CN112166154A - Composite and molded article - Google Patents
Composite and molded article Download PDFInfo
- Publication number
- CN112166154A CN112166154A CN201880093806.6A CN201880093806A CN112166154A CN 112166154 A CN112166154 A CN 112166154A CN 201880093806 A CN201880093806 A CN 201880093806A CN 112166154 A CN112166154 A CN 112166154A
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- China
- Prior art keywords
- compound
- group
- chemical formula
- composite
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title claims abstract description 116
- 239000003822 epoxy resin Substances 0.000 claims abstract description 106
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 106
- 229910052751 metal Inorganic materials 0.000 claims abstract description 93
- 239000002184 metal Substances 0.000 claims abstract description 91
- 239000011342 resin composition Substances 0.000 claims abstract description 80
- 239000000843 powder Substances 0.000 claims abstract description 73
- 150000001875 compounds Chemical class 0.000 claims abstract description 62
- -1 siloxane compound Chemical class 0.000 claims description 114
- 239000000126 substance Substances 0.000 claims description 72
- 125000004432 carbon atom Chemical group C* 0.000 claims description 30
- 125000003118 aryl group Chemical group 0.000 claims description 18
- 125000000962 organic group Chemical group 0.000 claims description 17
- 125000003700 epoxy group Chemical group 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 125000001033 ether group Chemical group 0.000 claims description 6
- 229920001281 polyalkylene Polymers 0.000 claims description 6
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 229910052799 carbon Chemical group 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 238000000465 moulding Methods 0.000 abstract description 28
- 238000001723 curing Methods 0.000 description 60
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 37
- 239000005011 phenolic resin Substances 0.000 description 31
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 29
- 229910045601 alloy Inorganic materials 0.000 description 28
- 239000000956 alloy Substances 0.000 description 28
- 239000003795 chemical substances by application Substances 0.000 description 28
- 239000000047 product Substances 0.000 description 28
- 239000002245 particle Substances 0.000 description 24
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 23
- 239000000243 solution Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 16
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 13
- 239000001993 wax Substances 0.000 description 13
- QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical compound CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 description 11
- 239000007822 coupling agent Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 238000004898 kneading Methods 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- 239000003063 flame retardant Substances 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 8
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229940126214 compound 3 Drugs 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000194 fatty acid Substances 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
- 229910000859 α-Fe Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 150000002736 metal compounds Chemical class 0.000 description 6
- 125000001624 naphthyl group Chemical group 0.000 description 6
- 238000001721 transfer moulding Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 125000005023 xylyl group Chemical group 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000006038 hexenyl group Chemical group 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 239000006247 magnetic powder Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 235000013872 montan acid ester Nutrition 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
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- 150000002910 rare earth metals Chemical class 0.000 description 2
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- 239000010935 stainless steel Substances 0.000 description 2
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- 235000007586 terpenes Nutrition 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- MXJJJAKXVVAHKI-WRBBJXAJSA-N (9z,29z)-octatriaconta-9,29-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O MXJJJAKXVVAHKI-WRBBJXAJSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
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- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical class C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NODRXLWVBKZXOO-UHFFFAOYSA-N 2-(hydroxymethyl)docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCC(CO)C(N)=O NODRXLWVBKZXOO-UHFFFAOYSA-N 0.000 description 1
- KHTJRKQAETUUQH-UHFFFAOYSA-N 2-(hydroxymethyl)octadecanamide Chemical compound CCCCCCCCCCCCCCCCC(CO)C(N)=O KHTJRKQAETUUQH-UHFFFAOYSA-N 0.000 description 1
- XOSCKTQMAZSFBZ-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]methyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2CC=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 XOSCKTQMAZSFBZ-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical group CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910001199 N alloy Inorganic materials 0.000 description 1
- 150000007945 N-acyl ureas Chemical class 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 229910000828 alnico Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
- RKVQXYMNVZNJHZ-UHFFFAOYSA-N hexacosanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCC(N)=O RKVQXYMNVZNJHZ-UHFFFAOYSA-N 0.000 description 1
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- TXSUIVPRHHQNTM-UHFFFAOYSA-N n'-(3-methylanilino)-n-phenyliminobenzenecarboximidamide Chemical compound CC1=CC=CC(NN=C(N=NC=2C=CC=CC=2)C=2C=CC=CC=2)=C1 TXSUIVPRHHQNTM-UHFFFAOYSA-N 0.000 description 1
- PECBPCUKEFYARY-ZPHPHTNESA-N n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC PECBPCUKEFYARY-ZPHPHTNESA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- MFPOQHJDIPCXSL-UHFFFAOYSA-N n-octadecanoyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NC(=O)CCCCCCCCCCCCCCCCC MFPOQHJDIPCXSL-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- WGOROJDSDNILMB-UHFFFAOYSA-N octatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WGOROJDSDNILMB-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a compound with small molding shrinkage. The composite comprises a metal element-containing powder and a resin composition, wherein the resin composition contains an epoxy resin and a compound having a siloxane bond.
Description
Technical Field
The present invention relates to a composite and a molded article.
Background
A composite including a metal powder and a resin composition is used as a material for various industrial products such as inductors, electromagnetic wave shielding materials, and bonded magnets, depending on the physical properties of the metal powder (see patent document 1 below).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2014-13803
Disclosure of Invention
Problems to be solved by the invention
When an industrial product is produced from a composite, the composite is supplied to another member (for example, a cured product of another composite), and the composite is cured to produce a molded body. As the molding shrinkage of the composite is larger, the molded article is more likely to warp, and it is more difficult to process the molded article into a desired shape. Therefore, the composite is required to have a small molding shrinkage.
The invention aims to provide a compound with small molding shrinkage and a molded body with the compound.
Means for solving the problems
A composite according to one aspect of the present invention includes a metal element-containing powder and a resin composition containing an epoxy resin and a compound (chemical compound) having a siloxane bond.
In the composite according to one aspect of the present invention, the content of the compound having a siloxane bond is 25 parts by mass or more and 45 parts by mass or less with respect to 100 parts by mass of the epoxy resin.
The above-mentioned composite according to one aspect of the present invention may include a1 st siloxane compound as the compound having a siloxane bond, and the 1 st siloxane compound may have a structural unit represented by the following chemical formula (1).
[ solution 1]
[ in the above chemical formula (1), R1And R2Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.]
In the above composite according to one aspect of the present invention, the 1 st siloxane compound may have a structural unit represented by the following chemical formula (2).
[ solution 2]
[ in the above chemical formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.]
The above-mentioned composite according to one aspect of the present invention may include a compound represented by the following chemical formula (3) as the 1 st siloxane compound.
[ solution 3]
[ in the chemical formula (3), n is an integer of 1 to 200, m1And m2Each independently is an integer of 1 to 200, R4、R5、R6And R7Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group or a polyalkylene ether group having 3 to 500 carbon atoms, R8And R9Each independently an alkylene group having 1 to 10 carbon atoms, R10And R11Each independently is a C1-10 2-valent hydrocarbon group.]
The compound according to one aspect of the present invention may include a 2 nd siloxane compound as the compound having a siloxane bond, and the 2 nd siloxane compound may have a structural unit represented by the following chemical formula (4) and a structural unit represented by the following chemical formula (5).
[ solution 4]
[ in the above chemical formula (4), R12Is a C1-12 alkyl radical.]
[ solution 5]
[ in the above chemical formula (5), R13And R14Each independently is a C1-12 hydrocarbon group.]
In the above composite according to one aspect of the present invention, the 2 nd siloxane compound may have a structural unit represented by the following chemical formula (6).
[ solution 6]
[ in the above chemical formula (6), R15Is a C1-12 hydrocarbon radical, R16Is a 1-valent organic group having an epoxy group.]
The complex according to one aspect of the present invention may include, as the 2 nd siloxane compound, a compound having at least one structural unit selected from the group consisting of a structural unit represented by the following chemical formula (7), a structural unit represented by the following chemical formula (8), a structural unit represented by the following chemical formula (9), and a structural unit represented by the following chemical formula (10).
[ solution 7]
[ solution 8]
[ solution 9]
[ solution 10]
The composite according to one aspect of the present invention may include at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin.
In the composite according to one aspect of the present invention, the content of the metal element-containing powder may be 90% by mass or more and less than 100% by mass.
A molded body according to an aspect of the present invention includes the composite.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a composite having a small molding shrinkage and a molded article comprising the composite are provided.
Detailed Description
Preferred embodiments of the present invention will be described below. However, the present invention is not limited to the following embodiments.
< overview of the Complex >
The composite according to the present embodiment includes a metal element-containing powder and a resin composition.
The metal element-containing powder is composed of a plurality (a large number) of metal element-containing particles. The metal element-containing powder (metal element-containing particles) may contain at least one selected from the group consisting of simple metals, alloys, and metal compounds, for example. The resin composition contains at least an epoxy resin and a compound having a siloxane bond. The compound having a siloxane bond is sometimes referred to as "siloxane compound". The resin composition may contain other components in addition to the epoxy resin and the siloxane compound. For example, the resin composition may contain a curing agent. The resin composition may also contain a curing accelerator. The resin composition may contain an additive. The resin composition may contain an epoxy resin, a silicone compound, a curing agent, a curing accelerator, and additives, or may contain other components (nonvolatile components) in addition to the organic solvent and the metal element-containing powder. The additive means the components other than the resin, the silicone compound, the curing agent and the curing accelerator in the resin composition. The additive is, for example, a coupling agent or a flame retardant. The resin composition may contain wax as an additive. The compound may be a powder (compound powder).
The composite according to the present embodiment contains a silicone compound, which is one of elastomers, and therefore can reduce the elasticity of the entire composite and reduce stress applied to the composite as the composite is shrunk by molding (heat curing). As a result, the molding shrinkage of the composite according to the present embodiment can be reduced. However, the operational effects according to the present invention are not limited to the above.
The composite may include a metal element-containing powder and a resin composition attached to the surface of each metal element-containing particle constituting the metal element-containing powder. The resin composition may cover the entire surface of the particles, or may cover only a part of the surface of the particles. The composite may be provided with an uncured resin composition and a metal element-containing powder. The composite may also comprise a semi-cured product of the resin composition (e.g., a b-staged resin composition) and a metal element-containing powder. The composite may further include both an uncured resin composition and a semi-cured product of the resin composition. The composite may be composed of a powder containing a metal element and a resin composition.
The content of the metal element-containing powder in the composite may be 90 mass% or more and less than 100 mass%, 90 mass% or more and 99.8 mass% or less, 92 mass% or more and 99.8 mass% or less, or 94 mass% or more and 99.8 mass% or less with respect to the mass of the entire composite. The composite may contain other filler materials (e.g., a filler of silica) in addition to the elemental metal-containing powder.
The content of the resin composition in the composite may be 0.2 mass% or more and 10 mass% or less, or 4 mass% or more and 6 mass% or less, with respect to the mass of the entire composite (for example, the total of the mass of the metal element-containing powder and the mass of the resin composition).
The content of the siloxane compound in the composite may be 25 parts by mass or more and 45 parts by mass or less, or 25 parts by mass or more and 35 parts by mass or less with respect to 100 parts by mass of the epoxy resin. When the content of the silicone compound is within the above range, the molding shrinkage of the composite tends to be small.
The average particle diameter of the metal element-containing powder is not particularly limited, and may be, for example, 1 μm or more and 300 μm or less. The average particle diameter can be measured, for example, by a particle size distribution meter. The shape of each metal element-containing particle constituting the metal element-containing powder is not limited, and may be, for example, a spherical shape, a flat shape, a prismatic shape, or a needle shape. The composite may include a plurality of kinds of metal element-containing powders having different average particle diameters.
The composition or combination of the metal element-containing powder contained in the composite enables the electromagnetic properties and other characteristics of the compact formed from the composite to be freely controlled, and the compact can be used for various industrial products or raw materials thereof. Industrial products produced using the composite may be, for example, automobiles, medical devices, electronic devices, electrical devices, information communication devices, household electric appliances, audio devices, and general industrial devices. For example, when the composite contains a permanent magnet such as an Sm-Fe-N alloy or an Nd-Fe-B alloy as a powder containing a metal element, the composite can be used as a raw material for a bonded magnet. When the composite contains a soft magnetic powder such as an Fe — Si — Cr alloy or ferrite as the powder containing the metal element, the composite can be used as a material (e.g., a magnetic core) for an inductor (e.g., an EMI filter) or a transformer. In the case where the composite contains iron and copper as the powder containing the metal element, a formed body (e.g., a sheet) formed of the composite can be utilized as the electromagnetic wave shielding material.
< composition of the composite >
(resin composition)
The resin composition has a function as a binder (binder) for the metal element-containing particles constituting the metal element-containing powder, and imparts mechanical strength to a molded article formed of the composite. For example, when the composite is molded under high pressure using a mold, the resin composition is filled between the particles containing the metal element, and the particles containing the metal element are bonded to each other. By curing the resin composition in the molded article, the cured product of the resin composition more firmly bonds the metal element-containing particles to each other, and the mechanical strength of the molded article is improved.
The resin composition contains at least an epoxy resin as a thermosetting resin. When the composite contains an epoxy resin having relatively excellent fluidity among thermosetting resins, the fluidity, storage stability and moldability of the composite are improved. However, the compound may contain other resins in addition to the epoxy resin as long as the effect of the present invention is not hindered. For example, the resin composition may contain at least one of a phenol resin and a polyamideimide resin as a thermosetting resin. When the resin composition contains both an epoxy resin and a phenol resin, the phenol resin can function as a curing agent for the epoxy resin. The resin composition may include a thermoplastic resin. The thermoplastic resin may be at least one selected from the group consisting of acrylic resins, polyethylene, polypropylene, polystyrene, polyvinyl chloride, and polyethylene terephthalate, for example. The resin composition may contain both a thermosetting resin and a thermoplastic resin. The resin composition may comprise a silicone resin.
The epoxy resin may be, for example, a resin having 2 or more epoxy groups in 1 molecule. The epoxy resin may be, for example, a compound selected from the group consisting of biphenyl type epoxy resin, stilbene type epoxy resin, diphenylmethane type epoxy resin, sulfur atom containing type epoxy resin, phenol novolak type epoxy resin, dicyclopentadiene type epoxy resin, salicylaldehyde type epoxy resin, copolymer type epoxy resin of naphthol and phenol, epoxide of aralkyl type phenol resin, bisphenol type epoxy resin, epoxy resin having a bisphenol skeleton, glycidyl ether type epoxy resin of alcohol, glycidyl ether type epoxy resin of p-xylene and/or m-xylene modified phenol resin, glycidyl ether type epoxy resin of terpene modified phenol resin, cyclopentadiene type epoxy resin, glycidyl ether type epoxy resin of polycyclic aromatic ring modified phenol resin, glycidyl ether type epoxy resin of naphthalene ring containing phenol resin, glycidyl ester type epoxy resin, epoxy resin of aromatic ring containing phenol resin, epoxy resin of aromatic ring containing benzene ring, epoxy resin of aromatic ring containing benzene ring, Glycidyl-type or methylglycidyl-type epoxy resin, alicyclic-type epoxy resin, halogenated phenol novolac-type epoxy resin, o-cresol novolac-type epoxy resin, p-phenylene bisphenol-type epoxy resin, trimethylolpropane-type epoxy resin, and linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid.
From the viewpoint of excellent fluidity, the epoxy resin may be at least one selected from the group consisting of a biphenyl-type epoxy resin, an o-cresol novolac-type epoxy resin, a phenol novolac-type epoxy resin, a bisphenol-type epoxy resin, an epoxy resin having a bisphenol skeleton, a salicylaldehyde novolac-type epoxy resin, and a naphthol novolac-type epoxy resin.
The epoxy resin may be a crystalline epoxy resin. Although the crystalline epoxy resin has a low molecular weight, the crystalline epoxy resin has a high melting point and is excellent in fluidity. The crystalline epoxy resin (epoxy resin having high crystallinity) may be at least one selected from, for example, a hydroquinone-type epoxy resin, a bisphenol-type epoxy resin, a thioether-type epoxy resin, and a biphenyl-type epoxy resin. Commercially available products of the crystalline epoxy resin may be, for example, those selected from the group consisting of Epiclon 860, Epiclon 1050, Epiclon 1055, Epiclon 2050, Epiclon 3050, Epiclon 4050, Epiclon 7050, Epiclon HM-091, Epiclon HM-101, Epiclon N-730A, Epiclon N-740, Epiclon N-770, Epiclon N-775, Epiclon N-865, Epiclon HP-4032D, Epiclon HP-7200L, Epiclon HP-7200H, Epiclon HP-7200HH, Epiclon HP-4700, Epiclon HP-4710, Epiclon HP-4770, Epiclon HP-5000, Epiclon HP-6000 HP-500 NC-3000, and NC-3000, CEIClon NC-3000, CEC-3000, CEIClon NC-3000, CEC-3000, CElon N-3000, and CElon N-3000, NC-2000-L, XD-1000, NC-7000-L, NC-7300-L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, BREN-10S (trade name manufactured by Nippon chemical Co., Ltd.), YX-4000H, YL4121H and YX-8800 (trade name manufactured by Mitsubishi chemical Co., Ltd.).
The resin composition may contain at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin, from the viewpoint of easily reducing the molding shrinkage of the composite. The resin composition may contain both a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin as the epoxy resin. A commercially available product of the biphenylene aralkyl type epoxy resin may be, for example, NC-3000 manufactured by Nippon Kabushiki Kaisha. A commercially available product of the isocyanate-modified epoxy resin may be, for example, AER-4001 manufactured by Asahi Kasei (Asahi Kasei Co., Ltd.).
The resin composition may contain one of the above epoxy resins. The resin composition may contain a plurality of epoxy resins as described above.
The curing agent is classified into a curing agent that cures an epoxy resin in a range from a low temperature to room temperature, and a heat-curing type curing agent that cures an epoxy resin with heat. Examples of the curing agent for curing the epoxy resin in a range from low temperature to room temperature include aliphatic polyamines, polyaminoamides, and polythiols. Examples of the heat-curable curing agent include aromatic polyamine, acid anhydride, phenol novolac resin, and Dicyandiamide (DICY).
When a curing agent that cures an epoxy resin in a range from low temperature to room temperature is used, the glass transition temperature of a cured product of the epoxy resin is low, and the cured product of the epoxy resin tends to be soft. As a result, the molded article formed of the composite is also easily softened. On the other hand, from the viewpoint of improving the heat resistance of the molded article, the curing agent may preferably be a heat-curable curing agent, may more preferably be a phenol resin, and may further preferably be a phenol novolac resin. In particular, by using a phenol novolac resin as a curing agent, a cured product of an epoxy resin having a high glass transition temperature can be easily obtained. As a result, the heat resistance and mechanical strength of the molded article are easily improved.
The phenol resin may be at least one selected from the group consisting of an aralkyl type phenol resin, a dicyclopentadiene type phenol resin, a salicylaldehyde type phenol resin, a phenol novolac resin, a copolymerized type phenol resin of a benzaldehyde type phenol and an aralkyl type phenol, a p-xylene and/or m-xylene modified phenol resin, a melamine modified phenol resin, a terpene modified phenol resin, a dicyclopentadiene type naphthol resin, a cyclopentadiene modified phenol resin, a polycyclic aromatic ring modified phenol resin, a biphenyl type phenol resin, and a triphenylmethane type phenol resin, for example. The phenol resin may be a copolymer composed of 2 or more of the above. As a commercial product of the phenol resin, for example, Tamanol 758 manufactured by Mikan chemical industries, or HP-850N manufactured by Hitachi chemical Co., Ltd.
The phenol novolac resin may be, for example, a resin obtained by condensing or co-condensing a phenol and/or a naphthol with an aldehyde under an acidic catalyst. The phenol constituting the phenol novolac resin may be at least one of phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, and aminophenol, for example. The naphthol constituting the phenol novolac resin may be at least one selected from the group consisting of α -naphthol, β -naphthol and dihydroxynaphthalene, for example. The aldehyde constituting the phenol novolac resin may be at least one selected from the group consisting of formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde, for example.
The curing agent may be, for example, a compound having 2 phenolic hydroxyl groups in 1 molecule. The compound having 2 phenolic hydroxyl groups in 1 molecule may be, for example, at least one selected from resorcinol, catechol, bisphenol a, bisphenol F and substituted or unsubstituted biphenol.
The resin composition may contain one of the above-mentioned phenol resins. The resin composition may further include a plurality of the above phenol resins. The resin composition may contain one of the above curing agents. The resin composition may contain a plurality of curing agents as described above.
The ratio of the active group (phenolic OH group) in the curing agent that reacts with the epoxy group in the epoxy resin may be preferably 0.5 to 1.5 equivalents, more preferably 0.6 to 1.4 equivalents, and still more preferably 0.8 to 1.2 equivalents, relative to 1 equivalent of the epoxy group in the epoxy resin. When the ratio of the active groups in the curing agent is less than 0.5 equivalent, it is difficult to obtain a sufficient elastic modulus of the resulting cured product. On the other hand, when the ratio of the active groups in the curing agent is more than 1.5 equivalents, the mechanical strength of the molded article formed of the composite after curing tends to be lowered. However, even when the ratio of the active group in the curing agent is outside the above range, the effects of the present invention can be obtained.
The curing accelerator is not limited as long as it is a composition that, for example, reacts with an epoxy resin to accelerate the curing of the epoxy resin. The curing accelerator may be, for example, an imidazole such as alkyl-substituted imidazole or benzimidazole. The resin composition may be provided with a curing accelerator. The resin composition may be provided with a plurality of curing accelerators. By adding a curing accelerator to the resin composition, the moldability and releasability of the composite can be easily improved. Further, by containing a curing accelerator in the resin composition, the mechanical strength of a molded article (for example, an electronic component) produced using the composite is improved, and the storage stability of the composite in a high-temperature and high-humidity environment is improved. As commercially available products of imidazole-based curing accelerators, at least one member selected from the group consisting of 2MZ-H, C11Z, C17Z, 1,2DMZ, 2E4MZ, 2PZ-PW, 2P4MZ, 1B2MZ, 1B2PZ, 2MZ-CN, C11Z-CN, 2E4MZ-CN, 2PZ-CN, C11Z-CNS, 2P4MHZ, TPZ and SFZ (the above is a trade name manufactured by Shikoku chemical Co., Ltd.) can be used.
The amount of the curing accelerator to be blended is not particularly limited as long as the curing accelerator can obtain a curing acceleration effect. However, from the viewpoint of improving curability and fluidity of the resin composition upon moisture absorption, the amount of the curing accelerator to be blended may be preferably 0.1 part by mass or more and 30 parts by mass or less, and more preferably 1 part by mass or more and 15 parts by mass or less, with respect to 100 parts by mass of the epoxy resin. The content of the curing accelerator is preferably 0.001 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total of the mass of the epoxy resin and the curing agent (for example, phenol resin). When the amount of the curing accelerator is less than 0.1 part by mass, it is difficult to obtain a sufficient curing acceleration effect. When the amount of the curing accelerator is more than 30 parts by mass, the storage stability of the composite is liable to be lowered. However, even when the amount and content of the curing accelerator are outside the above ranges, the effects of the present invention can be obtained.
The resin composition contains a compound having a siloxane bond (siloxane compound). A siloxane bond is a bond comprising 2 silicon atoms (Si) and 1 oxygen atom (O), and may be represented by-Si-O-Si-. The resin composition may contain one kind of silicone compound, or may contain a plurality of kinds of silicone compounds. From the viewpoint of easily reducing the molding shrinkage of the composite, the resin composition preferably contains at least one of the 1 st siloxane compound and the 2 nd siloxane compound described later as the siloxane compound. The resin composition may contain only the 1 st siloxane compound as the siloxane compound, or may contain only the 2 nd siloxane compound as the siloxane compound. The resin composition may contain both of the 1 st siloxane compound and the 2 nd siloxane compound. The resin composition may further contain a siloxane compound other than the 1 st siloxane compound and the 2 nd siloxane compound. The details of the 1 st and 2 nd siloxane compounds will be described below.
The 1 st siloxane compound may have a structural unit represented by the following chemical formula (1). The structural unit represented by the following chemical formula (1) may be referred to as "structural unit 1".
[ solution 11]
In the above chemical formula (1), R1And R2Independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group orA polyalkylene ether group having 3 to 500 carbon atoms.
The 1 st siloxane compound may have a plurality of structural units 1. Plural R's present in the 1 st siloxane compound1May be the same as or different from each other. Plural R's present in the 1 st siloxane compound2And may be the same or different from each other. R1And R2May be the same as or different from each other. The 1 st siloxane compound may have a repeating unit represented by the above chemical formula (1).
The 1 st siloxane compound preferably has a structural unit represented by the following chemical formula (2) from the viewpoint of easily reducing the molding shrinkage of the composite. The structural unit represented by the following chemical formula (2) may be referred to as "structural unit 2".
[ solution 12]
In the above chemical formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.
The 1 st siloxane compound may have a plurality of structural units 2. Plural R's present in the 1 st siloxane compound3May be the same as or different from each other. The 1 st siloxane compound may have a repeating unit represented by the above chemical formula (2).
The 1 st siloxane compound is preferably a compound represented by the following chemical formula (3) from the viewpoint of easily reducing the molding shrinkage of the composite. The compound represented by the following chemical formula (3) may be referred to as "compound 3".
[ solution 13]
In the chemical formula (3), n is an integer of 1 to 200. m is1And m2Each independently is an integer of 1 to 200. R4、R5、R6And R7Independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or a carbon atomAn alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms. R8And R9Each independently an alkylene group having 1 to 10 carbon atoms. R10And R11Each independently is a C1-10 2-valent hydrocarbon group.
Plural R's present in Compound 34May be the same as or different from each other. Plural R's present in Compound 35May be the same as or different from each other. R4、R5、R6And R7May be the same as or different from each other. Plural R's present in Compound 38May be the same as or different from each other. Plural R's present in Compound 39And may be the same or different from each other. R8And R9May be the same as or different from each other. The weight average molecular weight (Mw) of the compound 3 may be, for example, 4000 to 20000.
Commercially available products of Compound 3 include, for example, DBL-C31 and DBL-C32 manufactured by Gelest corporation.
From the viewpoint of easily reducing the molding shrinkage of the composite, the 2 nd siloxane compound preferably has a structural unit represented by the following chemical formula (4) and a structural unit represented by the following chemical formula (5). The structural unit represented by the following chemical formula (4) may be referred to as "structural unit 4". The structural unit represented by the following chemical formula (5) may be referred to as "structural unit 5".
[ solution 14]
In the above chemical formula (4), R12Is a C1-12 alkyl radical.
R12May be for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl radicals such as benzyl and phenethylAnd the like. R12Preferably methyl or phenyl.
The 2 nd siloxane compound may have a plurality of structural units 4. Plural R's present in the 2 nd siloxane compound12May be the same as or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (4).
[ solution 15]
In the above chemical formula (5), R13And R14Each independently is a C1-12 hydrocarbon group.
R13May be for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R13Preferably methyl or phenyl.
R14May be for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R14Preferably methyl or phenyl.
The 2 nd siloxane compound may have a plurality of structural units 5. Plural R's present in the 2 nd siloxane compound13May be the same as or different from each other. Plural R's present in the 2 nd siloxane compound14May be the same as or different from each other. R13And R14May be the same as or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (5).
From the viewpoint of storage stability of the 2 nd siloxane compound, the terminal of the molecule of the 2 nd siloxane compoundPreferably R12、R13、R14A hydroxyl group and an alkoxy group. Alkoxy groups may be, for example, methoxy, ethoxy, propoxy or butoxy.
The 2 nd siloxane compound preferably has a structural unit represented by the following chemical formula (6) from the viewpoint of easily reducing the molding shrinkage of the composite. The structural unit represented by the following chemical formula (6) may be referred to as "structural unit 6".
[ solution 16]
In the above chemical formula (6), R15Is a C1-12 alkyl radical. R16Is a 1-valent organic group having an epoxy group.
R15May be for example: alkyl groups such as methyl, ethyl, propyl, butyl, isopropyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, and 2-ethylhexyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and the like; aryl groups such as phenyl, tolyl, xylyl, naphthyl, and biphenyl; aralkyl groups such as benzyl and phenethyl. R13Preferably methyl or phenyl.
R16Examples thereof include 2, 3-epoxypropyl group, 3, 4-epoxybutyl group, 4, 5-epoxypentyl group, 2-epoxypropoxyethyl group, 3-epoxypropoxypropyl group, 4-epoxypropoxybutyl group, 2- (3, 4-epoxycyclohexyl) ethyl group, and 3- (3, 4-epoxycyclohexyl) propyl group. R16Preferably 3-glycidoxypropyl.
The 2 nd siloxane compound may have a plurality of structural units 6. Plural R's present in the 2 nd siloxane compound15May be the same as or different from each other. Plural R's present in the 2 nd siloxane compound16And may be the same or different from each other. The 2 nd siloxane compound may have a repeating unit represented by the above chemical formula (6).
From the viewpoint of easily reducing the molding shrinkage of the composite, the 2 nd siloxane compound is preferably a compound having at least one structural unit selected from the structural unit represented by the following chemical formula (7), the structural unit represented by the following chemical formula (8), the structural unit represented by the following chemical formula (9), and the structural unit represented by the following chemical formula (10). The structural unit represented by the following chemical formula (7) may be referred to as "structural unit 7". The structural unit represented by the following chemical formula (8) may be referred to as "structural unit 8". The structural unit represented by the following chemical formula (9) may be referred to as "structural unit 9". The structural unit represented by the following chemical formula (10) may be referred to as "structural unit 10". The compound having at least one structural unit selected from the structural units 7, 8, 9 and 10 may be referred to as "compound 11". Compound 11 may have all of structural units 7, 8, 9, and 10.
[ solution 17]
[ solution 18]
[ solution 19]
[ solution 20]
Compound 11 may have a plurality of structural units 7. Compound 11 may have a repeating unit represented by the above chemical formula (7). Compound 11 may have a plurality of structural units 8. Compound 11 may have a repeating unit represented by the above chemical formula (8). Compound 11 may have a plurality of structural units 9. Compound 11 may have a repeating unit represented by the above chemical formula (9). Compound 11 may have a plurality of structural units 10. Compound 11 may have a repeating unit represented by the above chemical formula (10).
A commercially available product of Compound 11 can be, for example, AY42-119 available from Tollio Dow Corning Co.
The 2 nd siloxane compound may have an epoxy equivalent of 500 or more and 4000 or less, or 1000 or more and 2500 or less. When the epoxy equivalent is within the above range, the fluidity of the composite is easily improved and the moldability is easily improved.
The softening point of the 2 nd siloxane compound is preferably 40 ℃ or higher and 120 ℃ or lower, and more preferably 50 ℃ or higher and 100 ℃ or lower. When the softening point is within the above range, the mechanical strength of the molded article formed of the composite is easily improved. The softening point of the 2 nd siloxane compound can be adjusted by the molecular weight, structure (for example, content ratio of each constituent unit), kind of organic group bonded to the silicon atom, and the like of the 2 nd siloxane compound. From the viewpoint of improving the fluidity of the composite, it is preferable to adjust the softening point by the content of the aryl group in the 2 nd siloxane compound. The aryl group may be, for example, phenyl, tolyl, xylyl, naphthyl, biphenyl, or the like. Aryl is preferably phenyl. More preferably, the softening point is adjusted by the content of phenyl groups in the monovalent organic groups bonded to silicon atoms in the 2 nd siloxane compound. The content of the phenyl group is preferably adjusted to 60 mol% or more and 100 mol% or less, and more preferably adjusted to 70 mol% or more and 85 mol% or less.
The weight average molecular weight (Mw) of the 2 nd siloxane compound may be 1000 or more and 30000 or less, preferably 2000 or more and 20000 or less, more preferably 3000 or more and 10000 or less. The weight average molecular weight (Mw) can be measured by Gel Permeation Chromatography (GPC), and can be a value converted using a standard polystyrene calibration curve. The 2 nd siloxane compound is preferably a random copolymer.
The resin composition may contain one or more of the above-described silicone compounds.
The coupling agent improves the adhesion between the resin composition and the metal element-containing particles constituting the metal element-containing powder, and improves the flexibility and mechanical strength of the molded article formed of the composite. The coupling agent may be at least one selected from silane-based compounds (silane coupling agents), titanium-based compounds, aluminum compounds (aluminum chelates), and aluminum/zirconium-based compounds, for example. The silane coupling agent may be at least one selected from epoxy silane, mercapto silane, amino silane, alkyl silane, ureide silane, acid anhydride silane, and vinyl silane, for example. Particularly preferred is an aminophenyl-based silane coupling agent. The resin composition may contain one or more of the above coupling agents.
The compound may include a flame retardant for environmental safety, recyclability, molding processability, and low cost of the compound. The flame retardant may be at least one selected from the group consisting of a bromine-based flame retardant, a bulb (Japanese: bulb) flame retardant, a hydrated metal compound-based flame retardant, a silicone-based flame retardant, a nitrogen-containing compound, a hindered amine compound, an organic metal compound, and an aromatic engineering plastic, for example. The resin composition may contain one or more of the above flame retardants.
In the case of forming a molded body from the composite using a mold, the resin composition may contain wax. The wax functions as a release agent while improving the fluidity of the composite in the molding (e.g., transfer molding) of the composite. The wax may be at least one of a fatty acid such as a higher fatty acid and a fatty acid ester.
The wax may be, for example, at least one of the following: fatty acids such as montanic acid, stearic acid, 12-hydroxystearic acid (Japanese: 12- オキシステアリン acid), lauric acid, and esters thereof; fatty acid salts such as zinc stearate, calcium stearate, barium stearate, aluminum stearate, magnesium stearate, calcium laurate, zinc laurate, calcium ricinoleate, and zinc 2-ethylhexanoate (Japanese: ヘキソイン acid); fatty acid amides such as stearic acid amide, oleic acid amide, erucic acid amide, behenic acid amide, palmitic acid amide, lauric acid amide, hydroxystearic acid amide, methylenebisstearic acid amide, ethylenebisstearic acid amide, ethylenebislauric acid amide, distearoyl adipic acid amide, ethylenebisoleic acid amide, dioleyl adipic acid amide, N-stearoyl stearic acid amide, N-oleyl stearic acid amide, N-stearoyl erucic acid amide, hydroxymethyl stearic acid amide, and hydroxymethyl behenic acid amide; fatty acid esters such as butyl stearate; alcohols such as ethylene glycol and stearyl alcohol; polyethers containing polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and modified products thereof; polysiloxanes such as silicone oil and silicone lubricant oil; fluorine compounds such as fluorine-based oils, fluorine-based lubricating oils, and fluorine-containing resin powders; and waxes such as paraffin wax, polyethylene wax, amide wax, polypropylene wax, ester wax, carnauba wax, and microwax.
(Metal element-containing powder)
The metal element-containing powder (metal element-containing particles) may contain at least one selected from the group consisting of simple metals, alloys, and metal compounds, for example. The metal element-containing powder may contain, for example, at least one selected from the group consisting of simple metals, alloys, and metal compounds. The alloy may include at least one selected from a solid solution, a eutectic, and an intermetallic compound. The alloy may be, for example, stainless steel (Fe-Cr alloy, Fe-Ni-Cr alloy, etc.). The metal compound may be an oxide such as ferrite. The metal element-containing powder may contain one metal element or a plurality of metal elements. The metal element contained in the metal element-containing powder may be, for example, a base metal element, a noble metal element, a transition metal element, or a rare earth element. The composite may contain one kind of metal-containing powder, or may contain a plurality of kinds of metal-containing powders having different compositions.
The powder containing a metal element is not limited to the above-described composition. The metal element contained in the metal element-containing powder may be at least one selected from the group consisting of iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), aluminum (Al), tin (Sn), chromium (Cr), barium (Ba), strontium (Sr), lead (Pb), silver (Ag), praseodymium (Pr), neodymium (Nd), samarium (Sm), and dysprosium (Dy), for example. The metal element-containing powder may further contain an element other than the metal element. The metal element-containing powder may contain, for example, oxygen (o), beryllium (Be), phosphorus (P), boron (B), or silicon (Si). The powder containing a metal element may be magnetic powder. The powder containing the metallic element may be a soft magnetic alloy or a ferromagnetic alloy. The metal element-containing powder may be, for example, a magnetic powder containing at least one selected from the group consisting of an Fe — Si-based alloy, an Fe — Si — Al-based alloy (sendust), an Fe — Ni-based alloy (permalloy), an Fe — Cu — Ni-based alloy (permalloy), an Fe — Co-based alloy (permendur), an Fe — Cr — Si-based alloy (electromagnetic stainless steel), an Nd — Fe — B-based alloy (rare earth magnet), an Sm — Fe — N-based alloy (rare earth magnet), an Al — Ni — Co-based alloy (alnico magnet), and a ferrite. The ferrite may be, for example, spinel ferrite, hexagonal ferrite or garnet ferrite. The metal element-containing powder may Be a copper alloy such as a Cu-Sn alloy, a Cu-Sn-P alloy, a Cu-Ni alloy, or a Cu-Be alloy. The powder containing a metal element may contain one of the elements and the compositions described above, or may contain a plurality of the elements and the compositions described above.
The powder containing the metal element can also be Fe simple substance. The powder containing a metal element may be an alloy containing iron (Fe-based alloy). The Fe-based alloy may be, for example, an Fe-Si-Cr-based alloy or an Nd-Fe-B-based alloy. The powder containing a metal element may be at least one of an amorphous iron powder and a carbonyl iron powder. When the metal element-containing powder contains at least either of a simple substance of Fe and an Fe-based alloy, a compact having a high space factor and excellent magnetic properties can be easily produced from the composite. The powder containing the metal element may also be an Fe amorphous alloy. As a commercial product of the Fe amorphous alloy powder, at least one selected from AW2-08, KUAME-6B 2 (trade name manufactured by EPSON ATMIX Co., Ltd.), DAP MS3, DAP MS7, DAP MSA10, DAP PB, DAP PC, DAP MKV49, DAP 410L, DAP 430L, DAP HYB series (trade name manufactured by Daomorph Special Steel Co., Ltd.), MH45D, MH28D, MH25D and MH20D (trade name manufactured by Kobe Steel Co., Ltd.) can be used, for example.
< method for producing composite >
In the production of the composite, the metal element-containing powder and the resin composition (each component constituting the resin composition) are mixed while heating. For example, the metal element-containing powder and the resin composition may be kneaded by a kneader, a roll, a stirrer, or the like while being heated. By heating and mixing the metal element-containing powder and the resin composition, the resin composition is attached to a part or the entire surface of the metal element-containing particles constituting the metal element-containing powder to coat the metal element-containing particles, and a part or the entire of the epoxy resin in the resin composition becomes a semi-cured product. As a result, a complex can be obtained. A composite can also be obtained by further adding wax to the powder obtained by heating and mixing the metal element-containing powder and the resin composition. The resin composition and the wax may be mixed in advance.
In the kneading, a powder containing a metal element, a curing agent such as a siloxane compound, an epoxy resin, or a phenol resin, a curing accelerator, and a coupling agent may be kneaded in a tank. The metal element-containing powder, the siloxane compound, and the coupling agent may be put into a tank and mixed, and then the epoxy resin, the curing agent, and the curing accelerator may be put into the tank and the raw materials in the tank may be kneaded. After the silicone compound, the epoxy resin, the curing agent, and the coupling agent are kneaded in the tank, the curing accelerator may be put in the tank, and the raw materials in the tank may be further kneaded. Alternatively, a mixed powder of an epoxy resin, a curing agent and a curing accelerator (resin mixed powder) may be prepared in advance, and then the metal element-containing powder, the siloxane compound and the coupling agent may be kneaded to prepare a metal mixed powder, and then the metal mixed powder may be kneaded with the resin mixed powder.
The kneading time depends on the type of kneading machine, the volume of the kneading machine, and the amount of the composite produced, and is, for example, preferably 1 minute or more, more preferably 2 minutes or more, and still more preferably 3 minutes or more. The kneading time is preferably 20 minutes or less, more preferably 15 minutes or less, and still more preferably 10 minutes or less. If the kneading time is less than 1 minute, kneading becomes insufficient, moldability of the composite is impaired, and the degree of curing of the composite varies. When the kneading time is longer than 20 minutes, for example, the curing of the resin composition (for example, epoxy resin and phenol resin) in the tank proceeds, and the fluidity and moldability of the composite are easily impaired. When the raw materials in the tank are kneaded by a kneader while being heated, the heating temperature may be, for example, a temperature at which the generation of a prepreg of the epoxy resin (a b-stage epoxy resin) is suppressed and the generation of a cured product of the epoxy resin (a c-stage epoxy resin) is suppressed. The heating temperature may be a temperature lower than the activation temperature of the curing accelerator. The heating temperature is, for example, preferably 50 ℃ or higher, more preferably 60 ℃ or higher, and still more preferably 70 ℃ or higher. The heating temperature is preferably 150 ℃ or lower, more preferably 120 ℃ or lower, and still more preferably 110 ℃ or lower. When the heating temperature is within the above range, the resin composition in the tank is softened and easily coats the surfaces of the metal element-containing particles constituting the metal element-containing powder, and a semi-cured product of the epoxy resin is easily produced, and complete curing of the epoxy resin during kneading is easily suppressed.
< shaped body >
The molded body according to the present embodiment may include the above-described composite. The molded article may contain at least one selected from the group consisting of an uncured resin composition, a semi-cured product of a resin composition (b-stage resin composition 2), and a cured product of a resin composition (c-stage resin composition 2). The molded article may be a cured product of the composite.
< method for producing molded article >
The method for producing a molded article according to the present embodiment may include a step of pressing the composite in a mold. The method for producing the molded article may include only the step of pressing the composite in the mold, or may include other steps in addition to the step. The method for producing a molded body may further include a first step, a second step, and a third step. The details of each step will be described below.
In the first step, a composite is produced by the above-described method.
In the second step, the composite is pressed in a mold to obtain a molded article (b-stage molded article). Here, the resin composition is filled between the respective metal element-containing particles constituting the metal element-containing powder. The resin composition functions as a binder (adhesive) to bond the metal element-containing particles to each other.
As the second step, transfer molding of the composite may be performed. The composite may be pressurized under a condition of 5MPa or more and 50MPa or less in the transfer molding. The higher the molding pressure, the more easily a molded article having excellent mechanical strength tends to be obtained. In consideration of mass productivity of the molded body and the life of the mold, the molding pressure is preferably 8MPa or more and 20MPa or less. The density of the molded article formed by transfer molding may be preferably 75% or more and 86% or less, and more preferably 80% or more and 86% or less, with respect to the true density of the composite. When the density of the molded article is 75% or more and 86% or less, a molded article having excellent mechanical strength can be easily obtained. The second step and the third step may be performed together in the transfer molding.
In the third step, the compact is solidified by heat treatment to obtain a third-order compact. The compound according to the present embodiment contains a silicone compound which is one kind of elastomer, and therefore, the elasticity of the entire compound can be reduced, and the stress acting on the compound can be reduced by shrinkage (heat curing) of the compound during molding. As a result, the molding shrinkage of the composite can be reduced in the process of forming a molded article by thermosetting the composite. The temperature of the heat treatment may be preferably 100 ℃ or more and 300 ℃ or less, more preferably 110 ℃ or more and 250 ℃ or less. In order to suppress oxidation of the metal element-containing powder in the compact, the heat treatment is preferably performed in an inert atmosphere. When the heat treatment temperature is more than 300 ℃, the powder containing the metal element is oxidized by a trace amount of oxygen inevitably contained in the heat treatment atmosphere, or the cured resin is deteriorated. In order to sufficiently cure the resin composition while suppressing oxidation of the metal element-containing powder and deterioration of the cured resin, the retention time of the heat treatment temperature is preferably several minutes or more and 10 hours or less, and more preferably 3 minutes or more and 8 hours or less.
Examples
The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.
(example 1)
[ preparation of the Complex ]
50g of a biphenylene aralkyl type epoxy resin, 50g of an isocyanate-modified epoxy resin, 70.4g of a biphenylene aralkyl type phenol resin (curing agent), 1.0g of 2-undecylimidazole (curing accelerator), 1.5g of 2-ethyl-4-methylimidazole (curing accelerator) and 8.0g of montanic acid ester (wax) were put into a plastic container (Japanese: ポリ container). These raw materials were mixed in a plastic container for 10 minutes, thereby preparing a resin mixture. The resin mixture corresponds to all the components other than the siloxane compound and the coupling agent in the resin composition.
As the biphenylene aralkyl type epoxy resin, NC-3000 manufactured by Nippon Kabushiki Kaisha was used.
As the isocyanate-modified epoxy resin, AER-4001 manufactured by Asahi Kasei Co., Ltd (Asahi Kasei Co., Ltd.) was used.
As the biphenylene aralkyl type phenol resin, MEHC-7851SS, available from Minghe Kasei K.K., was used.
As the 2-undecylimidazole, C11Z, manufactured by Kabushiki Kaisha, was used.
2E4MZ, manufactured by Kabushiki Kaisha, was used as 2-ethyl-4-methylimidazole.
LiCoWAX-E, manufactured by Clariant Chemicals, was used as the montanic acid ester.
The amorphous iron powder 1 and the amorphous iron powder 2 were uniformly mixed by a pressure double-shaft kneader (manufactured by Spindle corporation, japan, volume 5L) for 5 minutes to prepare 4667g of a metal element-containing powder. The content of the amorphous iron powder 1 in the metal element-containing powder was 75 mass%. The content of the amorphous iron powder 2 in the metal element-containing powder was 25 mass%. 4.0g of 3-glycidoxypropyltrimethoxysilane (coupling agent) and 35g of caprolactone-modified dimethylsilicone (compound having siloxane bond) were added to the metal element-containing powder in the biaxial kneader. Subsequently, the contents of the biaxial kneader were heated to 90 ℃ and mixed for 10 minutes while maintaining the temperature. Next, the resin mixture was added to the contents of the biaxial kneader, and the contents were melted and kneaded for 15 minutes while maintaining the temperature of the contents at 120 ℃. The kneaded product obtained by the above melting and kneading is cooled to room temperature, and then the kneaded product is pulverized by a hammer until the kneaded product has a predetermined particle size. The term "melt" as used herein means that at least a part of the resin composition in the contents of the biaxial kneader is melted. The metal element-containing powder in the composite is not melted during the preparation of the composite.
As the amorphous iron powder 1, 9A4-II (average particle size 24 μm) manufactured by EPSON ATMIX was used.
AW2-08 (average particle size 5.3 μm) manufactured by EPSON ATMIX was used as the amorphous iron powder 2.
As 3-glycidoxypropyltrimethoxysilane, KBM-403 manufactured by shin-Etsu chemical Co., Ltd.
As the caprolactone-modified dimethylsilicone, DBL-C32 manufactured by Gelest corporation was used. The caprolactone-modified dimethylsilicone is a compound represented by the above chemical formula (3).
The composite of example 1 was prepared using the above method. The content of the metal element-containing powder in the composite was 95.5 mass%.
[ evaluation of flowability ]
50g of the composite of example 1 was put into a transfer tester, and the spiral flow amount (unit: mm) of the composite was measured under conditions of a mold temperature (molding temperature) of 140 ℃, an injection pressure of 13.5MPa, and a molding time of 360 seconds. The spiral flow rate is a length over which the softened or liquefied composite flows in a spiral curve (archimedean spiral) groove formed in the mold. I.e. the spiral flow rate refers to the flow distance of the softened or liquefied compound. The easier the compound softened or liquefied by heating flows, the greater the amount of spiral flow. That is, the spiral flow amount of the compound having excellent fluidity is large. As the transfer tester, a transfer molding machine manufactured by T-Marushichi, Inc. was used. As the mold, a mold for spiral flow measurement based on ASTM D3123 was used. The spiral flow rate of example 1 is shown in table 1 below.
[ evaluation of Molding shrinkage ]
The compound of example 1 was filled in the cavity of a mold. The dimensions of the cavity of the mould are 127mm in length by 6.4mm in height (depth) by 12.7mm in width. The dimensions of the cavity of the mold were determined at room temperature (25 ℃). The composite is formed by transfer to form a shape. The molding conditions were 140 ℃ for 360 seconds and 13.5 MPa. The molded body was heated at 180 ℃ for 2 hours to be cured, thereby obtaining a test piece. The test piece immediately after heating was cooled to room temperature (25 ℃). By the above method, 2 test pieces were prepared. One of the 2 test pieces is referred to as test piece 1, and the other is referred to as test piece 2. The dimensions of each of the test pieces 1 and 2 were measured at room temperature (25 ℃ C.) using a vernier. The molding shrinkage (unit:%) was calculated based on the following numerical formula (A). In the following formula (A), D1The dimension (unit: mm) in the longitudinal direction of the cavity of the mold used for producing the test piece 1. d1Is the dimension (unit: mm) of the test piece 1 in the longitudinal direction. D2The dimension (unit: mm) in the longitudinal direction of the cavity of the mold used for producing the test piece 2. D2And D1Are equal. d2Is the dimension (unit: mm) of the test piece 2 in the longitudinal direction. The molding shrinkage of example 1 is shown in table 1 below.
[ number 1]
(examples 2 to 4)
In examples 2 to 4, the compositions shown in the following table 1 were used as raw materials of the composites. The mass (unit: g) of each composition used in examples 2 to 4 is a value shown in Table 1 below. In addition to the above, the compounds of examples 2 to 4 were prepared in the same manner as in example 1. The measurement and evaluation of the complex in each of examples 2 to 4 were carried out in the same manner as in example 1. The results of measurement and evaluation of each of examples 2 to 4 are shown in table 1 below.
Comparative example 1
In comparative example 1, the composition shown in table 1 below was used as a raw material of the composite. The mass (unit: g) of each composition used in comparative example 1 is a value shown in Table 1 below. Except for these matters, the composite of comparative example 1 was prepared in the same manner as in example 1. The measurement and evaluation of the composite of comparative example 1 were carried out in the same manner as in example 1. The results of measurement and evaluation of comparative example 1 are shown in table 1 below.
HP-850N shown in the following Table is a phenol novolac resin (curing agent) manufactured by Hitachi chemical Co.
KBM-503 shown in the following Table is 3-methacryloxypropyltriethoxysilane (coupling agent) manufactured by shin-Etsu chemical Co., Ltd.
AY42-119 shown in the following tables is a polysiloxane (compound having a siloxane bond) manufactured by Tollio Dow Corning Co., Ltd. AY42-119 is a compound having all of the aforementioned structural units 7, 8, 9 and 10.
[ Table 1]
Industrial applicability
The compound of the present invention has a small molding shrinkage, and therefore, the compound has a high industrial value.
Claims (11)
1. A composite comprising a metal element-containing powder and a resin composition,
the resin composition contains an epoxy resin and a compound having a siloxane bond.
2. The composite according to claim 1, wherein a content of the compound having a siloxane bond is 25 parts by mass or more and 45 parts by mass or less with respect to 100 parts by mass of the epoxy resin.
3. The composite according to claim 1 or 2, wherein a1 st siloxane compound is contained as the compound having a siloxane bond,
the 1 st siloxane compound has a structural unit represented by the following chemical formula (1),
in the chemical formula (1), R1And R2Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.
4. The composite according to claim 3, wherein the 1 st siloxane compound has a structural unit represented by the following chemical formula (2),
in the chemical formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.
5. The compound according to claim 3 or 4, wherein a compound represented by the following chemical formula (3) is contained as the 1 st siloxane compound,
in the chemical formula (3), n is an integer of 1-200, and m1And m2Each independently is an integer of 1 to 200, R4、R5、R6And R7Each independently an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, or a carbon atom3 to 500 of a polyalkylene ether group, R8And R9Each independently an alkylene group having 1 to 10 carbon atoms, R10And R11Each independently is a C1-10 2-valent hydrocarbon group.
6. The composite according to any one of claims 1 to 5, wherein a 2 nd siloxane compound is contained as the compound having a siloxane bond,
the 2 nd siloxane compound has a structural unit represented by the following chemical formula (4) and a structural unit represented by the following chemical formula (5),
in the chemical formula (4), R12Is a C1-valent hydrocarbon group having 1 to 12 carbon atoms,
in the chemical formula (5), R13And R14Each independently is a C1-12 hydrocarbon group.
7. The composite according to claim 6, wherein the 2 nd siloxane compound has a structural unit represented by the following chemical formula (6),
in the chemical formula (6), R15Is a C1-12 hydrocarbon radical, R16Is a 1-valent organic group having an epoxy group.
8. The compound according to claim 6 or 7, wherein a compound having at least one structural unit selected from the group consisting of a structural unit represented by the following chemical formula (7), a structural unit represented by the following chemical formula (8), a structural unit represented by the following chemical formula (9), and a structural unit represented by the following chemical formula (10) is contained as the 2 nd siloxane compound,
9. the composite according to any one of claims 1 to 8, wherein at least one of a biphenylene aralkyl type epoxy resin and an isocyanate modified epoxy resin is contained as the epoxy resin.
10. The composite according to any one of claims 1 to 9, wherein a content of the metal element-containing powder is 90% by mass or more and less than 100% by mass.
11. A molded article comprising the composite according to any one of claims 1 to 10.
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| PCT/JP2018/021053 WO2019229960A1 (en) | 2018-05-31 | 2018-05-31 | Composition and molded object |
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| WO2020246246A1 (en) * | 2019-06-04 | 2020-12-10 | 昭和電工マテリアルズ株式会社 | Compound, molded article, and cured product |
| JPWO2021112135A1 (en) * | 2019-12-03 | 2021-06-10 | ||
| CN116134084A (en) * | 2020-09-03 | 2023-05-16 | 株式会社力森诺科 | Composite, molded article, and cured product of composite |
| JP7168131B2 (en) | 2020-10-05 | 2022-11-09 | 住友ベークライト株式会社 | Resin molding material, molded article, and method for producing the molded article |
| JPWO2022075191A1 (en) * | 2020-10-05 | 2022-04-14 |
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| JP2017112218A (en) * | 2015-12-16 | 2017-06-22 | 株式会社村田製作所 | Electronic part |
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| JP3646486B2 (en) * | 1997-08-11 | 2005-05-11 | セイコーエプソン株式会社 | Rare earth bonded magnet |
| JP4329426B2 (en) * | 2003-06-24 | 2009-09-09 | 日立化成工業株式会社 | Epoxy resin molding material for sealing and electronic component device |
| JP6159512B2 (en) | 2012-07-04 | 2017-07-05 | 太陽誘電株式会社 | Inductor |
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2018
- 2018-05-31 WO PCT/JP2018/021053 patent/WO2019229960A1/en active Application Filing
- 2018-05-31 CN CN201880093806.6A patent/CN112166154B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008143016A1 (en) * | 2007-05-10 | 2008-11-27 | Hitachi Chemical Co., Ltd. | Epoxy resin composition for sealing, and electronic component device using the same |
| JP2010138384A (en) * | 2008-11-12 | 2010-06-24 | Hitachi Chem Co Ltd | Encapsulating liquid epoxy resin composition, electronic component device including element encapsulated with the encapsulating liquid epoxy resin composition, and wafer level chip size package |
| JP2010212442A (en) * | 2009-03-10 | 2010-09-24 | Nec Tokin Corp | Amorphous soft magnetic powder, toroidal core, and inductor |
| CN103517948A (en) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic component device |
| JP2012255130A (en) * | 2011-05-19 | 2012-12-27 | Hitachi Chemical Co Ltd | Epoxy resin composition and electronic component device |
| JP2017112218A (en) * | 2015-12-16 | 2017-06-22 | 株式会社村田製作所 | Electronic part |
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| KR102587422B1 (en) | 2023-10-10 |
| KR20230145239A (en) | 2023-10-17 |
| WO2019229960A1 (en) | 2019-12-05 |
| JP2022125219A (en) | 2022-08-26 |
| JP7103413B2 (en) | 2022-07-20 |
| CN112166154B (en) | 2024-02-20 |
| JPWO2019229960A1 (en) | 2021-06-24 |
| KR20210018194A (en) | 2021-02-17 |
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