウンド粉)であってよい。 [compound]
The compound according to the present embodiment includes a metal powder and a resin composition. The metal powder may contain, for example, at least one selected from the group consisting of elemental metals, alloys, amorphous powders, and metal compounds. The resin composition contains at least an epoxy resin, a curing agent and a coupling agent. The coupling agent includes a first silane compound having a functional group selected from an epoxy group, an amino group, a ureido group, and an isocyanate group, and a second silane compound having a chain hydrocarbon group having 6 or more carbon atoms. including. In the compound, the metal powder, the epoxy resin, the curing agent, and the coupling agent are mixed. The resin composition may further contain a curing accelerator, a mold release agent, an additive and the like as other components. The resin composition is a component that can include an epoxy resin, a curing agent, a coupling agent, a curing accelerator, a mold release agent, and an additive, and is a component other than an organic solvent and a metal powder, and is a remaining component (nonvolatile component). ) May be. The additive is a component of the rest of the resin composition excluding the resin, the mold release agent, the curing agent, the curing accelerator, and the coupling agent. Additives are, for example, flame retardants, lubricants and the like. The compound may be a powder (compound powder).
樹脂組成物は、金属粉を構成する金属粒子の結合材(バインダ)としての機能を有し、コンパウンドから形成される成形体に機械的強度を付与する。例えば、コンパウンドに含まれる樹脂組成物は、金型を用いてコンパウンドが高圧で成形される際に、金属粒子の間に充填され、当該粒子を互いに結着する。成形体中の樹脂組成物を硬化させることにより、樹脂組成物の硬化物が金属粒子同士をより強固に結着して、成形体の機械的強度が向上する。 (Resin composition)
The resin composition has a function as a binder of metal particles constituting the metal powder, and imparts mechanical strength to the molded product formed from the compound. For example, the resin composition contained in the compound is filled between the metal particles when the compound is molded at high pressure using a mold, and the particles are bound to each other. By curing the resin composition in the molded product, the cured product of the resin composition binds the metal particles more firmly to each other, and the mechanical strength of the molded product is improved.
金属粉(金属元素含有粒子)は、例えば、金属単体、合金及び金属化合物からなる群より選ばれる少なくとも一種を含有してよい。金属元素含有粉は、例えば、金属単体、合金及び金属化合物からなる群より選ばれる少なくとも一種からなっていてよい。合金は、固溶体、共晶及び金属間化合物からなる群より選ばれる少なくとも一種を含んでよい。合金とは、例えば、ステンレス鋼(Fe‐Cr系合金、Fe‐Ni‐Cr系合金等)であってよい。金属化合物とは、例えば、フェライト等の酸化物であってよい。金属粉は、一種の金属元素又は複数種の金属元素を含んでよい。金属粉に含まれる金属元素は、例えば、卑金属元素、貴金属元素、遷移金属元素、又は希土類元素であってよい。コンパウンドは、一種の金属元素含有粉を含んでよく、組成が異なる複数種の金属元素含有粉を含んでもよい。 (Metal powder)
The metal powder (particle containing a metal element) may contain, for example, at least one selected from the group consisting of elemental metals, alloys and metal compounds. The metal element-containing powder may consist of, for example, at least one selected from the group consisting of elemental metals, alloys and metal compounds. The alloy may contain at least one selected from the group consisting of solid solutions, eutectic and intermetallic compounds. The alloy may be, for example, stainless steel (Fe—Cr based alloy, Fe—Ni—Cr based alloy, etc.). The metal compound may be, for example, an oxide such as ferrite. The metal powder may contain one kind of metal element or a plurality of kinds of metal elements. The metal element contained in the metal powder may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element. The compound may contain one kind of metal element-containing powder, and may contain a plurality of kinds of metal element-containing powders having different compositions.
コンパウンドの製造では、金属粉と樹脂組成物(樹脂組成物を構成する各成分)とを加熱しながら混合する。例えば、金属粉と樹脂組成物とを加熱しながらニーダー、ロール、攪拌機などで混練してよい。金属粉及び樹脂組成物の加熱及び混合により、樹脂組成物が金属粉を構成する金属元素含有粒子の表面の一部又は全体に付着して金属元素含有粒子を被覆し、樹脂組成物中のエポキシ樹脂の一部又は全部が半硬化物になる。その結果、コンパウンドが得られる。金属粉及び樹脂組成物の加熱及び混合によって得られた粉末に、更にワックスを加えることによって、コンパウンドを得てもよい。予め樹脂組成物とワックスとが混合されていてもよい。 <Manufacturing method of compound>
In the production of the compound, the metal powder and the resin composition (each component constituting the resin composition) are mixed while being heated. For example, the metal powder and the resin composition may be kneaded with a kneader, a roll, a stirrer, or the like while heating. By heating and mixing the metal powder and the resin composition, the resin composition adheres to a part or the whole of the surface of the metal element-containing particles constituting the metal powder to cover the metal element-containing particles, and the epoxy in the resin composition. Part or all of the resin becomes a semi-cured product. The result is a compound. A compound may be obtained by further adding wax to the powder obtained by heating and mixing the metal powder and the resin composition. The resin composition and the wax may be mixed in advance.
本実施形態に係る成形体は、上記のコンパウンドを備えてよい。本実施形態に係る成形体は、上記のコンパウンドの硬化物を備えてよい。成形体は、未硬化の樹脂組成物、樹脂組成物の半硬化物(Bステージの樹脂組成物)、及び樹脂組成物の硬化物(Cステージの樹脂組成物)からなる群より選ばれる少なくとも一種を含んでいてよい。本実施形態に係る成形体は、電子部品又は電子回路基板用の封止材として用いられてよい。本実施形態によれば、電子部品又は電子回路基板が備える金属部材と、成形体(封止材)との熱膨張率差に起因する成形体のクラックを抑制することができる。 [Molded product]
The molded product according to the present embodiment may be provided with the above-mentioned compound. The molded product according to the present embodiment may be provided with a cured product of the above compound. The molded product is at least one selected from the group consisting of an uncured resin composition, a semi-cured resin composition (B-stage resin composition), and a cured resin composition (C-stage resin composition). May include. The molded product according to this embodiment may be used as a sealing material for electronic components or electronic circuit boards. According to this embodiment, it is possible to suppress cracks in the molded body due to the difference in the coefficient of thermal expansion between the metal member included in the electronic component or the electronic circuit board and the molded body (sealing material).
本実施形態に係る成形体の製造方法は、コンパウンドを金型中で加圧する工程を備えてよい。成形体の製造方法は、金属部材の表面の一部又は全体を覆うコンパウンドを金型中で加圧する工程を備えてよい。成形体の製造方法は、コンパウンドを金型中で加圧する工程のみを備えてよく、当該工程に加えてその他の工程を備えてもよい。成形体の製造方法は、第一工程、第二工程及び第三工程を備えてもよい。以下では、各工程の詳細を説明する。 <Manufacturing method of molded product>
The method for producing a molded product according to the present embodiment may include a step of pressurizing the compound in a mold. The method for producing a molded product may include a step of pressurizing a compound covering a part or the whole of the surface of a metal member in a mold. The method for producing a molded product may include only a step of pressurizing the compound in a mold, and may include other steps in addition to the step. The method for producing the molded product may include a first step, a second step, and a third step. Hereinafter, the details of each step will be described.
ビフェニレンアラルキル型エポキシ樹脂(日本化薬株式会社製の商品名:NC-3000、エポキシ当量:275g/eq)
多官能型エポキシ樹脂(株式会社プリンテック製の商品名:TECHMORE VG3101L、エポキシ当量:215g/eq) (Epoxy resin)
Biphenylene aralkyl type epoxy resin (trade name: NC-3000 manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent: 275 g / eq)
Polyfunctional epoxy resin (trade name: TECHMORE VG3101L manufactured by Printec Co., Ltd., epoxy equivalent: 215 g / eq)
トリフェニルメタン型フェノール樹脂(エア・ウォーター株式会社製の商品名:HE910-09、水酸基当量:101g/eq)
ビフェニレンアラルキル型フェノール樹脂(明和化成株式会社製の商品名:MEHC-7841-4S、水酸基当量:166g/eq) (Hardener)
Triphenylmethane type phenol resin (trade name: HE910-09 manufactured by Air Water Inc., hydroxyl group equivalent: 101 g / eq)
Biphenylene aralkyl type phenol resin (trade name: MEHC-7841-4S manufactured by Meiwa Kasei Co., Ltd., hydroxyl group equivalent: 166 g / eq)
3-グリシドキシプロピルトリメトキシシラン(信越化学工業株式会社製の商品名:KBM-403)
3-メルカプトプロピルトリメトキシシラン(信越化学工業株式会社製の商品名:KBM-803)
メタクリロキシオクチルトリメトキシシラン(信越化学工業株式会社製の商品名:KBM-5803) (Coupling agent)
3-glycidoxypropyltrimethoxysilane (trade name: KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.)
3-Mercaptopropyltrimethoxysilane (trade name: KBM-803 manufactured by Shin-Etsu Chemical Co., Ltd.)
Methacryloxyoctyltrimethoxysilane (trade name: KBM-5803 manufactured by Shin-Etsu Chemical Co., Ltd.)
イミダゾール系硬化促進剤(四国化成工業株式会社製の商品名:2P4MHZ-PW)
(離型剤)
ラウリン酸亜鉛(日油株式会社製の商品名:パウダーベースL)
部分ケン化モンタン酸エステルワックス(クラリアントケミカルズ株式会社製の商品名:Licowax‐OP)
(添加剤)
カプロラクトン変性ジメチルシリコーン(Gelest株式会社製の商品名:DBL‐C32) (Curing accelerator)
Imidazole-based curing accelerator (trade name: 2P4MHZ-PW manufactured by Shikoku Chemicals Corporation)
(Release agent)
Zinc laurate (trade name: Powder Base L manufactured by NOF CORPORATION)
Partially saponified montanic acid ester wax (trade name: Licowax-OP manufactured by Clariant Chemicals Co., Ltd.)
(Additive)
Caprolactone-modified dimethyl silicone (trade name: DBL-C32 manufactured by Gelest Co., Ltd.)
アモルファス系鉄粉(エプソンアトミックス株式会社製の商品名:9A4‐II、平均粒径24μm)
アモルファス系鉄粉(エプソンアトミックス株式会社製の商品名:AW2‐08、平均粒径5.3μm) (Metal powder)
Amorphous iron powder (trade name: 9A4-II manufactured by Epson Atmix Co., Ltd., average particle size 24 μm)
Amorphous iron powder (trade name: AW2-08, average particle size 5.3 μm manufactured by Epson Atmix Co., Ltd.)
(実施例1~5)
表1に示すエポキシ樹脂、硬化剤、硬化促進剤、及び離型剤を、同表に示す配合量(単位:g)でポリ容器に投入した。これらの材料をポリ容器内で10分間混合することにより、樹脂混合物を調製した。樹脂混合物とは、樹脂組成物のうちカップリング剤及び添加剤を除く他の全成分に相当する。 [Preparation of compound]
(Examples 1 to 5)
The epoxy resin, curing agent, curing accelerator, and mold release agent shown in Table 1 were put into a plastic container in the blending amounts (unit: g) shown in the same table. A resin mixture was prepared by mixing these materials in a plastic container for 10 minutes. The resin mixture corresponds to all the other components of the resin composition except the coupling agent and the additive.
各成分の種類及び配合量を表2に示すように変更したこと以外は実施例と同様に操作して、比較例1~3のコンパウンドを調製した。 (Comparative Examples 1 to 3)
The compounds of Comparative Examples 1 to 3 were prepared by operating in the same manner as in Examples except that the types and blending amounts of each component were changed as shown in Table 2.
実施例及び比較例で得られたコンパウンドについて、以下の評価を行った。結果を表1及び2に示す。 [Compound evaluation]
The compounds obtained in Examples and Comparative Examples were evaluated as follows. The results are shown in Tables 1 and 2.
流動性の評価は、株式会社島津製作所製のフローテスタCFT-100を用いて行った。コンパウンド7gを成形して、タブレットを作製した。タブレットを用いて、130℃、余熱20秒、荷重100kgの条件にて、流動性の評価を実施した。コンパウンドの流動が停止するまでのプランジャーの押し込み距離(単位:mm)をフローテスターストロークとし、コンパウンドの流動が停止するまでの時間をフロータイムとして測定し、流動性の指標とした。 (Liquidity)
The liquidity was evaluated using a flow tester CFT-100 manufactured by Shimadzu Corporation. A tablet was prepared by molding 7 g of the compound. Using a tablet, the fluidity was evaluated under the conditions of 130 ° C., residual heat of 20 seconds, and load of 100 kg. The pushing distance (unit: mm) of the plunger until the flow of the compound stopped was used as the flow tester stroke, and the time until the flow of the compound stopped was measured as the flow time, which was used as an index of the liquidity.
コンパウンドのゲルタイムを、以下の方法で測定した。キュラストメータ(JSRトレーディング株式会社製)を用い、試料量1.5mL、140℃の条件でゲルタイムを測定した。得られたチャートのトルクの立ち上がり開始の時間をゲルタイムとした。ゲルタイムが短いほど硬化性が高いことを意味する。 (Gel time)
The gel time of the compound was measured by the following method. The gel time was measured using a curast meter (manufactured by JSR Trading Co., Ltd.) under the conditions of a sample volume of 1.5 mL and 140 ° C. The time at which the torque of the obtained chart started to rise was defined as the gel time. The shorter the gel time, the higher the curability.
コンパウンドを、成形金型温度140℃、成形圧力13.5MPa、硬化時間360秒の条件でトランスファー成形した後、180℃で2時間ポストキュアすることによって、試験片を得た。試験片の寸法は、縦幅80mm×横幅10mm×厚さ3.0mmであった。 (Bending test)
The compound was transfer-molded under the conditions of a molding die temperature of 140 ° C., a molding pressure of 13.5 MPa, and a curing time of 360 seconds, and then post-cured at 180 ° C. for 2 hours to obtain a test piece. The dimensions of the test piece were 80 mm in length × 10 mm in width × 3.0 mm in thickness.
2つの支点間の距離Lv:64.0±0.5mm
ヘッドスピード:2.0±0.2mm/分
チャートスピード:100mm/分
チャートフルスケール:490N(50kgf) Using an autograph with a constant temperature bath, a 3-point support type bending test was performed on the test piece at 250 ° C. As the autograph, AGS-500A manufactured by Shimadzu Corporation was used. In the bending test, one surface of the test piece was supported by two fulcrums. A load was applied to the central position between the two fulcrums on the other surface of the test piece. The load when the test piece was broken was measured. The measurement conditions for the bending test were as follows.
Distance between two fulcrums Lv: 64.0 ± 0.5 mm
Head speed: 2.0 ± 0.2 mm / min Chart speed: 100 mm / min Chart full scale: 490N (50 kgf)
σ=(3×P×Lv)/(2×W×t2) (A)
E=[Lv3/(4×W×t3)]×(F/Y) (B) The bending strength σ (unit: MPa) was calculated based on the following mathematical formula (A). The flexural modulus E (unit: GPa) was calculated based on the following mathematical formula (B). In the following formula, "P" is the load (unit: N) when the test piece is broken. "Lv" is the distance (unit: mm) between the two fulcrums. “W” is the width (unit: mm) of the test piece. “T” is the thickness (unit: mm) of the test piece. "F / Y" is the gradient (unit: N / mm) of the straight line portion of the load-deflection curve.
σ = (3 × P × Lv) / (2 × W × t 2 ) (A)
E = [Lv 3 / (4 × W × t 3 )] × (F / Y) (B)
250℃における曲げ強度(MGa)を250℃における曲げ弾性率(GPa)で除した値を信頼性の評価の指標とした。この値が大きいほど、強度と弾性率とのバランスに優れることを意味する。 (reliability)
The value obtained by dividing the bending strength (MGa) at 250 ° C. by the flexural modulus (GPa) at 250 ° C. was used as an index for evaluating reliability. The larger this value is, the better the balance between strength and elastic modulus is.
トランスファー成形により、銅製の金属部材をコンパウンドで封止して、コンパウンドを硬化することにより成形体を得た。成形体にリフロー処理を施した。リフロー処理における最高加熱温度は、260℃であった。加熱時間は、300秒であった。リフロー処理後、成形体を観察して、成形体におけるクラックの有無を調べた。表中の「A」は、クラックが成形体に形成されていなかったことを意味し、「B」は、クラックが成形体に形成されたことを意味する。 (Reflow processing)
By transfer molding, a copper metal member was sealed with a compound, and the compound was cured to obtain a molded product. The molded body was reflowed. The maximum heating temperature in the reflow treatment was 260 ° C. The heating time was 300 seconds. After the reflow treatment, the molded product was observed to check for cracks in the molded product. "A" in the table means that the crack was not formed in the molded body, and "B" means that the crack was formed in the molded body.
Claims (9)
- 金属粉と、エポキシ樹脂、硬化剤、及びカップリング剤を含有する樹脂組成物と、を備え、
前記カップリング剤が、エポキシ基、アミノ基、ウレイド基、及びイソシアネート基から選ばれる官能基を有する第1のシラン化合物と、炭素数が6以上の鎖状炭化水素基を有する第2のシラン化合物とを含み、
前記金属粉の含有量が、90質量%以上100質量%未満である、コンパウンド。 A resin composition containing a metal powder, an epoxy resin, a curing agent, and a coupling agent is provided.
The coupling agent is a first silane compound having a functional group selected from an epoxy group, an amino group, a ureido group, and an isocyanate group, and a second silane compound having a chain hydrocarbon group having 6 or more carbon atoms. Including and
A compound having a metal powder content of 90% by mass or more and less than 100% by mass. - 前記カップリング剤が、メルカプト基を有する第3のシラン化合物を更に含む、請求項1に記載のコンパウンド。 The compound according to claim 1, wherein the coupling agent further contains a third silane compound having a mercapto group.
- 前記第1のシラン化合物が、エポキシ基を有する、請求項1又は2に記載のコンパウンド。 The compound according to claim 1 or 2, wherein the first silane compound has an epoxy group.
- 前記第2のシラン化合物が、スチリル基、(メタ)アクリロイル基、又はビニル基を有する、請求項1~3のいずれか一項に記載のコンパウンド。 The compound according to any one of claims 1 to 3, wherein the second silane compound has a styryl group, a (meth) acryloyl group, or a vinyl group.
- 前記カップリング剤の含有量が、前記エポキシ樹脂の100質量部に対して1.0質量部以上20質量部以下である、請求項1~4のいずれか一項に記載のコンパウンド。 The compound according to any one of claims 1 to 4, wherein the content of the coupling agent is 1.0 part by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the epoxy resin.
- 前記金属粉が、鉄、コバルト、及びニッケルからなる群より選ばれる少なくとも一種の金属元素を含む、請求項1~5のいずれか一項に記載のコンパウンド。 The compound according to any one of claims 1 to 5, wherein the metal powder contains at least one metal element selected from the group consisting of iron, cobalt, and nickel.
- 前記金属粉が、磁性粉である、請求項1~6のいずれか一項に記載のコンパウンド。 The compound according to any one of claims 1 to 6, wherein the metal powder is a magnetic powder.
- 請求項1~7のいずれか一項に記載のコンパウンドを含む、成形体。 A molded product containing the compound according to any one of claims 1 to 7.
- 請求項1~7のいずれか一項に記載のコンパウンドの硬化物。 The cured product of the compound according to any one of claims 1 to 7.
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JPWO2022050170A1 (en) | 2022-03-10 |
KR20230061411A (en) | 2023-05-08 |
CN116134084A (en) | 2023-05-16 |
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